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    ASSEMBLY OF A MICROFLUIDIC DEVICE FOR ANALYSIS OF BIOLOGICAL MATERIAL
    1.
    发明申请
    ASSEMBLY OF A MICROFLUIDIC DEVICE FOR ANALYSIS OF BIOLOGICAL MATERIAL 审中-公开
    用于分析生物材料的微流体装置的组装

    公开(公告)号：WO2007148358A1

    公开(公告)日：2007-12-27

    申请号：PCT/IT2006/000485

    申请日：2006-06-23

    Applicant: STMICROELECTRONICS S.R.L. ,  MAGNI, Pierangelo ,  BRIOSCHI, Roberto

    Inventor： MAGNI, Pierangelo ,  BRIOSCHI, Roberto

    IPC: B01L3/00

    CPC classification number: B01L3/502707 ,  B01L2200/027 ,  B01L2200/10 ,  B01L2300/043 ,  B01L2300/0609 ,  B01L2300/0867 ,  B01L2300/123 ,  B01L2300/1805 ,  B01L2400/0481 ,  B01L2400/0622 ,  B01L2400/0638 ,  B01L2400/0644 ,  Y10T436/25 ,  Y10T436/2575

    Abstract: In a microfluidic assembly (20), a microfluidic device (I1) is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (I1) . The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10')/ adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.

    Abstract translation: 在微流体组件（20）中，微流体装置（I1）设置有主体（4），其中至少第一入口（7）用于装载待分析的流体和与该流体相通的埋入区域（8） 定义第一入口（7）。 分析室（10'）与掩埋区域（8）流体连通，并且界面盖（23）以流体密封的方式联接在微流体装置（I1）上方。 接口盖（23）设置有与分析室（10'）对应的适于呈现静止状态的第一配置（其离开分析室10'）的密封部分（35），以及 作为应力的结果的第二构造，其以不流体密封的方式封闭相同的分析室。

    A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
    3.
    发明公开
    A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：EP3832701A1

    公开(公告)日：2021-06-09

    申请号：EP20210546.6

    申请日：2020-11-30

    Applicant: STMicroelectronics S.r.l.

    Inventor： ZIGLIOLI, Federico Giovanni ,  PINTUS, Alberto ,  MAGNI, Pierangelo

    IPC: H01L21/48 ,  H01L23/498 ,  H01L23/538

    Abstract: A method of manufacturing semiconductor devices (10) comprises:
    - providing a plastic material substrate (100) having at least one die mounting location (102) for a semiconductor die (104),
    - forming metallic traces (108a, 108b) on selected areas of the plastic material substrate (100), wherein the metallic traces (108a, 108b) provide electrically-conductive paths for coupling to the semiconductor die (104),
    - attaching the semiconductor die (104) onto the at least one die mounting location (102),
    - bonding the semiconductor die (104) attached onto the at least one die mounting location (102) to selected ones of the metallic traces (108a, 108b) formed on the plastic material substrate (100),
    - molding package material (110) onto the semiconductor die (104) attached onto the at least one die mounting location (102).

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
    5.
    发明公开
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：EP4181177A1

    公开(公告)日：2023-05-17

    申请号：EP22204387.9

    申请日：2022-10-28

    Applicant: STMicroelectronics S.r.l.

    Inventor： DERAI, Michele ,  MAGNI, Pierangelo

    IPC: H01L21/48 ,  H01L23/495 ,  H01L23/00

    Abstract: A semiconductor device (10) comprises a semiconductor die (14) arranged on a substrate such as a leadframe (12A, 12B) and an encapsulation of laser direct structuring, LDS material (16; 161, 162) molded onto the semiconductor die (14).
    A through mold via or TMV (182) extending through the encapsulation of LDS material (16; 161, 162) comprises:
    an enlarged collar section (182A) that extends through a first portion (161) of the encapsulation (16) from an outer surface (1613) to an intermediate plane (1612) of the encapsulation (16), the enlarged collar section (182A) having a cross-sectional area at the intermediate plane (1612) of the encapsulation (16), and
    a frusto-conical section (182B) that extends through a second portion (162) of the encapsulation (16; 161, 162) from a first end having a first diameter at the intermediate plane (1612) to a second end having a second diameter away from the intermediate plane (1612) of the encapsulation (16; 161, 162).
    The first end of the frusto-conical section (182B) has an area smaller than the cross-sectional area of the enlarged collar section (182A) at the intermediate plane (1612) and the second diameter of the frusto-conical section (182B) is smaller than the first diameter of the frusto-conical section (182B). The through mold via (182) can thus have an aspect ratio which is not limited to 1:1.

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