公开(公告)号：EP3832701A1

公开(公告)日：2021-06-09

申请号：EP20210546.6

申请日：2020-11-30

Applicant: STMicroelectronics S.r.l.

Inventor： ZIGLIOLI, Federico Giovanni ,  PINTUS, Alberto ,  MAGNI, Pierangelo

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/538

Abstract: A method of manufacturing semiconductor devices (10) comprises:
- providing a plastic material substrate (100) having at least one die mounting location (102) for a semiconductor die (104),
- forming metallic traces (108a, 108b) on selected areas of the plastic material substrate (100), wherein the metallic traces (108a, 108b) provide electrically-conductive paths for coupling to the semiconductor die (104),
- attaching the semiconductor die (104) onto the at least one die mounting location (102),
- bonding the semiconductor die (104) attached onto the at least one die mounting location (102) to selected ones of the metallic traces (108a, 108b) formed on the plastic material substrate (100),
- molding package material (110) onto the semiconductor die (104) attached onto the at least one die mounting location (102).

公开(公告)号：EP3780074A2

公开(公告)日：2021-02-17

申请号：EP20191180.7

申请日：2020-08-14

Applicant: STMicroelectronics S.r.l.

Inventor： ZIGLIOLI, Federico Giovanni ,  PINTUS, Alberto ,  DERAI, Michele ,  MAGNI, Pierangelo

IPC: H01L21/56 ,  H01L21/60 ,  H01Q1/22 ,  H01L23/552 ,  H01L23/36

Abstract: A method of manufacturing semiconductor devices, such as integrated circuits comprises:
- providing a support surface (10),
- arranging one or more semiconductor dice (12) on the support surface (10),
- molding laser direct structuring (LDS) material (14) onto the support surface (10) having the semiconductor die/dice (12) arranged thereon,
- laser beam processing (L) the laser direct structuring material (14) molded onto the support surface (10) having the semiconductor die/dice (12) arranged thereon to provide electrically conductive formations (16) for the semiconductor die/dice (12) arranged on the support surface, and
- separating from the support surface (10) the semiconductor die/dice (12) provided with said electrically-conductive formations (16).

公开(公告)号：EP3780074A3

公开(公告)日：2021-06-02

申请号：EP20191180.7

申请日：2020-08-14

Applicant: STMicroelectronics S.r.l.

Inventor： ZIGLIOLI, Federico Giovanni ,  PINTUS, Alberto ,  DERAI, Michele ,  MAGNI, Pierangelo

IPC: H01L21/56 ,  H01L21/60 ,  H01Q1/22 ,  H01L23/552 ,  H01L23/367 ,  H01L23/31

Abstract: A method of manufacturing semiconductor devices, such as integrated circuits comprises:
- providing a support surface (10),
- arranging one or more semiconductor dice (12) on the support surface (10),
- molding laser direct structuring (LDS) material (14) onto the support surface (10) having the semiconductor die/dice (12) arranged thereon,
- laser beam processing (L) the laser direct structuring material (14) molded onto the support surface (10) having the semiconductor die/dice (12) arranged thereon to provide electrically conductive formations (16) for the semiconductor die/dice (12) arranged on the support surface, and
- separating from the support surface (10) the semiconductor die/dice (12) provided with said electrically-conductive formations (16).