Mems-type high-sensitivity inertial sensor and manufacturing process thereof
    1.
    发明公开
    Mems-type high-sensitivity inertial sensor and manufacturing process thereof 有权
    手术器械和手术仪器Herstellungsverfahren

    公开(公告)号:EP1624284A1

    公开(公告)日:2006-02-08

    申请号:EP04425573.5

    申请日:2004-07-29

    CPC classification number: G01C19/5755 G01C19/5769

    Abstract: The semiconductor inertial sensor (30) is formed by a rotor element (38) and a stator element (39) electrostatically coupled together. The rotor element (38) is formed by a suspended mass (40) and by a plurality of mobile electrodes (41) extending from the suspended mass (40). The stator element (39) is formed by a plurality of fixed electrodes (42) facing respective mobile electrodes (41). The suspended mass (40) is supported by elastic suspension elements (45). The suspended mass (40) has a first, larger, thickness (t1 + t2), and the elastic suspension elements (45) have a second thickness (t1), smaller than the first thickness.

    Abstract translation: 半导体惯性传感器(30)由静电耦合在一起的转子元件(38)和定子元件(39)形成。 转子元件(38)由悬挂质量块(40)和从悬浮块(40)延伸的多个可移动电极(41)形成。 定子元件(39)由面对各自的可动电极(41)的多个固定电极(42)形成。 悬挂质量(40)由弹性悬挂元件(45)支撑。 悬挂质量(40)具有第一,较大的厚度(t1 + t2),并且弹性悬挂元件(45)具有小于第一厚度的第二厚度(t1)。

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