Abstract:
The wireless galvanic isolator device is formed by a transmitter circuit (31), a receiver circuit (32), and a wireless coupling structure, arranged between the transmitter circuit and the receiver circuit (32). The wireless coupling structure is formed by a pair of antennas (33a, 33b) each arranged on an own die (25, 26) and integrated together with the respective transmitter and receiver circuit (31, 32). The two dice can be arranged adjacent to each other in a planar configuration or arranged on top of each other and bonded together.
Abstract:
A monitoring device is for at least one physical characteristic of a building material. the monitoring device is buried inside a block of the building material and has a sensor to sense a physical characteristic thereof. The monitoring device includes a secondary inductor and a circuit coupled thereto, the circuit to generate an internal supply voltage for the sensor to transmit a signal representative of the physical characteristic. A wireless power supplier for the sensor is configured to generate a variable electromagnetic field, and has a dielectric layer and a resonant L-C circuit buried therein. The resonant L-C circuit has a primary inductor to be magnetically coupled to the secondary inductor of the sensor, with the wireless power supplier further having two current terminals being coupleable to an external reading circuit for the signal. The sensor is adjacent to the dielectric layer so as to magnetically couple the primary inductor and the secondary inductor.
Abstract:
A monitoring device is for at least one physical characteristic of a building material. the monitoring device is buried inside a block of the building material and has a sensor to sense a physical characteristic thereof. The monitoring device includes a secondary inductor and a circuit coupled thereto, the circuit to generate an internal supply voltage for the sensor to transmit a signal representative of the physical characteristic. A wireless power supplier for the sensor is configured to generate a variable electromagnetic field, and has a dielectric layer and a resonant L-C circuit buried therein. The resonant L-C circuit has a primary inductor to be magnetically coupled to the secondary inductor of the sensor, with the wireless power supplier further having two current terminals being coupleable to an external reading circuit for the signal. The sensor is adjacent to the dielectric layer so as to magnetically couple the primary inductor and the secondary inductor.
Abstract:
An electronic communications device, including: a body (32) of semiconductor material defining at least one integrated electronic circuit and having a top surface (32a); an electromagnetic shield (36); a radiant element (42); and a capacitive element (C) formed by a first electrode (50) and a second electrode (52), the radiant element (42) being arranged on top of the top surface (32a) and being ohmically connected to the first electrode (50) and the second electrode (52) by means of a first connection element (54) and a second connection element (56), respectively, the electromagnetic shield (36) being arranged between the radiant element (42) and the top surface (32a) and forming at least the second electrode.
Abstract:
A monitoring device is for at least one physical characteristic of a building material. the monitoring device is buried inside a block of the building material and has a sensor to sense a physical characteristic thereof. The monitoring device includes a secondary inductor and a circuit coupled thereto, the circuit to generate an internal supply voltage for the sensor to transmit a signal representative of the physical characteristic. A wireless power supplier for the sensor is configured to generate a variable electromagnetic field, and has a dielectric layer and a resonant L-C circuit buried therein. The resonant L-C circuit has a primary inductor to be magnetically coupled to the secondary inductor of the sensor, with the wireless power supplier further having two current terminals being coupleable to an external reading circuit for the signal. The sensor is adjacent to the dielectric layer so as to magnetically couple the primary inductor and the secondary inductor.