INTEGRATED CIRCUIT INCLUDING OVERVOLTAGE PROTECTION MECHANISM AND PROTECTING METHOD THEREFOR

    公开(公告)号:JPH0855965A

    公开(公告)日:1996-02-27

    申请号:JP14428395

    申请日:1995-06-12

    Abstract: PURPOSE: To provide an ESD protection system operable for a mixed voltage circuit. CONSTITUTION: An ESD protection system is provided for supplying an ESD conduction paths between different power lines while effectively utilizing several different types of over-voltage protection devices. For example, shunt diodes 28 and 30 can be used between the ground lines of the different power supplies and between I/O pads and power supply lines, an SCR protecting mechanism 32 can be used between I/O pads and ground, and thick type field device protecting mechanisms 80, 82, 84, 86 and 88 can be used between different power supply VDD lines.

    THICK FIELD DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREWITH

    公开(公告)号:JPH08181283A

    公开(公告)日:1996-07-12

    申请号:JP14428495

    申请日:1995-06-12

    Abstract: PURPOSE: To obtain an integrated circuit device incorporating a thick field device improved as a protective mechanism against electrostatic discharge(ESD). CONSTITUTION: A thick field device comprises two PN junctions (P region 25 and N+ regions 21, 23) isolated by field oxide 27 and functions as a lateral bipolar transistor having a floating base. A dopant is then implanted, at a controlled concentration, under the field oxide 27 in order to lower the trigger voltage. A well extends beneath metal contacts 31, 33 to minimize the effect of junction spiking. The metal contacts 31, 33 extending while covering the field oxide 27 provide a barrier to migration of ion, otherwise reduce the leak current.

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