公开(公告)号：US20230237631A1

公开(公告)日：2023-07-27

申请号：US18188868

申请日：2023-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehwan KIM ,  Seokjae LEE ,  Byungkwon KANG ,  Jinwoo NAM

IPC: G06T5/50 ,  G06T1/20

CPC classification number: G06T5/50 ,  G06T1/20 ,  G06T2207/20221

Abstract: An electronic apparatus may include: a video processor configured to output a video frame; a graphic processor configured to output a graphic frame; a mixer; and a processor which may be configured to: control the mixer to generate and output a first composite frame based on the video frame and the graphic frame, generate a second composite frame, which comprises a video area corresponding to the video frame and a graphic area corresponding to the graphic frame in a displayed image, and in which the video area and the graphic area have undergone image effect processing, based on an event of the image effect processing, and control the mixer to output the second composite frame.

公开(公告)号：US20220345598A1

公开(公告)日：2022-10-27

申请号：US17727296

申请日：2022-04-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeheung PARK ,  Kwangseok BYON ,  Hwajoong JUNG ,  Bongchan KIM ,  Taehwan KIM ,  Hyungjin RHO ,  Kihuk LEE

IPC: H04N5/225 ,  G02B27/64

Abstract: An electronic device including a camera module is provided. The camera module includes a lens assembly including a lens, a lens holder in which the lens assembly is fixedly disposed, a sensor carrier that includes an image sensor at least partially aligned with an optical axis of the lens and a circuit board electrically connected with the image sensor and that moves in a first axial direction perpendicular to the optical axis and a second axial direction perpendicular to the optical axis and the first axial direction, a fixed substrate adjacent to the sensor carrier and fixed in a specified position, and a connecting member that extends from the circuit board to the fixed substrate and that extends to surround at least three interconnected edges of the circuit board when viewed in a direction of the optical axis.

公开(公告)号：US20210185267A1

公开(公告)日：2021-06-17

申请号：US17119329

申请日：2020-12-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehwan KIM ,  Sungjin SON ,  Seungjin PARK ,  Kwangsub BYUN ,  Junghwan CHOI ,  Byungkwon KANG ,  Seokjae LEE

IPC: H04N5/445 ,  H04N21/431

Abstract: Provided are a display apparatus and an operation method thereof for preventing image flicker when displaying mixed images: generating a first image corresponding to video content on a first plane, generating, on a second plane, a second image, outputting a mixed image that is a mixture of the first image and the second image, generating a third image on a third plane corresponding to the mixed image, and displaying the third image based on removal of the first image from the display.

公开(公告)号：US20160156925A1

公开(公告)日：2016-06-02

申请号：US14938248

申请日：2015-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehwan KIM ,  Sungho Roh

IPC: H04N19/52 ,  H04N19/80 ,  H04N19/176 ,  H04N19/167 ,  H04N19/61 ,  H04N19/124

CPC classification number: H04N19/57 ,  H04N19/20

Abstract: An encoding system includes a motion estimation unit configured to receive a plurality of frames and motion data corresponding to the plurality of frames, the plurality of frames including a first frame and a second frame, the first frame being a reference frame to an encoding target frame and the second frame being the encoding target frame, the motion estimation unit further configured to generate a motion vector to indicate a positional relationship between a macroblock of the first frame and a target macroblock of the second frame, a motion compensation unit configured to compensate for a motion of the target macroblock of the second frame according to the motion vector, a transform and quantization unit configured to output transformed and quantized data transforming and quantizing the motion-compensated target macroblock of the second frame and an encoder configured to encode the transformed and quantized data and output the encoded data.

Abstract translation: 编码系统包括：运动估计单元，被配置为接收与所述多个帧相对应的多个帧和运动数据，所述多个帧包括第一帧和第二帧，所述第一帧是参考帧到编码目标帧 并且所述第二帧是所述编码对象帧，所述运动估计单元还被配置为生成用于指示所述第一帧的宏块与所述第二帧的目标宏块之间的位置关系的运动矢量，运动补偿单元， 根据运动矢量的第二帧的目标宏块的运动;变换和量化单元，被配置为输出变换和量化数据，变换和量化第二帧的运动补偿目标宏块;以及编码器，被配置为编码经变换和 量化数据并输出编码数据。

公开(公告)号：US20250079279A1

公开(公告)日：2025-03-06

申请号：US18761415

申请日：2024-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geunwoo KIM ,  Taehwan KIM ,  Taejun KIM

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/528 ,  H01L23/552 ,  H05K1/11

Abstract: An electronic device includes a main board; a semiconductor package disposed on the main board and mounted via a plurality of conductive connection members; and an electromagnetic shielding member covering an upper surface and side surfaces of the semiconductor package. The plurality of conductive connection members includes: a plurality of signal connection balls disposed on a middle region of a lower surface of the semiconductor package and having a first diameter; and a plurality of electromagnetic shielding balls spaced apart from each other along an edge of the lower surface of the semiconductor package, the electromagnetic shielding balls surrounding the middle region and having a second diameter smaller than the first diameter.

公开(公告)号：US20240304564A1

公开(公告)日：2024-09-12

申请号：US18394974

申请日：2023-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junbae KIM ,  Taehwan KIM ,  Heejung HWANG

IPC: H01L23/552 ,  H01L25/00 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L23/552 ,  H01L25/18 ,  H01L25/50 ,  H10B80/00 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265

Abstract: An electronic device includes a base substrate; a first package mounted on the base substrate, the first package including a first substrate and a first semiconductor chip mounted on the first substrate; a second package mounted on the first package, the second package including a second substrate, a second semiconductor chip mounted on the second substrate, a sealing material surrounding an upper surface of the second substrate and the second semiconductor chip, and a conformal conductive coating formed on at least an upper surface of the sealing material. A conductive fixing portion is secured to a ground pad exposed at an upper surface of the base substrate. A shielding can is secured to the base substrate by the conductive fixing portion and includes a side portion extending around the first and second packages. A metal paste is formed between the shielding can and the conformal conductive coating to contact the shielding can and the conformal conductive coating.

公开(公告)号：US20250103201A1

公开(公告)日：2025-03-27

申请号：US18974433

申请日：2024-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minwoo LEE ,  Taehwan KIM ,  Kwangsub BYUN ,  Sungjin SON ,  Jooheon LEE ,  Junyoung JEON ,  Junho JUNG ,  Hyunseok CHA

IPC: G06F3/0487 ,  G06F3/0362 ,  G06F3/0482

Abstract: A method of controlling a user interface in an electronic device according to an embodiment of the present disclosure may comprise: obtaining a wheel-based signal being executed by wheel manipulation; and obtaining an input signal type supported by a running application; based on the input signal type being a first input signal type, transferring the obtained wheel-based signal to the running application; and based on the input signal type being a second input signal type, changing the obtained wheel-based signal to a direction control signal and transferring same to the running application.

公开(公告)号：US20240337687A1

公开(公告)日：2024-10-10

申请号：US18531266

申请日：2023-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehwan KIM ,  Hyungjung SEO ,  Younsik PARK

IPC: G01R31/28

CPC classification number: G01R31/2884

Abstract: A system for verifying an integrated circuit includes a tracing module configured to: trace a specified path based on the specified path on which a timing analysis will be performed among a plurality of signal transfer paths within the integrated circuit and a netlist of the integrated circuit at a transistor level, generate a list of nets listing names of nets in the specified path based on the netlist and information on the specified path, declare design constraints for the specified path based on the list of the nets, and generate parasitic data for the net based on the list of the nets. The system further includes an analysis module configured to perform a timing analysis for the specified path based on the design constraints and the parasitic data.

公开(公告)号：US20240321841A1

公开(公告)日：2024-09-26

申请号：US18609255

申请日：2024-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwanjoo PARK ,  Jaechoon KIM ,  Sunggu KANG ,  Taehwan KIM

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/3736 ,  H01L23/49816 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1094

Abstract: The disclosure provides a semiconductor package including a first wiring structure including a first wiring, a first semiconductor chip on the first wiring structure, a molding member surrounding the first semiconductor chip, a second wiring structure on an upper surface of the molding member and including a second wiring and a heat conductive metal, a second semiconductor chip on an upper surface of the second wiring structure, a plurality of first bumps between the second wiring structure and the second semiconductor chip, an underfill layer covering the plurality of first bumps, and a first thermal interface material (TIM) on an upper surface of the heat conductive metal, the heat conductive metal not overlapping the plurality of first bumps in the vertical direction.

公开(公告)号：US20240111172A1

公开(公告)日：2024-04-04

申请号：US17703289

申请日：2022-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeheung PARK ,  Hyungjin RHO ,  Hwajoong JUNG ,  Bongchan KIM ,  Taehwan KIM ,  Kwangseok BYON ,  Kihuk LEE

IPC: G02B27/64 ,  G03B5/00 ,  H04N23/54

CPC classification number: G02B27/646 ,  G03B5/00 ,  H04N23/54 ,  G03B2205/0007 ,  G03B2205/0069

Abstract: Disclosed is a camera module. The camera module includes a lens assembly including a lens and an image stabilization assembly including a moving member including a first substrate and an image sensor electrically connected to the first substrate, the image stabilization assembly being connected to the lens assembly wherein an optical axis is at least partially aligned with the image sensor. The image stabilization assembly is configured to move the moving member in at least one direction perpendicular to the optical axis such that the optical axis is aligned with a specified position on the image sensor.