公开(公告)号：AT542785T

公开(公告)日：2012-02-15

申请号：AT05254950

申请日：2005-08-09

Applicant: UNITED TECHNOLOGIES CORP

Inventor： BHATIA TANIA ,  HOLOWCZAK JOHN E ,  BALDWIN NEIL

IPC: C04B41/90 ,  C25D13/02 ,  F01D5/28

Abstract: The present invention relates to a process for the deposition of protective coatings on complex shaped Si-based substrates which are used in articles and structures subjected to high temperature, aqueous environments comprises a non-line-of-sight process, particularly, electrophoretic deposition (EPD) process. The deposition process comprises steps of: providing a complex shaped Si-containing substrate; depositing an electrically conductive layer on the substrate; and depositing at least one barrier layer by electrophoretic deposition (EPD) as a protective coating.