ASSEMBLY AND METHOD FOR TRANSFER MOLDING
    2.
    发明申请
    ASSEMBLY AND METHOD FOR TRANSFER MOLDING 审中-公开
    组装和转移成型方法

    公开(公告)号:WO2015108579A3

    公开(公告)日:2015-09-11

    申请号:PCT/US2014060406

    申请日:2014-10-14

    Inventor: JARMON DAVID C

    Abstract: One exemplary embodiment of this disclosure relates to a transfer molding assembly. The assembly includes a die having a molding cavity interconnected with a reservoir. The assembly further includes a heater operable to heat the die, and a load plate configured to move under its own weight to transfer material from the reservoir into the molding cavity.

    Abstract translation: 本公开的一个示例性实施例涉及一种传递模制组件。 该组件包括具有与储存器相互连接的模腔的模具。 所述组件还包括可操作以加热所述模具的加热器,以及构造成在其自重下移动以将材料从所述储存器转移到所述模腔中的负载板。

    4.
    发明专利
    未知

    公开(公告)号:DE60138173D1

    公开(公告)日:2009-05-14

    申请号:DE60138173

    申请日:2001-12-18

    Abstract: A ceramic matrix composite part having elongated cooling channels within the wall thereof is manufactured by inserting decomposable inserts within a woven ceramic fiber preform. The inserts are tows of continuous carbon fibers surrounded by a carbonaceous filler, and are inserted where the channels are desired. The preform, with the inserts in place, is disposed within a mold. A ceramic matrix material is added and the fiber preform is consolidated with the ceramic matrix material. The consolidated part is then heated to thermally decompose the inserts to create the elongated channels within the part. The inserts may be flexible and woven into the preform using an automated weaving loom, or they may have limited flexibility and be inserted by machine or by hand.

    ASSEMBLY AND METHOD FOR TRANSFER MOLDING
    6.
    发明公开
    ASSEMBLY AND METHOD FOR TRANSFER MOLDING 审中-公开
    ANORDNUNG UND VERFAHRENFÜRSPRITZPRESSEN

    公开(公告)号:EP3057747A4

    公开(公告)日:2017-05-31

    申请号:EP14854538

    申请日:2014-10-14

    Inventor: JARMON DAVID C

    CPC classification number: B05D1/00 B05C1/003 B05D2203/30 C03B19/02 C03B19/025

    Abstract: One exemplary embodiment of this disclosure relates to a transfer molding assembly including a chamber, a die within the chamber, a first gas control device configured to provide a first gas into the chamber, and a second gas control device configured to provide a second gas into the die.

    Abstract translation: 本公开的一个示例性实施例涉及一种传递模塑组件,其包括腔室,腔室内的模具,构造成将第一气体提供到腔室中的第一气体控制装置以及构造成将第二气体提供到腔室中的第二气体控制装置 死亡。

    ASSEMBLY AND METHOD FOR TRANSFER MOLDING
    7.
    发明公开
    ASSEMBLY AND METHOD FOR TRANSFER MOLDING 审中-公开
    ANORDNUNG UND VERFAHRENFÜRSPRITZPRESSEN

    公开(公告)号:EP3057756A4

    公开(公告)日:2017-06-28

    申请号:EP14879144

    申请日:2014-10-14

    Inventor: JARMON DAVID C

    Abstract: One exemplary embodiment of this disclosure relates to a transfer molding assembly. The assembly includes a die having a molding cavity interconnected with a reservoir. The assembly further includes a heater operable to heat the die, and a load plate configured to move under its own weight to transfer material from the reservoir into the molding cavity.

    Abstract translation: 本公开的一个示例性实施例涉及一种传递模制组件。 该组件包括具有与储存器相互连接的模腔的模具。 所述组件还包括可操作以加热所述模具的加热器,以及构造成在其自重下移动以将材料从所述储存器转移到所述模腔中的负载板。

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