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公开(公告)号:EP2438608A4
公开(公告)日:2015-01-07
申请号:EP10784163
申请日:2010-06-04
Applicant: UNIV NORTHWESTERN
Inventor: MIRKIN CHAD A , SHIM WOOYOUNG , BRAUNSCHWEIG ADAM B , LIAO XING , CHAI JINAN , LIM JONG KUK , ZHENG GENGFENG , ZHENG ZIJIAN
CPC classification number: G03F7/0002 , B81B2203/0361 , B81B2207/056 , B81C1/00111 , B81C1/0046 , B81C2201/0154 , B81C2201/0185 , B82Y10/00 , B82Y40/00 , Y10S977/732
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公开(公告)号:ES2687650T3
公开(公告)日:2018-10-26
申请号:ES09735282
申请日:2009-04-25
Applicant: UNIV NORTHWESTERN
Inventor: MIRKIN CHAD , HUO FENGWEI , ZHENG ZIJIAN , ZHENG GENGFENG
Abstract: Un método para la impresión a escala submicrométrica de signos sobre una superficie de un sustrato, que comprende: revestir una disposición de puntas con una composición para dibujar, comprendiendo la disposición de puntas un polímero elastomérico compresible que comprende una pluralidad de puntas que no están en voladizo que tienen cada una un radio de curvatura menor de aproximadamente 1 μm, y un sustrato común que comprende una capa elastomérica que comprende un polímero elastomérico compresible, estando la disposición de puntas y el sustrato común fijados sobre un soporte rígido y siendo la disposición de puntas, sustrato común y soporte rígido juntos al menos traslúcidos; poner en contacto la superficie del sustrato durante un primer período de tiempo de contacto y una primera presión de contacto con todas o sustancialmente todas las puntas revestidas de la disposición para depositar la composición para dibujar sobre la superficie del sustrato para formar signos sustancialmente uniformes con todas o sustancialmente todas las citadas puntas revestidas, teniendo los signos un tamaño de puntos o anchura de línea de menos de 1 μm.
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公开(公告)号:CA2763907A1
公开(公告)日:2010-12-09
申请号:CA2763907
申请日:2010-06-04
Applicant: UNIV NORTHWESTERN
Inventor: MIRKIN CHAD A , SHIM WOOYOUNG , BRAUNSCHWEIG ADAM B , LIAO XING , CHAI JINAN , LIM JONG KUK , ZHENG GENGFENG , ZHENG ZIJIAN
IPC: H01L21/027
Abstract: Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.
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公开(公告)号:WO2010096593A3
公开(公告)日:2010-12-16
申请号:PCT/US2010024633
申请日:2010-02-18
Applicant: UNIV NORTHWESTERN , MIRKIN CHAD A , ZHENG GENGFENG , HUO FENGWEI
Inventor: MIRKIN CHAD A , ZHENG GENGFENG , HUO FENGWEI
IPC: H01L21/027 , G03F7/20
CPC classification number: G03F7/2051 , G03F7/70291 , G03F7/70383 , G03F7/70466 , G03F7/70525 , G03F7/70958
Abstract: The disclosure relates to methods of beam pen lithography using a tip array having a plurality of transparent, elastomeric, reversibly-deformable tips coated with a blocking layer and apertures defined in the blocking layer to expose tip ends of the tips in the array. The tip array can be used to perform a photolithography process in which the tips are illuminated with a radiation that is channeled through the tips and out the apertures to expose a photosensitive substrate. Also disclosed are tip arrays formed of polymers and gels, apparatus including the tip arrays and radiation sources, and related apparatus for selectively masking tips in the tip array from radiation emitted from the radiation source.
Abstract translation: 本公开涉及使用尖端阵列的光束笔光刻方法,所述尖端阵列具有涂覆有阻挡层的多个透明的,弹性的,可逆变形的尖端和在所述阻挡层中限定的孔以暴露所述阵列中的尖端的末端。 尖端阵列可以用于执行光刻工艺,其中尖端用引导穿过尖端并从孔出来的辐射照射以曝光感光基底。 还公开了由聚合物和凝胶形成的尖端阵列,包括尖端阵列和辐射源的设备以及用于从由辐射源发射的辐射选择性地遮蔽尖端阵列中的尖端的相关装置。
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公开(公告)号:HK1156704A1
公开(公告)日:2012-06-15
申请号:HK11111062
申请日:2011-10-17
Applicant: UNIV NORTHWESTERN
Inventor: MIRKIN CHAD A , HUO FENGWEI , ZHENG ZIJIAN , ZHENG GENGFENG
IPC: G03F20060101
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公开(公告)号:WO2010141836A3
公开(公告)日:2011-03-03
申请号:PCT/US2010037428
申请日:2010-06-04
Applicant: UNIV NORTHWESTERN , MIRKIN CHAD A , SHIM WOOYOUNG , BRAUNSCHWEIG ADAM B , LIAO XING , CHAI JINAN , LIM JONG KUK , ZHENG GENGFENG , ZHENG ZIJIAN
Inventor: MIRKIN CHAD A , SHIM WOOYOUNG , BRAUNSCHWEIG ADAM B , LIAO XING , CHAI JINAN , LIM JONG KUK , ZHENG GENGFENG , ZHENG ZIJIAN
IPC: H01L21/027
CPC classification number: G03F7/0002 , B81B2203/0361 , B81B2207/056 , B81C1/00111 , B81C1/0046 , B81C2201/0154 , B81C2201/0185 , B82Y10/00 , B82Y40/00 , Y10S977/732
Abstract: Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.
Abstract translation: 公开了使用具有连接到背衬层的多个笔的尖端阵列的光刻方法,其中尖端可以包括金属,准金属和/或半导电材料,并且背衬层可以包括弹性体聚合物。 尖端阵列可用于执行光刻工艺,其中尖端涂覆有当尖端与衬底表面接触时沉积到衬底上的油墨(例如,图案化组合物)。 尖端可以容易地平整到基底上,并且可以通过背衬层的光反射的变化和/或在尖端与基底表面接触时靠近尖端附近来光学地监测流平。
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