公开(公告)号：JP2010084164A

公开(公告)日：2010-04-15

申请号：JP2008251829

申请日：2008-09-29

Applicant: Epson Toyocom Corp ,  エプソントヨコム株式会社

Inventor： YAMAMOTO YUSUKE ,  UGAWA MASAKI

IPC: C23F4/00 ,  C23C16/458

Abstract: PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus where a workpiece can be correctly positioned on the placing face of a placing part, upon plasma treatment, prescribed plasma treatment can be performed to the workpiece by securely fixing the workpiece to the placing part, and further, the workpiece can be easily removed from the placing part after the plasma treatment.
SOLUTION: The plasma treatment apparatus 1 comprises: a lower electrode 22 provided with a placing face 221; a hole 61 provided to the lower electrode 22 and opened to the placing face 221; a pin 71 inserted to the hole and freely retractable from the plating face; and a fixing means 6 fixing a workpiece 10 to the placing face 221. The fixing means 6 utilizes at least a part of the space on the inside of the hole 61 as a suction hole, and decompresses the suction hole so as to suck and fix the back face 102 of the workpiece 10 to the placing face 221.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供等离子体处理装置，其中可以将工件正确地定位在放置部件的放置面上，在等离子体处理时，可以通过将工件牢固地固定到工件上来对工件进行规定的等离子体处理 放置部件，此外，等离子体处理后，工件可以容易地从放置部件移除。 解决方案：等离子体处理装置1包括：设置有放置面221的下电极22; 设置在下部电极22上且向着放置面221开口的孔61; 插入到孔中并从电镀面自由缩回的销71; 以及将工件10固定到放置面221的固定装置6.固定装置6将孔61的内部的至少一部分空间用作吸入孔，并且将吸入孔减压以便吸取和固定 工件10的背面102到放置面221.版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010081225A

公开(公告)日：2010-04-08

申请号：JP2008246346

申请日：2008-09-25

Applicant: Epson Toyocom Corp ,  エプソントヨコム株式会社

Inventor： ANZAI FUMIO

IPC: H03H3/02 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/23 ,  H01L41/253 ,  H01L41/313 ,  H03H3/04 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric vibrator capable of reducing manufacture steps while improving the loading accuracy of a piezoelectric vibration piece. SOLUTION: The manufacturing method of the piezoelectric vibrator includes: a loading step of loading the piezoelectric vibration piece 30 on the tray 50 provided with a stage 56 with an opening 60 for suction; a suction step of fixing the piezoelectric vibration piece 30 to the stage 56 by applying a negative pressure to the opening 60; an application step of applying a conductive adhesive 40 to the input/output electrode 36 of the piezoelectric vibration piece 30; a mounting step of electrically connecting the input/output electrode 36 and a mount electrode through the conductive adhesive 40 in the state of sucking and fixing the piezoelectric vibration piece 30 to the stage 56; and a curing step of curing the conductive adhesive 40 in the state of loading the piezoelectric vibration piece 30 on the stage 56. In the mounting step, the loading angle of the piezoelectric vibration piece 30 to a package base 16 and the height when loading it are determined utilizing the level difference part 54 of the stage 56 in the tray 50. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够在提高压电振动片的加载精度的同时减少制造步骤的压电振动器的制造方法。 解决方案：压电振动器的制造方法包括：将压电振动片30装载在设置有台架56的托盘50上的装载步骤，具有用于抽吸的开口60; 通过向开口60施加负压将压电振动片30固定到台56的抽吸步骤; 施加步骤，将导电粘合剂40施加到压电振动片30的输入/输出电极36; 在将压电振动片30吸附固定到台架56的状态下，通过导电性粘合剂40电连接输入输出电极36和安装电极的安装工序; 以及在将压电振动片30装载到台56上的状态下固化导电性粘合剂40的固化工序。在安装工序中，压电振动片30与封装基座16的装载角度以及装载时的高度 使用托盘50中的台56的水平差部分54来确定。版权所有：（C）2010，JPO＆INPIT

公开(公告)号：JP2010056842A

公开(公告)日：2010-03-11

申请号：JP2008219216

申请日：2008-08-28

Applicant: Epson Toyocom Corp ,  エプソントヨコム株式会社

Inventor： MATSUZAWA JUICHIRO ,  SHIMODAIRA KAZUHIKO

IPC: H03B5/32 ,  H01L23/28

CPC classification number: H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To let an increase in an electronic-part loadable area on a circuit board and an improvement in reliability on an electro-mechanical connection coexist in a piezoelectric device having a two-storied structure. SOLUTION: The piezoelectric device 10 having the two-storied structure includes a resin 39 coating an IC on the circuit board 22. Through-holes 28 used for electrically connecting internal terminals 24 fitted on one main surface in the circuit board 22 and a rear electrode 44 for a piezoelectric vibrator 40 are formed to the resin 39. Recesses 30 having aperture areas larger than the through-holes 28 are formed at the upper ends of the through-holes 28, and the circuit board 22 and the piezoelectric vibrator 40 are connected electrically and mechanically by a conductive member 38 filled into the through-holes 28 and the recesses 30. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题为了使电路板上的电子部件可承载区域的增加和机电连接的可靠性的提高在具有两层结构的压电装置中共存。 具有双层结构的压电装置10包括在电路板22上涂覆IC的树脂39.用于电连接装配在电路板22的一个主表面上的内部端子24的通孔28和 在树脂39上形成有用于压电振动器40的后电极44.在通孔28的上端形成具有大于通孔28的孔径面的凹部30，并且电路板22和压电振子 40通过填充到通孔28和凹槽30中的导电构件38电连接和机械连接。版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010045270A

公开(公告)日：2010-02-25

申请号：JP2008209505

申请日：2008-08-18

Applicant: Epson Toyocom Corp ,  エプソントヨコム株式会社

Inventor： KURITA TOSHIYUKI

IPC: H05K3/34 ,  B23K3/00 ,  B23K101/42

Abstract: PROBLEM TO BE SOLVED: To provide a terminal positioning device that is shared for the positioning of not only a straight type terminal whose total length is linearly extended but also differently shaped terminals such as a J type terminal and an L type terminal whose ends supported by a positioning jig are non-linearly deformed, and that is mounted in a batch on the terminal receiving section of a printed circuit board side.
SOLUTION: The terminal positioning device includes: a base member 2 having a placement surface 3 on which a printed circuit board 30 having a plurality of terminal receiving sections is placed and a terminal support recess 4 for supporting the supported end of each terminal 40 installed corresponding to each terminal receiving section one to one; a terminal pressing member 10 for pressurizing each terminal supported so as to freely move backward and forward by the base member 2, and stored in each terminal support recess in a batch to one internal wall 4a of the terminal support recess for positioning it; and a driving mechanism 15 for making the terminal pressing member move backward and forward between the pressurizing position where each terminal is pressurized to one internal wall and a release position where the pressurization is released.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种终端定位装置，其不仅是用于定位总长度线性延伸的直型终端，而且还具有不同形状的端子，例如J型端子和L型端子， 由定位夹具支撑的端部是非线性变形的，并且分批安装在印刷电路板侧的端子接收部分上。 端子定位装置包括：基座部件2，具有放置面3，配置有多个端子接收部的印刷电路板30和支承各端子的支承端的端子支承凹部4 40对应于每个终端接收部分一一对应; 终端按压部件10，用于对被支撑的每个端子进行加压，以便由基部部件2自由地向前和向后移动，并且分批地存储在每个端子支撑凹部中，以将其定位在端子支撑凹部的一个内壁4a上; 以及用于使端子按压部件在每个端子被加压到一个内壁的加压位置和释放加压的释放位置之间向前和向前移动的驱动机构15。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010043962A

公开(公告)日：2010-02-25

申请号：JP2008208332

申请日：2008-08-13

Applicant: Epson Toyocom Corp ,  エプソントヨコム株式会社

Inventor： SATO KENJI

IPC: G01C19/56 ,  G01P9/04

Abstract: PROBLEM TO BE SOLVED: To provide a circuit and device for detecting angular velocity and a method for diagnosing the device for detecting angular velocity, which enhance the accuracy in fault diagnosis without affecting the accuracy in detection of angular velocity. SOLUTION: The circuit 80 for detecting angular velocity includes a drive circuit 20 which supplies a drive signal to a drive electrode 102 of a vibrator 10, and a detecting circuit 30 which forms an angular velocity detection signal 32 according to the angular velocity, based on signals generated in detecting electrodes 112 and 114 of the vibrator 10. In a fault diagnosis mode, the drive circuit 20 forms an angular velocity false signal and supplies the formed angular velocity false signal to the drive electrode 102 of the vibrator 10, superposing it on the drive signal. In the fault diagnosis mode, the detecting circuit 30 forms the angular velocity detection signal 32, based on a signal propagated by the angular velocity false signal to the detecting electrodes 112 and 114 through the capacitive coupling capacity between the drive electrode 102 of the vibrator 10 and the detecting electrodes 112 and 114 thereof. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于检测角速度的电路和装置以及用于诊断角速度检测装置的方法，其提高了故障诊断的精度，而不影响角速度的检测精度。 解决方案：用于检测角速度的电路80包括：向振动器10的驱动电极102提供驱动信号的驱动电路20;以及根据角速度形成角速度检测信号32的检测电路30 基于在振动器10的检测电极112和114中产生的信号。在故障诊断模式中，驱动电路20形成角速度假信号，并将形成的角速度假信号提供给振动器10的驱动电极102， 将其叠加在驱动信号上。 在故障诊断模式中，检测电路30通过振动器10的驱动电极102之间的电容耦合能力，基于由角速度假信号传播到检测电极112和114的信号形成角速度检测信号32 及其检测电极112和114。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP4420038B2

公开(公告)日：2010-02-24

申请号：JP2007034377

申请日：2007-02-15

Applicant: エプソントヨコム株式会社

Inventor： 潤 渡辺

IPC: G01P15/10

CPC classification number: G01L1/162

公开(公告)号：JP2010039158A

公开(公告)日：2010-02-18

申请号：JP2008201557

申请日：2008-08-05

Applicant: Epson Toyocom Corp ,  エプソントヨコム株式会社

Inventor： KAWASE AKIKO

IPC: G02B5/30 ,  G02F1/13 ,  G02F1/13363 ,  G03B21/00 ,  G03B21/14

Abstract: PROBLEM TO BE SOLVED: To provide an optical product for bonding optical members to each other without causing any variation of wavefront aberration or entry of bubbles in a bonding layer, and to provide a method of manufacturing the optical product. SOLUTION: The optical product 6 is used for the projector and is provided with an optical compensation substrate 61 having an optical compensation function, a support substrate 62 for supporting the optical compensation substrate 61, and a bonding layer 63 for molecularly bonding the optical members. The bonding layer 63 is composed of a plasma polymerized film. As a result, the optical compensation substrate 61 and the support substrate 62 are molecularly bonded to dispense with an adhesive, thereby causing no variation in thickness of the bonded part and wavefront aberration while improving light resistance. Furthermore, the optical compensation substrate 61 and the support substrate 62 are molecularly bonded, so that high temperature processing is not required and the bonding is carried out in a short time. The optical compensation substrate 61 and the support substrate 62 are firmly bonded by forming the plasma polymerized film. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于将光学构件彼此结合的光学产品，而不会引起波面像差的任何变化或粘合层中气泡的进入，并提供制造光学产品的方法。

解决方案：光学产品6用于投影仪，并且设置有具有光学补偿功能的光学补偿基板61，用于支撑光学补偿基板61的支撑基板62和用于分子结合 光学构件。 接合层63由等离子体聚合膜构成。 结果，光学补偿基板61和支撑基板62被分子结合以省去粘合剂，从而在改善耐光性的同时不会导致接合部分的厚度和波前像差的变化。 此外，光学补偿基板61和支撑基板62分子结合，使得不需要高温处理，并且在短时间内进行接合。 通过形成等离子体聚合膜，光学补偿基板61和支撑基板62牢固地接合。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP4412506B2

公开(公告)日：2010-02-10

申请号：JP2007232805

申请日：2007-09-07

Applicant: エプソントヨコム株式会社

Inventor： 健次 土戸 ,  貴大 黒田

IPC: H03H9/02 ,  H03H3/02

CPC classification number: H03H9/1035 ,  H03H9/0595 ,  Y10T29/42

公开(公告)号：JP4412123B2

公开(公告)日：2010-02-10

申请号：JP2004263026

申请日：2004-09-09

Applicant: エプソントヨコム株式会社

Inventor： 康秀 小野澤

IPC: H03H9/25 ,  H03H3/08 ,  H03H9/72

CPC classification number: H03H9/059 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/16195 ,  H03H3/02 ,  H03H9/1078 ,  H03H9/1085 ,  Y10T29/42 ,  H01L2924/00014

Abstract: An SAW chip (11) where ones are balanced signal terminals and the others are unbalanced signal terminals is mounted on a mounting board (12) in a flip chip manner, and the mounting board (12) and a surface of the SAW chip are covered with resin (19). At that time, grounds of first and second SAW filters in the SAW chip (11) are connected together and an annular pattern (14) is formed so as to surround a signal pattern of the SAW chip (11) on the mounting board (12) on which the SAW chip (11) is mounted, and the annular electrode (14) is connected to a ground pattern.

公开(公告)号：JPWO2008044484A1

公开(公告)日：2010-02-04

申请号：JP2008538636

申请日：2007-09-20

Applicant: エプソントヨコム株式会社

Inventor： 明法 山田 ,  明法 山田 ,  小野澤　康秀 ,  康秀 小野澤

IPC: H03H9/19 ,  H01L41/09 ,  H01L41/18

CPC classification number: H03H9/19 ,  H03H9/02023 ,  H03H9/02157 ,  H03H9/0595 ,  H03H9/132

Abstract: カット角がIRE標準のYXltφ/θで表される水晶基板からなる、平面形状が四角形の振動体と、前記振動体の表裏両面に形成され、外郭形状が四角形の励振電極とを備え、前記カット角θが40度以上50度以下の範囲であり、前記振動体の平面形状をなす前記四角形の1辺の長さL、前記振動体の厚さt、前記励振電極の膜厚H、前記励振電極の外郭形状をなす前記四角形の1辺の長さLe、によりカット角φを適切に設定して、温度特性の改善された輪郭振動子を得る。