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    Lead-free solder compositions
    94.
    发明授权
    Lead-free solder compositions 有权

    公开(公告)号：US12115602B2

    公开(公告)日：2024-10-15

    申请号：US17309818

    申请日：2019-12-26

    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

    Inventor： Ranjit Pandher ,  Niveditha Nagarajan ,  Anil Kumar ,  Morgana de Avila Ribas ,  Gyan Dutt ,  Siuli Sarkar ,  Carl Bilgrien

    IPC: B23K35/00 ,  B23K35/26 ,  C22C13/00

    CPC classification number: B23K35/262 ,  C22C13/00

    Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.

    Low-silver alternative to standard SAC alloys for high reliability applications
    96.
    发明授权
    Low-silver alternative to standard SAC alloys for high reliability applications 有权

    公开(公告)号：US11577343B2

    公开(公告)日：2023-02-14

    申请号：US16022337

    申请日：2018-06-28

    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

    Inventor： Md Hasnine ,  Lik Wai Kho

    IPC: B23K35/26 ,  C22C13/02 ,  B23K35/00 ,  B23K35/02

    Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony. The alloy may further comprise nickel. The silver may be present in an amount from about 2.0% to 2.8% by weight of the solder. The copper may be present in an amount from about 0.2% to 1.2% by weight of the solder. The bismuth may be present in an amount from about 0.0% to about 5.0% by weight of the solder. In some embodiments, the bismuth may be present in an amount from about 1.5% to 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.001% to about 0.2% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.1% by weight of the solder. The balance of the solder is tin.

    HIGH TEMPERATURE ULTRA-HIGH RELIABILITY ALLOYS
    97.
    发明申请
    HIGH TEMPERATURE ULTRA-HIGH RELIABILITY ALLOYS 有权

    公开(公告)号：US20220324063A1

    公开(公告)日：2022-10-13

    申请号：US17753280

    申请日：2020-08-28

    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

    Inventor： Pritha CHOUDHURY ,  Morgana RIBAS ,  Anil KUMAR ,  Raghu R. RANGARAJU ,  Siuli SARKAR

    IPC: B23K35/26 ,  C22C13/00 ,  B23K35/02

    Abstract: A lead-free solder alloy comprising: from 2.5 to 5 wt. % silver; from 0.01 to 5 wt. % bismuth; from 1 to 7 wt. % antimony; from 0.01 to 2 wt. % copper; one or more of: up to 6 wt. % indium, up to 0.5 wt. % titanium, up to 0.5 wt. % germanium, up to 0.5 wt. % rare earths, up to 0.5 wt. % cobalt, up to 5.0 wt. % aluminium, up to 5.0 wt. % silicon, up to 0.5 wt. % manganese, up to 0.5 wt. % chromium, up to 0.5 wt. % iron, up to 0.5 wt. % phosphorus, up to 0.5 wt. % gold, up to 1 wt. % gallium, up to 0.5 wt. % tellurium, up to 0.5 wt. % selenium, up to 0.5 wt. % calcium, up to 0.5 wt. % vanadium, up to 0.5 wt. % molybdenum, up to 0.5 wt. % platinum, and up 0 to 0.5 wt. % magnesium; optionally up to 0.5 wt. % nickel; and the balance tin together with any unavoidable impurities.

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