公开(公告)号：EP1154348A2

公开(公告)日：2001-11-14

申请号：EP01304182.7

申请日：2001-05-09

Applicant: Matsushita Electronics Corporation

Inventor： Matsuzaki, Natsume ,  Emura, Satoshi ,  Inagaki, Saturu

IPC: G06F1/00

CPC classification number: G06F21/6218

Abstract: A password registration unit encrypts key information using an input password, and stores the generated encrypted key as a file into a computer. A file encryption unit generates a file key arbitrarily, encrypts the file key using the key information, encrypts a plaintext using the file key to generate a ciphertext, and stores an encrypted file including the encrypted file key in its header part and the ciphertext in its data part. A file decryption unit decrypts the encrypted file key using the key information to obtain a file key, or receives an input of a password, decrypts the encrypted key using the password to obtain key information, and decrypts the encrypted file key using the key information to obtain a file key. The file decryption unit then decrypts the ciphertext using the obtained file key.

Abstract translation: 密码登记单元使用输入密码对密钥信息进行加密，将生成的加密密钥作为文件存储到计算机中。 文件加密单元任意地生成文件密钥，使用密钥信息对文件密钥进行加密，使用文件密钥加密明文生成密文，并将包含加密文件密钥的加密文件存储在其标题部分和密文中 数据部分。 文件解密单元使用密钥信息对加密文件密钥进行解密以获得文件密钥，或接收密码输入，使用密码解密加密密钥以获得密钥信息，并使用密钥信息对加密文件密钥进行解密 获取文件密钥。 文件解密单元然后使用获得的文件密钥对密文进行解密。

公开(公告)号：EP1152528A1

公开(公告)日：2001-11-07

申请号：EP00902110.6

申请日：2000-02-07

Applicant: Matsushita Electronics Corporation

Inventor： TSUZUKI, Shigeru ,  FUJII, Kunihiro ,  TAKADA, Masahiro ,  MATSUO, Satoshi ,  KOGA, Takafumi ,  MURAKAMI, Kozo

IPC: H03H3/08

CPC classification number: H03H9/1071 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/49117 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically scaled with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.

公开(公告)号：EP0975556B1

公开(公告)日：2001-11-07

申请号：EP98909128.5

申请日：1998-03-12

Applicant: SYMETRIX CORPORATION ,  MATSUSHITA ELECTRONICS CORPORATION

Inventor： KANO, Gota ,  PAZ DE ARAUJO, Carlos, A. ,  ARITA, Koji ,  SCOTT, Michael, C. ,  MCMILLAN, Larry, D. ,  HAYASHI, Shinichiro

IPC: C03C17/25 ,  H01J9/24

CPC classification number: H01J9/20 ,  C03C17/25 ,  C03C2217/228 ,  C03C2218/11 ,  H01J2209/012 ,  H01J2211/40

公开(公告)号：EP0936668A3

公开(公告)日：2001-09-12

申请号：EP99301126.1

申请日：1999-02-16

Applicant: Matsushita Electronics Corporation

Inventor： Ishihara, Tomoaki ,  Kobayashi, Kazunori ,  Nobusada, Toshihide

IPC: H01L21/84 ,  H01L21/336 ,  H01L21/60 ,  H01L21/768

CPC classification number: H01L27/1288 ,  H01L21/76895 ,  H01L24/11 ,  H01L27/1214 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/013

Abstract: On the surface of an insulating substrate 1 on which a transistor is formed, a first interlayer insulation film 8 is provided, and a first contact hole 9 and a metal interconnection layer 10 are formed. A second interlayer insulation film 11 is formed covering the above items, and a second contact hole 12 and a barrier metal 13 are formed. After a first hole 14 for bonding pad is formed, a third interlayer insulation film 15 is provided, and then a third contact hole 16 and a second hole 17 for bonding pad are formed. A transparent electro-conductive film 18 is formed covering the holes 14, 16 and 17, After that, a portion of the transparent electro-conductive film 18 locating above the holes 14, 17 for bonding pad is removed to have the metal interconnection layer 10 exposed. The exposed metal interconnection layer 10 is used as bonding pad 20. This contributes to reliable bonding of bonding wires onto the bonding pad.

Abstract translation: 在其上形成有晶体管的绝缘基板1的表面上，设置有第一层间绝缘膜8，并且形成第一接触孔9和金属互连层10。 形成覆盖上述物品的第二层间绝缘膜11，形成第二接触孔12和阻挡金属13。 在形成用于焊盘的第一孔14之后，设置第三层间绝缘膜15，然后形成用于焊盘的第三接触孔16和第二孔17。 形成覆盖孔14,16,17的透明导电膜18，然后去除位于用于接合焊盘的孔14,17上方的透明导电膜18的一部分，以使金属互连层10 裸露。 暴露的金属互连层10用作接合焊盘20.这有助于将接合线可靠地接合到接合焊盘上。

公开(公告)号：EP1130622A1

公开(公告)日：2001-09-05

申请号：EP01102120.1

申请日：2001-01-31

Applicant: Matsushita Electronics Corporation

Inventor： Nishikata, Koichi

IPC: H01J29/87

CPC classification number: H01J29/87

Abstract: A cathode ray tube includes a panel and a reinforcing band for implosion-protection that is located around a side wall of the panel. The reinforcing band is formed by folding over one side in a width direction of a belt-like metal plate (6) so as to have a partially twofold structure and by joining both end portions of the belt-like metal plate (6) so as to be in the shape of a closed loop extending along the side wall of the panel. One end portion and the other end portion of the both end portions are joined together so as to achieve a threefold structure in at least one part. This can achieve a strong reinforcing band at a low cost without using a special member.

Abstract translation: 阴极射线管包括面板和位于面板侧壁周围的用于防爆的增强带。 增强带通过在带状金属板（6）的宽度方向上的一侧折叠以形成部分双重结构并且通过将带状金属板（6）的两个端部接合成 呈沿着面板的侧壁延伸的闭环形状。 两个端部的一个端部和另一个端部接合在一起，以在至少一部分中实现三重结构。 这可以在不使用特殊成员的情况下以低成本实现强大的增强带。

公开(公告)号：EP0593197B1

公开(公告)日：2001-09-05

申请号：EP93307933.7

申请日：1993-10-06

Applicant: Matsushita Electronics Corporation

Inventor： Shimomura, Koji ,  Sano, Yoshikazu

IPC: H01L31/0216 ,  H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14643 ,  H01L31/02162 ,  H01L31/02327

公开(公告)号：EP0869665B1

公开(公告)日：2001-08-16

申请号：EP98109665.4

申请日：1993-11-18

Applicant: MATSUSHITA ELECTRONICS CORPORATION

Inventor： Itakura, Keijirou ,  Nobusada, Toshihide ,  Toyoda, Yasuyuki ,  Saitoh, Yukio ,  Kokusenya, Nohoru ,  Nagayoshi, Kyouichi ,  Tanaka, Hironori ,  Ozaki, Masayoshi

IPC: H04N3/15

CPC classification number: H04N5/3722 ,  H04N5/353 ,  H04N5/357 ,  H04N5/3658

公开(公告)号：EP1020935A3

公开(公告)日：2001-08-08

申请号：EP00100496.9

申请日：2000-01-11

Applicant: Matsushita Electronics Corporation

Inventor： Maeda, Toshihide ,  Obara, Kunihiko ,  Inoue, Tomio

IPC: H01L33/00 ,  H01S5/022

CPC classification number: H01L33/505 ,  H01L24/94 ,  H01L25/167 ,  H01L33/32 ,  H01L33/38 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/0603 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12033 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0016 ,  H01L2933/0041 ,  H01S5/32341 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A composite light-emitting device according to the present invention includes a light-emitting element including a transparent substrate and a multilayer structure formed on the substrate. The multilayer structure includes first and second semiconductor layers of first and second conductivity types, respectively. The device further includes a submount member for mounting the light-emitting element thereon. The principal surface of the submount member faces the multilayer structure. The submount member is electrically connected to the light-emitting element. The light-emitting element is covered with a wavelength-shifting resin member. The resin member is provided on the principal surface of the submount member and contains a photofluorescent or filtering compound. The photofluorescent compound shifts the wavelength of radiation that has been emitted from the light-emitting element, while the filtering compound partially absorbs the radiation.

Abstract translation: 根据本发明的复合发光装置包括：发光元件，其包括透明基板和形成在基板上的多层结构。 多层结构分别包括第一和第二导电类型的第一和第二半导体层。 该装置还包括用于在其上安装发光元件的基座部件。 底座构件的主表面面向多层结构。 基座部件电连接到发光元件。 发光元件被波长转移树脂部件覆盖。 树脂构件设置在基座构件的主表面上并且包含光荧光或过滤化合物。 荧光化合物使发光元件发射的辐射的波长偏移，同时过滤化合物部分地吸收辐射。

公开(公告)号：EP1115144A1

公开(公告)日：2001-07-11

申请号：EP00927810.2

申请日：2000-05-19

Applicant: Matsushita Electronics Corporation

Inventor： KITAMURA, Koji ,  TACHIBANA, Hirokazu

IPC: H01J61/46

CPC classification number: H01J61/46

Abstract: In a phosphor lamp manufacturing method, a phosphor suspension that is not prone to deterioration is prepared, and applied to an inner surface of a glass bulb. Then, the phosphor suspension is dried and baked to form a phosphor film. In addition to a phosphor, metal oxide used as a bonding agent, pure water used as a dispersant and ammonia used as a pH regulator are mixed into the phosphor suspension, and pH is regulated in a range of no less than pH8 and no more than pH10. Aluminum oxide particles with a specific surface area of no less than 1.5 m 2 /g and no more than 30 m 2 /g are used as the metal oxide. This makes the phosphor suspension less prone to deterioration and enables a high film strength of 1.5 gf/cm 2 or more to be obtained even if the phosphor film is formed using a phosphor suspension that has been left for a long period after mixing.

Abstract translation: 在荧光灯制造方法中，准备不容易劣化的荧光体悬浮液，并施加到玻璃灯泡的内表面。 然后，将磷光体悬浮液干燥并烘烤以形成荧光膜。 除了用作粘合剂的荧光体，用作分散剂的纯水和用作pH调节剂的氨之外，还混合到荧光体悬浮液中，并且将pH调节在不低于pH8且不超过 pH为10。 使用比表面积不小于1.5m 2 / g且不大于30m 2 / g的氧化铝颗粒作为金属氧化物。 这使得荧光体悬浮液不容易劣化，并且即使使用在混合后长时间留下的荧光体悬浮液形成荧光膜，也能够获得1.5gf / cm 2以上的高膜强度。

公开(公告)号：EP1113270A2

公开(公告)日：2001-07-04

申请号：EP00128537.8

申请日：2000-12-27

Applicant: Matsushita Electronics Corporation

Inventor： Kawamura, Tatsurou

IPC: G01N33/493 ,  G01N21/82

CPC classification number: G01N21/82

Abstract: The object of the present invention is to measure a concentration of protein stably at a temperature not higher than 25°C, which is a possible ambient temperature at home, and further to expand the measurable concentration range while preventing an obstruction due to a suspending particle such as a bubble and the like, using a reagent prepared by mixing an acid in a solution containing tannin, tannic acid and m-galloyl gallic acid. By mixing the reagent in a solution to be detected to opacify the solution, intensities of at least a transmitted light or a scattered light of the solution to be detected is measured, and a protein concentration thereof is determined based on the intensity. The present invention also provides a method for measuring a concentration of a solution and a method of urinalysis, wherein a protein concentration is measured after measuring an angle of rotation.

Abstract translation: 本发明的目的是在不高于25℃的温度下稳定地测量蛋白质的浓度，这是家庭中可能的环境温度，并进一步扩大可测量的浓度范围，同时防止由于悬浮颗粒引起的阻塞 使用通过将酸混合在含有单宁，单宁酸和间伐酰基没食子酸的溶液中制备的试剂，如气泡等。 通过将待检测溶液中的试剂混合以使溶液不透明度，测量待检测溶液的至少透射光或散射光的强度，并且基于强度确定其蛋白质浓度。 本发明还提供了一种测定溶液浓度的方法和尿分析方法，其中在测量旋转角度后测量蛋白质浓度。