AMBIENT LIGHT SENSING DEVICE AND METHOD, AND INTERACTIVE DEVICE USING SAME

    公开(公告)号:US20180136740A1

    公开(公告)日:2018-05-17

    申请号:US15856042

    申请日:2017-12-27

    Inventor: Chuan-Hsin Lee

    CPC classification number: G06F3/0304 G06K9/4661

    Abstract: The invention provides an ambient light sensing device which receives at least one visible light image sensed by an image sensor. The ambient light sensing device includes an image sampling unit and an analyzing unit. The image sampling unit divides the visible light image into plural image blocks, extracts at least one sample data in each image block, and generates a comparison data according to a difference between the sample data extracted at different time points. The analyzing unit analyzes the comparison data and generates an output analysis signal accordingly.

    Thermal pile sensing structure integrated with capacitor

    公开(公告)号:US09945726B2

    公开(公告)日:2018-04-17

    申请号:US15249214

    申请日:2016-08-26

    CPC classification number: G01J5/16 G01J5/024 G01J5/12

    Abstract: The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

    MEMS ACOUSTIC PRESSURE SENSOR DEVICE AND METHOD FOR MAKING SAME

    公开(公告)号:US20170225944A1

    公开(公告)日:2017-08-10

    申请号:US15494535

    申请日:2017-04-23

    Inventor: Chuan-Wei Wang

    CPC classification number: G01L9/0073 H01L28/00

    Abstract: The present invention discloses a Micro-Electro-Mechanical System (MEMS) acoustic pressure sensor device and a method for making same. The MEMS device includes: a substrate; a fixed electrode provided on the substrate; and a multilayer structure, which includes multiple metal layers and multiple metal plugs, wherein the multiple metal layers are connected by the multiple metal plugs. A cavity is formed between the multilayer structure and the fixed electrode. Each metal layer in the multilayer structure includes multiple metal sections. The multiple metal sections of one metal layer and those of at least another metal layer are staggered to form a substantially blanket surface as viewed from a moving direction of an acoustic wave.

    IMAGE SENSOR CIRCUIT WITH POWER NOISE FILTERING FUNCTION AND CONTROL METHOD THEREOF
    95.
    发明申请
    IMAGE SENSOR CIRCUIT WITH POWER NOISE FILTERING FUNCTION AND CONTROL METHOD THEREOF 有权
    具有功率噪声滤波功能的图像传感器电路及其控制方法

    公开(公告)号:US20160309099A1

    公开(公告)日:2016-10-20

    申请号:US14960178

    申请日:2015-12-04

    CPC classification number: H04N5/378 H04N5/3577 H04N5/361

    Abstract: The present invention provides an image sensor circuit with a power noise filtering function and a control method thereof. The image sensor circuit includes: an image sensing unit, for sensing an image, to generate an image sensed signal; a power noise sensing unit, for sensing a power noise, to generate a power noise signal; a differential amplifier circuit, which is coupled to the image sensing unit and the power noise sensing unit, for receiving the image sensed signal and the power noise signal, to generate a differential filtered signal by a differential amplification operation between the image sensed signal and the power noise signal; and an analog-to-digital converter (ADC) circuit, which is coupled to the differential amplifier circuit, for receiving the differential filtered signal, to generate a digital image signal.

    Abstract translation: 本发明提供一种具有功率噪声滤波功能的图像传感器电路及其控制方法。 图像传感器电路包括:图像感测单元,用于感测图像,以产生图像感测信号; 功率噪声感测单元,用于感测功率噪声,以产生功率噪声信号; 差分放大电路,其耦合到图像感测单元和功率噪声感测单元,用于接收图像感测信号和功率噪声信号,以通过图像感测信号和图像感测信号之间的差分放大操作产生差分滤波信号 功率噪声信号; 以及耦合到差分放大器电路的用于接收差分滤波信号的模数转换器(ADC)电路,以产生数字图像信号。

    TV demodulator capable of calibrating output and calibration method thereof
    96.
    发明授权
    TV demodulator capable of calibrating output and calibration method thereof 有权
    电视解调器能够校准其输出和校准方法

    公开(公告)号:US09456171B1

    公开(公告)日:2016-09-27

    申请号:US14960251

    申请日:2015-12-04

    Inventor: Chia-Ming Wu

    CPC classification number: H04N5/455

    Abstract: The present invention provides a TV demodulator, which includes a TV digital-to-analog converter (TV DAC) and a calibration circuit. The TV DAC includes: a master control switch controlled by a calibration signal to generate a master current; a current distribution circuit distributing the master current to generate an analog output signal at an output terminal; a first switch electrically connected between the current distribution circuit and a first resistor; and a second switch electrically connected between the current distribution circuit and a second resistor. The calibration circuit generates the calibration signal according to the analog output signal, to feedback control the master current.

    Abstract translation: 本发明提供一种TV解调器,其包括TV数模转换器(TV DAC)和校准电路。 TV DAC包括:由校准信号控制的主控开关,以产生主电流; 分配主电流以在输出端产生模拟输出信号的电流分配电路; 电连接在电流分配电路和第一电阻器之间的第一开关; 以及电连接在电流分配电路和第二电阻器之间的第二开关。 校准电路根据模拟输出信号产生校准信号,以反馈控制主电流。

    封裝結構
    97.
    发明专利
    封裝結構 审中-公开
    封装结构

    公开(公告)号:TW201717329A

    公开(公告)日:2017-05-16

    申请号:TW105127369

    申请日:2015-11-06

    Abstract: 一種封裝結構,包含:一基板;至少一晶片模組,配置於基板上;以及一殼體,包含一頂部、連接於該頂部而圍繞該晶片模組之一外壁、以及至少一強化結構,該外壁和該至少一強化結構藉由一黏著材料而與該基板連接,其中該強化結構具有一封閉或半封閉之通孔。

    Abstract in simplified Chinese: 一种封装结构,包含:一基板;至少一芯片模块,配置于基板上;以及一壳体,包含一顶部、连接于该顶部而围绕该芯片模块之一外壁、以及至少一强化结构,该外壁和该至少一强化结构借由一黏着材料而与该基板连接,其中该强化结构具有一封闭或半封闭之通孔。

    封裝結構
    98.
    发明专利
    封裝結構 审中-公开
    封装结构

    公开(公告)号:TW201717328A

    公开(公告)日:2017-05-16

    申请号:TW104136576

    申请日:2015-11-06

    CPC classification number: H01L23/16 H01L23/04 H01L23/055 H01L23/10

    Abstract: 一種封裝結構,包含:一基板;至少一晶片模組,配置於基板上;以及一殼體,包含一頂部、連接於該頂部而圍繞該晶片模組之一外壁、以及至少一強化結構,該外壁和該至少一強化結構藉由一黏著材料而與該基板連接,其中該強化結構具有一封閉或半封閉之通孔。

    Abstract in simplified Chinese: 一种封装结构,包含:一基板;至少一芯片模块,配置于基板上;以及一壳体,包含一顶部、连接于该顶部而围绕该芯片模块之一外壁、以及至少一强化结构,该外壁和该至少一强化结构借由一黏着材料而与该基板连接,其中该强化结构具有一封闭或半封闭之通孔。

    半導體元件及其製造方法
    100.
    发明专利
    半導體元件及其製造方法 审中-公开
    半导体组件及其制造方法

    公开(公告)号:TW201644057A

    公开(公告)日:2016-12-16

    申请号:TW104119183

    申请日:2015-06-12

    Abstract: 本發明提出一種半導體元件的製造方法。半導體元件的製造方法包括:提供基板;於基板上形成半導體堆疊結構;於半導體堆疊結構上形成堆疊覆蓋層之至少一部分,其中堆疊覆蓋層之至少一部分包括氮化層;移除氮化層的一部分;完成堆疊覆蓋層之所有部分;於堆疊覆蓋層上形成保護層,並蝕刻保護層,以形成至少一開孔,其中氮化層未被開孔所曝露;以及從開孔通入一蝕刻材料,以蝕刻基板。本發明另提出一種採用上述方法形成的半導體元件。

    Abstract in simplified Chinese: 本发明提出一种半导体组件的制造方法。半导体组件的制造方法包括:提供基板;于基板上形成半导体堆栈结构;于半导体堆栈结构上形成堆栈覆盖层之至少一部分,其中堆栈覆盖层之至少一部分包括氮化层;移除氮化层的一部分;完成堆栈覆盖层之所有部分;于堆栈覆盖层上形成保护层,并蚀刻保护层,以形成至少一开孔,其中氮化层未被开孔所曝露;以及从开孔通入一蚀刻材料,以蚀刻基板。本发明另提出一种采用上述方法形成的半导体组件。

Patent Agency Ranking