Abstract:
PURPOSE: A method for manufacturing a stack semiconductor device and the stack semiconductor device manufactured by the same are provided to simplify a process step by forming a contact plug and an external wire at the same time. CONSTITUTION: At least one first transistor is arranged on a first substrate(100). A first source region and a first drain region(106) are arranged on both sides of the first transistor. A lower side of a first contact plug(1510) is contacted with the first source region and the first drain region. A second substrate(200) is arranged on a first substrate. An upper side of at least one second contact plug(1520) is connected to the external wiring. The upper side of the first contact plug and the upper side of the second substrate are positioned on the same plane. A first interlayer insulation layer(160) is positioned between the first substrate and the second substrate, and on one side of the second substrate.
Abstract:
PURPOSE: A semiconductor device, a manufacturing method thereof, and an electric device including the same are provided to minimize a loss of integration of a semiconductor device by preventing extension of a chip size due to use of an additional plug or width extension of a top common source line. CONSTITUTION: First conductive regions are positioned to a bottom semiconductor layer(100). A top semiconductor layer(200) is laminated on the bottom semiconductor layer. Second conductive regions are positioned to the top semiconductor layer. A bottom conductive line is formed under the top semiconductor layer, and is electrically connected to the first conductive regions. A top conductive line is formed on the top semiconductor layer, and is electrically connected to the second conductive regions. A first conductive plug(315D) electrically connects the bottom conductive line to the top conductive line, and passes a through hole of the top semiconductor layer.
Abstract:
PURPOSE: A stack-layered nonvolatile memory device, a method of manufacturing the same and a memory card and a system including the same are provided to form the top parts of a common source line and/or a bit line contact plug in a lower portion than the top part of a gate structure, thereby improving device reliability by preventing defects of a contact. CONSTITUTION: A stack-layered nonvolatile memory device includes a lower memory layer, lower contact units, an upper memory layer, and upper contact units. The lower memory layer(1) includes a lower active area and a plurality of lower gate structures. The upper contact units are electrically connected to the active area. Partial top parts of the upper contact units are formed in a lower portion than the top part of the upper gate structures.
Abstract:
An electrode composition for ink jet printing, and an electrode and a secondary battery using the composition are provided to improve the adhesion of an electrode component and a current collector and to enhance printing efficiency. An electrode composition for ink jet printing comprises an oxide, a conducting agent, a moisturizer, a binder having a viscosity of 1-100 cps in 1 wt% aqueous solution, and an aqueous solvent. The oxide is an electrode active material of a secondary battery.
Abstract:
반도체 소자 및 그 형성방법이 제공된다. 상기 반도체 소자는 디지털 회로 영역과 아날로그 회로 영역을 포함하는 반도체 기판, 상기 디지털 회로 영역과 상기 아날로그 회로 영역의 경계에 제공되는 소자분리막, 상기 소자분리막의 측면과 바닥면에 인접하는 도전 영역 및 상기 도전 영역과 전기적으로 연결되며 접지 전압이 인가되는 접지 패드를 포함한다. 디지털 회로 영역, 아날로그 회로 영역, 노이즈
Abstract:
본 발명은 프로세서간 통신(Inter Processor Communication: IPC) 방식을 사용하는 시스템의 프로세서간 통신 장치 및 방법에 관한 것으로, 특히 유토피아 맵퍼(UTOPIA Mapper)를 이용하여 프로세서간 통신을 수행하는 통신장치 및 방법에 관한 것이다. 이러한 본 발명은 프로세서간 통신을 수행하고 물리층 보드인 제1인접보드 정합부를 구비하는 시스템에 있어서, 프로세서간 통신 셀만을 인터페이스하는 복수개의 유토피아 포트들을 구비하고, 상기 제1인접보드 정합부와 셀들의 인터페이스를 수행하는 제2인접보드 정합부와, 소정의 프로세서간 통신 셀 입력 시 상기 프로세서간 통신 셀에 대한 해당 동작을 수행하고 프로세서간 통신 셀 발생 시 상기 프로세서간 통신 셀을 전송할 유토피아 포트에 대한 유토피아 어드레스를 상기 프로세서간 통신 셀에 삽입하여 출력하는 제어부와, 상기 유토피아 포트들에 대한 유토피아 어드레스를 구비하고, 상기 유토피아 포트를 통해 상기 프로세서간 통신 셀이 입력되면 상기 유토피아 포트에 대한 유토피아 어드레스와 함께 상기 프로세서간 통신 셀을 상기 제어부로 출력하고, 상기 제어부로부터 입력되는 프로세서간 통신 셀의 유토피아 어드레스에 해당하는 유토피아 포트를 통해 제어보드로 전송하는 유토피아 맵퍼로 이루어짐을 특징으로 한다.
Abstract:
저항 소자를 구비하는 반도체 장치 및 그 제조 방법을 제공한다. 이 저항 소자는 반도체기판의 소정영역 상부에 배치된 저항 패턴, 상기 저항 패턴을 포함하는 반도체기판 상에 배치되어 상기 저항 패턴의 양단을 노출시키는 개구부들을 구비하는 층간절연막 및 상기 개구부들을 채우면서 상기 저항 패턴의 양단에 접속하는 플러그 패턴들을 포함한다. 이때, 상기 플러그 패턴은 상기 저항 패턴과 동일한 물질로 형성된다.
Abstract:
PURPOSE: An exposure progressing method for manufacturing a semiconductor device is provided to be capable of restraining the bridge phenomenon between patterns having a micro interval with each other. CONSTITUTION: More than two multi-step exposure masks are prepared. At least one out of the multi-step exposure masks is formed as a no pattern mask and the others are formed as predetermined pattern masks. Photoresist layers are sequentially coated on a substrate by using the no pattern mask and the predetermined pattern mask. Then, an exposure process is performed on the resultant structure. Preferably, a phase transition mask is used when preparing the multi-step exposure masks. At this time, the phase transition mask has the predetermined transmittance.
Abstract:
PURPOSE: A device for controlling a non-real time traffic in an ATM(Asynchronous Transfer Mode) device is provided to monitor states of a switch queue to control a switch rate, and to perform an EPD(Early Packet Discard) when a reference value of a UBR(Unspecified Bit Rate) queue exceeds. CONSTITUTION: A receiving subscriber interface(311) stores cells received from a subscriber card and a trunk, and outputs the cells by a FIFO(First-In-First-Out) method. A switch(312) routs the cells according to header information, and outputs the cells to a transmitting subscriber interface. The transmitting subscriber interface stores the cells outputted from the switch(312), and outputs the cells by the FIFO method. An output queue monitor(315) monitors a threshold value of a transmitting FIFO of the transmitting subscriber interface. If a speed difference is over a setup threshold value, the output queue monitor(315) notifies the receiving subscriber interface(311) of that the speed difference is over the setup threshold value, and reduces a transmission data capacity by a receiver(311). If the threshold value of the transmitting FIFO is below the setup threshold value, the output queue monitor(315) transmits a signal for releasing an alarm state to the receiving subscriber interface(311).
Abstract:
PURPOSE: A subscriber matching apparatus is provided to increase system efficiency by dispersing and processing load caused to manipulate subscriber link information or state management information. CONSTITUTION: A subscriber matching apparatus comprises ATM layer processing parts(24a,24b) which make an ATM cell become an internal cell with added routing information and transfer the ATM cell to switch link matching parts(26a,26b), in case where the ATM cell is a user cell. The matching parts(26a,26b) converts the internal cell into an ATM cell to transfer the converted cell to physical layer interfaces(22a,22b), which process frame information. The matching parts(26a,26b) converts an internal cell from the processing parts(24a,24b) into a switch internal cell format to transfer the converted result to a switch network through a switch link of a switch module(10). The matching parts(26a,26b) converts a cell received through the switch link into an original format to transfer the converted result to the processing parts(24a,24b).