公开(公告)号：US20200110920A1

公开(公告)日：2020-04-09

申请号：US16575180

申请日：2019-09-18

Applicant: Apple Inc.

Inventor： Benjamin J. Pope ,  Shawn Arnold ,  Barry J. Corlett ,  Terry L. Gilton ,  Syed Husaini ,  Steven Webster ,  Scott A. Myers ,  Matthew D. Hill ,  Benjamin B. Lyon

IPC: G06K9/00 ,  G06F3/044

Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

公开(公告)号：US10423815B2

公开(公告)日：2019-09-24

申请号：US15985562

申请日：2018-05-21

Applicant: Apple Inc.

Inventor： Benjamin J. Pope ,  Shawn Arnold ,  Barry J. Corlett ,  Terry L. Gilton ,  Syed Husaini ,  Steven Webster ,  Scott A. Myers ,  Matthew D. Hill ,  Benjamin B. Lyon

IPC: G06K9/00 ,  G06F3/044

Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

公开(公告)号：US20190141171A1

公开(公告)日：2019-05-09

申请号：US16241914

申请日：2019-01-07

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Derek C. Krass ,  Benjamin Shane Bustle ,  Lucy Elizabeth Browning ,  Michael Benjamin Wittenberg ,  James B. Smith ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H04M1/02

Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

公开(公告)号：US10244659B2

公开(公告)日：2019-03-26

申请号：US15712069

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  David A. Pakula ,  David J. Dunsmoor ,  Ian A. Spraggs ,  Lee E. Hooton ,  Marwan Rammah ,  Matthew D. Hill ,  Robert F. Meyer ,  James A. Bertin ,  Eric M. Bennett ,  Simon C. Helmore ,  Melissa A. Wah ,  Jon F. Housour ,  Douglas G. Fournier ,  Christopher S. Tomasetta

IPC: H05K7/20 ,  H05K1/02 ,  G06F3/041 ,  H01M2/10 ,  H05K1/14 ,  G06F1/16 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.

公开(公告)号：US20190036201A1

公开(公告)日：2019-01-31

申请号：US16147703

申请日：2018-09-29

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Michael B. Wittenberg ,  Shane Bustle ,  Duy P. Le

IPC: H01Q1/24 ,  H04M1/02 ,  G06F1/16 ,  B29C45/14 ,  B29C37/00 ,  B29L31/34

CPC classification number: H01Q1/243 ,  B29C37/0082 ,  B29C45/14311 ,  B29C45/14467 ,  B29L2031/34 ,  B29L2031/3437 ,  G06F1/1626 ,  G06F1/1633 ,  G06F1/1656 ,  G06F2200/1633 ,  H04M1/0249 ,  H04M1/0283

Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

公开(公告)号：US20190033934A1

公开(公告)日：2019-01-31

申请号：US16152261

申请日：2018-10-04

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Ihtesham H. Chowdhury ,  Richard Hung Minh Dinh ,  Benjamin J. Pope ,  Matthew D. Hill ,  Dhaval N. Shah ,  Martin J. Auclair

IPC: G06F1/20 ,  H04M1/02 ,  H04M1/725 ,  G06F1/16 ,  G06F1/18

Abstract: An electronic device is configured to detect the presence or absence of a case that is positioned over at least one surface of the electronic device. When a case is present, the electronic device is configured to determine one or more characteristics of the case and adjust one or more operations of the electronic device based on at least one characteristic of the case.

公开(公告)号：US10000018B2

公开(公告)日：2018-06-19

申请号：US15148543

申请日：2016-05-06

Applicant: Apple Inc.

Inventor： Stefan C. Mag ,  Matthew D. Hill ,  Scott A. Myers ,  Liane J. Fang ,  Tyler B. Cater

IPC: B29C65/76 ,  B29C65/50 ,  C09J7/00 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  F16B11/00 ,  B29L31/34

CPC classification number: B29C65/76 ,  B29C65/50 ,  B29C65/5057 ,  B29L2031/3481 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/618 ,  C09J2203/326 ,  C09J2203/33 ,  C09J2421/00 ,  F16B11/006 ,  G06F1/1613 ,  H04M1/026 ,  H04M1/0262 ,  H04M1/0279 ,  H05K5/0086 ,  Y10T428/1476 ,  Y10T428/2419 ,  Y10T428/24273 ,  Y10T428/24777

Abstract: A stretch release adhesive is disclosed. The stretch release adhesive can be used for extracting an electrical component from an interior surface of a housing of a mobile computing device. The stretch release adhesive can have a double-sided adhesive body configured to adhere the component to the interior surface of the housing. A portion of the double-sided adhesive body is configured to extend out from between the electrical component and the interior surface of the housing to provide a graspable portion. When the stretch release adhesive is adhered between the electrical component and the internal surface of the housing, the stretch release adhesive can receive a pulling force at the graspable portion. If pulled with enough force, the stretch release adhesive will extend outwardly from between the electrical component and the internal surface of the mobile computing device, then completely release the electrical component from the mobile computing device.

公开(公告)号：US09972459B1

公开(公告)日：2018-05-15

申请号：US14480276

申请日：2014-09-08

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Matthew P. Rao ,  Alex M. Lee ,  Benjamin J. Pope ,  Jared M. Kole ,  Scott A. Myers ,  Stefan C. Mag

IPC: H01H13/34 ,  H01H13/10 ,  H01H13/14 ,  H01R33/955 ,  G06K9/00 ,  H01H11/00

CPC classification number: H01H13/10 ,  G06K9/00013 ,  G06K9/22 ,  H01H11/00 ,  H01H13/14 ,  H01H2207/004 ,  H01H2209/01 ,  H01H2215/004 ,  H01H2227/036 ,  H01H2239/01 ,  H01H2239/074

Abstract: A tactile switch assembly can include a tactile switch structure electrically connected to one end of a flexible circuit. The tactile switch assembly has a first length when the flexible circuit is in an unfolded state and a smaller second length when the flexible circuit is in a folded state. The flexible circuit folds over itself one or more times in the folded state. The tactile switch structure can include a stiffener positioned over a switch. The flexible circuit can extend over at least a portion of a top surface of the stiffener and wrap around the stiffener at a bend region and extend under at least a portion of a bottom surface of the stiffener. One or more component chambers can be created in openings in the stiffener that provide additional locations for one or more electrical components to be electrically connected to the flexible circuit.

公开(公告)号：US20170249048A1

公开(公告)日：2017-08-31

申请号：US15056679

申请日：2016-02-29

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Rasamy Phouthavong ,  Scott A. Myers

IPC: G06F3/041 ,  G06F1/16

CPC classification number: G06F3/0418 ,  G06F1/1626 ,  G06F1/1694 ,  G06F3/0414 ,  G06F3/044 ,  G06F3/04886 ,  G06F2203/04105

Abstract: The systems and techniques described herein generally relate to an electronic device having a touch-sensitive surface or region that is configured to receive force-based user input and dynamically adjust a force threshold used to recognize the force-based user input. In particular, the device may include one or more force sensors that are configured to detect a touch that exceeds a dynamically adjustable threshold. In some embodiments, the threshold is dynamically adjusted in response to a detected or estimated stability condition. By dynamically adjusting the threshold, the device may be better adapted or optimized for use with a particular support accessory or support configuration. In some cases, multiple sub-regions may be defined over the touch-sensitive surface, each sub-region having a different force threshold.

公开(公告)号：US09591110B2

公开(公告)日：2017-03-07

申请号：US14618744

申请日：2015-02-10

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Derek C. Krass ,  Benjamin Shane Bustle ,  Lucy Elizabeth Browning ,  Michael Benjamin Wittenberg ,  James B. Smith ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H04M1/02

CPC classification number: H04M1/0249

Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

Abstract translation: 公开了一种用于形成外壳的外壳和方法。 外壳可以由诸如铝的金属形成，并且还包括允许透射和接收电磁波的非金属部分。 非金属部分可以互锁到外壳，特别是与外壳内的区域相连，包括与非金属部分相比具有相对高的强度和刚度的第一材料。 联锁装置可以包括形成燕尾切口进入外壳以接纳非金属部分，钻入包围内部的孔或空腔，其包括内螺纹，以及插入第一材料中的杆以向非金属部分提供张力。 还公开了使用阳极氧化组装内部部件的方法。