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公开(公告)号:US12301743B2
公开(公告)日:2025-05-13
申请号:US18368534
申请日:2023-09-14
Applicant: Apple Inc.
Inventor: Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B Smith , Ashutosh Y. Shukla , Scott A. Myers
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号:US12074363B2
公开(公告)日:2024-08-27
申请号:US18109168
申请日:2023-02-13
Applicant: Apple Inc.
Inventor: Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , B29C45/14311 , B29C45/14467 , G06F1/1626 , G06F1/1633 , G06F1/1656 , H04M1/0249 , H04M1/0283 , B29C37/0082 , B29L2031/34 , B29L2031/3437 , G06F2200/1633
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号:US20230224393A1
公开(公告)日:2023-07-13
申请号:US17903937
申请日:2022-09-06
Applicant: Apple Inc.
Inventor: Kevin M. Froese , Brittany Barbara , Matthew D. Hill , James A. Bertin , Alan Wu , Justin D. Crosby , Sawyer I. Cohen
IPC: H04M1/02
CPC classification number: H04M1/0266
Abstract: A portable electronic device may include an enclosure including a housing component defining a side exterior surface of the portable electronic device, and a front cover assembly coupled to the housing component and defining a front exterior surface of the portable electronic device. The front cover assembly may include a cover defining a notch. The portable electronic device may include a speaker assembly positioned below the front cover assembly and coupled to an audio passage configured to transmit audio output from the speaker assembly, an end portion of the audio passage including a void defined between the housing component and the notch of the cover.
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公开(公告)号:US11272082B2
公开(公告)日:2022-03-08
申请号:US17023938
申请日:2020-09-17
Applicant: Apple Inc.
Inventor: Scott W. Miller , Brian A. Argyres , Lindsay M. Alanen , Matthew D. Hill , Nicholas D. Smyth , Shujun Tang
Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.
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公开(公告)号:US11132024B2
公开(公告)日:2021-09-28
申请号:US16875799
申请日:2020-05-15
Applicant: Apple Inc.
Inventor: David A. Pakula , Daniel W. Jarvis , Gregory N. Stephens , Ian A. Spraggs , James A. Bertin , Eric M. Bennett , Simon C. Helmore , Melissa A. Wah , Matthew D. Hill , Jon F. Housour , Douglas G. Fournier , Christopher S. Tomasetta
IPC: H01M10/46 , G06F1/16 , H05K9/00 , H05K1/14 , H01M50/20 , H05K7/20 , H05K1/02 , G06F3/041 , H01M50/183 , H02J7/00
Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.
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公开(公告)号:US20210168231A1
公开(公告)日:2021-06-03
申请号:US17068654
申请日:2020-10-12
Applicant: Apple Inc.
Inventor: John J. Baker , Yaocheng Zhang , Paul U. Leutheuser , Kevin M. Froese , Tushar Deshpande , Kai Wu , Marta M. Giachino , Sean Suri , Matthew D. Hill , Tyler B. Cater , Benjamin J. Pope , Jun Sik Ham
Abstract: A portable electronic device includes a housing member. The portable electronic device also includes a front cover coupled to the housing member and defining a top surface defining a portion of an exterior front surface of the portable electronic device, a bottom surface opposite the top surface, a peripheral side surface, and a chamfered edge extending from the bottom surface to the peripheral side surface. The portable electronic device further includes a display stack attached to the bottom surface of the front cover, an opaque coating positioned on at least a portion of each of the peripheral side surface, the chamfered edge, and the bottom surface and configured to absorb light emitted by the display stack, and a rear cover coupled to the housing member and defining a second portion of the exterior rear surface of the portable electronic device.
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公开(公告)号:US20210168226A1
公开(公告)日:2021-06-03
申请号:US17068619
申请日:2020-10-12
Applicant: Apple Inc.
Inventor: Bryan D. Keen , Devon A. Monaco , Sherry Lee , Ihtesham H. Chowdhury , Eric N. Nyland , Matthew D. Hill , Arun R. Varma , Lucy E. Browning , Sawyer I. Cohen , Benjamin J. Pope
Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.
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公开(公告)号:US20210168225A1
公开(公告)日:2021-06-03
申请号:US17068596
申请日:2020-10-12
Applicant: Apple Inc.
Inventor: Eric W. Bates , Xiao Ying Zhao , Luman Zhang , Christopher R. Xydis , Michael Firka , Benjamin J. Kallman , Ihtesham H. Chowdhury , Matthew D. Hill , Hugh J. Jay , Trent Canales , Lucy E. Browning
Abstract: A portable electronic device includes a front cover, a rear cover, and a housing structure between and coupled to the front cover and the rear cover. The housing structure includes a first housing member defining and a first interlock feature formed along a first end surface. The portable electronic device also includes a second housing member defining a second interlock feature formed along a second end surface. The portable electronic device also includes a nonconductive joining element engaged with the first interlock feature and the second interlock feature, thereby structurally coupling the first housing member to the second housing member.
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公开(公告)号:US10559872B2
公开(公告)日:2020-02-11
申请号:US16147703
申请日:2018-09-29
Applicant: Apple Inc.
Inventor: Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号:US20170069956A1
公开(公告)日:2017-03-09
申请号:US15233891
申请日:2016-08-10
Applicant: Apple Inc.
Inventor: Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , B29C37/0082 , B29C45/14311 , B29C45/14467 , B29L2031/34 , B29L2031/3437 , G06F1/1626 , G06F1/1633 , G06F1/1656 , G06F2200/1633 , H04M1/0249 , H04M1/0283
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括第一部件和第二部件,第一部件和第二部件通过间隙与第一部件分离。 壳体还包括第一模制元件,其至少部分地设置在间隙内并且限定互锁特征的至少一部分,以及至少部分地设置在间隙内并机械地接合互锁特征的第二模制元件。 第一部件,第二部件和第二模制部件形成壳体的外表面的一部分。 还公开了一种形成壳体的方法。
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