Housing features of an electronic device

    公开(公告)号:US12301743B2

    公开(公告)日:2025-05-13

    申请号:US18368534

    申请日:2023-09-14

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

    HANDHELD ELECTRONIC DEVICE
    3.
    发明公开

    公开(公告)号:US20230224393A1

    公开(公告)日:2023-07-13

    申请号:US17903937

    申请日:2022-09-06

    Applicant: Apple Inc.

    CPC classification number: H04M1/0266

    Abstract: A portable electronic device may include an enclosure including a housing component defining a side exterior surface of the portable electronic device, and a front cover assembly coupled to the housing component and defining a front exterior surface of the portable electronic device. The front cover assembly may include a cover defining a notch. The portable electronic device may include a speaker assembly positioned below the front cover assembly and coupled to an audio passage configured to transmit audio output from the speaker assembly, an end portion of the audio passage including a void defined between the housing component and the notch of the cover.

    HANDHELD ELECTRONIC DEVICE
    6.
    发明申请

    公开(公告)号:US20210168231A1

    公开(公告)日:2021-06-03

    申请号:US17068654

    申请日:2020-10-12

    Applicant: Apple Inc.

    Abstract: A portable electronic device includes a housing member. The portable electronic device also includes a front cover coupled to the housing member and defining a top surface defining a portion of an exterior front surface of the portable electronic device, a bottom surface opposite the top surface, a peripheral side surface, and a chamfered edge extending from the bottom surface to the peripheral side surface. The portable electronic device further includes a display stack attached to the bottom surface of the front cover, an opaque coating positioned on at least a portion of each of the peripheral side surface, the chamfered edge, and the bottom surface and configured to absorb light emitted by the display stack, and a rear cover coupled to the housing member and defining a second portion of the exterior rear surface of the portable electronic device.

    HANDHELD ELECTRONIC DEVICE
    7.
    发明申请

    公开(公告)号:US20210168226A1

    公开(公告)日:2021-06-03

    申请号:US17068619

    申请日:2020-10-12

    Applicant: Apple Inc.

    Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

    Coupling structures for electronic device housings

    公开(公告)号:US10559872B2

    公开(公告)日:2020-02-11

    申请号:US16147703

    申请日:2018-09-29

    Applicant: Apple Inc.

    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

    COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS
    10.
    发明申请
    COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS 审中-公开
    电子设备外壳的联结结构

    公开(公告)号:US20170069956A1

    公开(公告)日:2017-03-09

    申请号:US15233891

    申请日:2016-08-10

    Applicant: Apple Inc.

    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

    Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括第一部件和第二部件,第一部件和第二部件通过间隙与第一部件分离。 壳体还包括第一模制元件,其至少部分地设置在间隙内并且限定互锁特征的至少一部分,以及至少部分地设置在间隙内并机械地接合互锁特征的第二模制元件。 第一部件,第二部件和第二模制部件形成壳体的外表面的一部分。 还公开了一种形成壳体的方法。

Patent Agency Ranking