Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition in which preservation stability and hardening by low temperature firing of a short time period are both achieved and which has sufficient sensitivity; and a cured film excellent in heat resistance, transmittance, and voltage retaining ratio.SOLUTION: The radiation sensitive resin composition contains [A] a polymer having a structural unit comprising an epoxy group, [B] a polymeric compound including an ethylenically unsaturated bond, [C] a radiation-sensitive polymerization initiator, and [D] a compound including a cyanate group. Preferably, the [A] polymer further includes a structural unit comprising a carboxyl group.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which simultaneously achieves low temperature calcination and storage stability and has high radiation sensitivity, and to provide a cured film as an interlayer dielectric film, a protection film or a spacer, which is suitable for flexible display applications and is excellent in surface hardness, solvent resistance and dielectric constant.SOLUTION: A radiation-sensitive resin composition comprises: [A] an alkali-soluble resin obtained by copolymerizing (A1)at least one monomer selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride with (A2) an epoxy group-containing unsaturated compound; [B] a quinonediazide compound; and [C] at least one curing agent selected from the group consisting of a benzene compound having an electron-attracting group and an amino group, a compound containing two benzene rings having an electron-attracting group and an amino group, a tertiary amino compound, an amine salt, a phosphonium salt, an amidine salt, an amide compound, a ketimine compound, a block isocyanate compound, an imidazole ring-containing compound and a clathrate compound.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition simultaneously achieving storage stability and low temperature calcination with sufficient sensitivity; a cured film as an interlayer insulating film, a protective film, or a spacer, excellent in solvent resistance, relative dielectric constant and hardness; a method for forming the cured film; a color filter excellent in heat resistance, solvent resistance, voltage holding ratio, or the like; and a method for forming the color filter.SOLUTION: A radiation-sensitive resin composition of the present invention contains an alkali-soluble resin [A] obtained by copolymerizing at least one compound (A1) selected from a group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride and a hydroxyl group-containing unsaturated compound (A2), a polymerizable compound [B] having an ethylenically unsaturated bond, a radiation-sensitive polymerization initiator [C], and a blocked isocyanate compound [D].
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition (with sufficient radiation sensitivity and developability) which can easily form a microscopic and sophisticated pattern, and satisfies both storage stability and short-time low-temperature firing, and to provide a cured film excellent in required characteristics such as heat resistance and compression characteristics as well as to provide a method of forming the cured film.SOLUTION: The invention includes: [A] an alkali-soluble resin formed by copolymerizing monomers containing (A1) multiple kinds selected from a set composed of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides and (A2) an epoxy group-containing unsaturated compound; [B] a polymerizable compound with ethylenically unsaturated bonds; [C] a radiation-sensitive polymerization initiator; and [D] a radiation-sensitive resin composition containing a compound represented by the following formula (1).
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition for forming a cured film, which achieves both of storage stability and low temperature baking property and has sufficient sensitivity to radiation, to provide a cured film excellent in heat resistance, chemical resistance, transmittance, flatness and resistance against linear thermal expansion, and to provide a display element excellent in a voltage retention rate.SOLUTION: The radiation-sensitive resin composition for forming a cured film contains: [A] a copolymer having (a1) a structural unit containing a carboxyl group and (a2) a structural unit containing an epoxy group; [B] a polymerizable compound having an ethylenically unsaturated bond; [C] a radiation-sensitive polymerization initiator; [D] a compound having a hydroxyl group or a carboxyl group; and [E] an amine compound. The composition shows a viscosity of 1.0 mPa s or more and 50 mPa s or less at 25°C.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which can be heated and sintered at a low temperature and in a short time and has a high sensitivity with respect to radiation and the curing film obtained from which has a heat resistance, transparency and solvent resistance, is therefore suitably used for forming a spacer, a protection film, and an interlayer dielectric film of a flexible display and is excellent in terms of storage stability.SOLUTION: A radiation-sensitive resin composition includes (A) a compound containing epoxy groups, (B) a polymer compound having ethylenic unsaturated bonds, (C) a radiation-sensitive polymerization initiator and (D) at least one substance selected from the group of ketimine and aldimine.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which can be suitably used for forming a spacer, protection film and interlayer dielectric, etc. of a flexible display which are capable of rapid and low-temperature heating and calcination, and have a high radiation sensitivity and a low linear thermal expansion coefficient.SOLUTION: This radiation-sensitive resin composition for display elements includes; (A)a copolymer which has (a1) a structure unit containing a carboxyl group and (a2) a structure unit containing an epoxy group; (B) a polymerizable compound having an ethylenically unsaturated bond; (C) a radiation-sensitive polymerization initiator; and (D) at least either one selected from compounds represented by formulas (1) and (2).
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has high radiation sensitivity and can be baked by heating at a low temperature in a short period of time so that it is suitably used in the formation of an interlayer insulating film of a flexible display. SOLUTION: The radiation-sensitive resin composition for forming an interlayer insulating film contains [A] an alkali-soluble resin of a copolymer formed by copolymerizing a monomer containing (a1) unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, and (a2) an epoxy group-containing unsaturated compound, [B] a 1,2-quinonediazide compound, and [C] a compound including two or more mercapto groups in one molecule. The compound including two or more mercapto groups in one molecule as the component [C] is preferably a compound represented by formula (1), wherein R 1 is methylene, 2-10C alkylene or alkylmethylene; Y is a single bond, -CO- or -O-CO-* (provided that a bond to which "*" is attached bonds to R 1 ); n is an integer of 2-10; and X is a 2-70C n-valent hydrocarbon group which may have one or more ether bonds, or in the case of n=3, X is a group represented by formula (2), wherein three symbols R 2 are each independently methylene or 2-6C alkylene; and three marks "*" are each a bond. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition which can be heated and baked at low-temperature and in a short-time, has high radiation sensitivity and is suitably used for forming an interlayer dielectric of a flexible display; and to also provide a positive radiation sensitive resin composition excellent in relative dielectric constant, solvent resistance, film hardness, resolution in patterning and electrical properties. SOLUTION: The positive radiation sensitive resin composition comprises: [A] a polymer selected from the group consisting of a polyamic acid obtained by reacting a tetracarboxylic acid dianhydride with a diamine compound and a polyimide obtained by dehydration ring closure of the polyamic acid; [B] a 1,2-quinonediazide compound; and [C] a compound having at least one epoxy group in the molecule thereof. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of precisely coating it on a substrate having a step difference of a metal wiring and of forming a shield film having superior corrosion resistance while maintaining high photoelectric conversion efficiency, and furthermore, of forming the shield film at a reduced cost only by a comparatively easy process of a coating process and a heating process, and to provide an electrode for a dye-sensitized solar cell superior in the photoelectric conversion efficiency which is equipped with this shield film having this corrosion resistance. SOLUTION: The electrode for the dye-sensitized solar cell is equipped with the shield film composed of a cured material of the resin composition. The resin composition contains a co-polymer having at least one kind of reactive functional group selected from a group consisting of [A] a carboxyl group, an epoxy group, and a (meth)acryloyl group. COPYRIGHT: (C)2011,JPO&INPIT