Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive dry film having excellent storage stability after a dry film is formed, from which a microlens satisfying various characteristics even at a low heating temperature is formed. SOLUTION: The radiation-sensitive dry film includes: a base film; a radiation-sensitive resin composition layer layered on the base film and containing (A) an alkali-soluble polymer, (B) a polymerizable unsaturated compound, (C) a photo-polymerization initiator and (D) a compound having an oxiranyl group, an episulfide group or an oxetanyl group; and a cover film layered on the radiation-sensitive resin composition layer. The film contains, as the (A) alkali-soluble polymer, a copolymer of (a1) a polymerizable unsaturated compound having an acidic functional group and (a2) a polymerizable unsaturated compound comprising a specified compound represented by S-(tetrahydropyran-2-yl) thiomethacrylate. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition with excellent storage stability, with which a microlens can be formed which is excellent in film thickness, resolution, pattern configuration, thermostability, transparency, heat discoloration resistance, resistance to solvents or the like, even when lower temperature firing is adopted. SOLUTION: The radiation-sensitive resin composition comprises: an alkali-soluble copolymer (A); a polymerizable unsaturated compound (B); a photoradical generator (C); a compound (D) that has two or more oxetanyl groups in a molecule, except the alkali-soluble copolymer that has the oxetanyl group; and an acid generator (E), wherein the alkali-soluble copolymer (A) contains a copolymer (A1) containing: a polymerizable unsaturated compound (a1) that has an acidic functional group; an N-substituted maleimide (a2); and other polymerizable unsaturated compounds (a3) different from the (a1) and (a2). COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a dry film which is useful for pattern formation of a radiation-sensitive resin composition layer, which requires high-accuracy fine working, and which gives a radiation-sensitive resin composition layer excellent in surface smoothness and resolution. SOLUTION: The dry film 1 includes a base film 2 of 10-50 μm thickness with a surface having a three-dimensional ten-point average roughness SRz of ≤2.2 μm and a three-dimensional maximum height SRmax of 4.0 μm, a radiation-sensitive resin composition layer 3 of 2-200 μm thickness stacked on the surface of the base film 2, and a cover film 4 to cover the radiation-sensitive resin composition layer 3. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a dry film resist in which even if a radiation-sensitive resin composition has inferior tackiness after drying, adhesion between the radiation-sensitive resin composition and a cover film is good because of the adhesive power of the cover film, and the cover film can easily be peeled. SOLUTION: The dry film is obtained by stacking a laminated film having a radiation-sensitive resin composition layer of 2-200 μm thickness on a base film and a cover film having a self-adhesive resin layer on a film in such a way that the radiation-sensitive resin composition layer and the self-adhesive resin layer come in direct contact with each other. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having excellent sensitivity and developing solution resistance, from which an interlayer insulating film excellent in solvent resistance, heat resistance and transparency can be formed, and to provide an interlayer insulating film formed of the radiation-sensitive resin composition and a method for forming the interlayer insulating film.SOLUTION: The radiation-sensitive resin composition contains: [A] an alkali-soluble resin having a carboxyl group; [B] a quinone diazide compound; and [C] a copolymer prepared by copolymerizing an epoxy group-containing unsaturated compound with at least one kind of unsaturated compound selected from the group consisting of an alkyl ester of (meth)acrylic acid, a fluorinated alkyl ester of (meth)acrylic acid and a (meth)acrylic acid ester having a siloxane structure.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has high radiation sensitivity and can be baked by heating at a low temperature in a short period of time so that it is suitably used in the formation of an interlayer insulating film of a flexible display. SOLUTION: The radiation-sensitive resin composition for forming an interlayer insulating film contains [A] an alkali-soluble resin of a copolymer formed by copolymerizing a monomer containing (a1) unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, and (a2) an epoxy group-containing unsaturated compound, [B] a 1,2-quinonediazide compound, and [C] a compound including two or more mercapto groups in one molecule. The compound including two or more mercapto groups in one molecule as the component [C] is preferably a compound represented by formula (1), wherein R 1 is methylene, 2-10C alkylene or alkylmethylene; Y is a single bond, -CO- or -O-CO-* (provided that a bond to which "*" is attached bonds to R 1 ); n is an integer of 2-10; and X is a 2-70C n-valent hydrocarbon group which may have one or more ether bonds, or in the case of n=3, X is a group represented by formula (2), wherein three symbols R 2 are each independently methylene or 2-6C alkylene; and three marks "*" are each a bond. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive dry film having controlled melt flow properties. SOLUTION: The dry film comprises a base film, a radiation-sensitive resin composition layer of 2-200 μm thickness stacked on the base film, and a cover film stacked on the radiation-sensitive resin composition layer, wherein the radiation-sensitive resin composition layer contains (A) an alkali-soluble copolymer, (B) a polymerizable unsaturated compound, (C) a photopolymerization initiator, and (D) a chain transfer agent. COPYRIGHT: (C)2009,JPO&INPIT