公开(公告)号：US20060202385A1

公开(公告)日：2006-09-14

申请号：US10505035

申请日：2003-11-10

Applicant: Yuan Xu ,  Chee Lim ,  Pei Ying Tan

Inventor： Yuan Xu ,  Chee Lim ,  Pei Ying Tan

IPC: B29C33/40

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0046 ,  A61M2037/0053 ,  B29C33/3878 ,  B29C33/42 ,  B29C45/00 ,  B29C2045/0094 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C2201/034

Abstract: A master mould is made by wire cutting a plate in two or more directions to provide a base with an array of master mould needles protruding therefrom. The size and shape of the master mould needles can readily be varied by varying the angles of upward and downward cuts in the two or more directions. The master mould is used to make a secondary mould by hot embossing a secondary mould plate onto the master mould. This forms through-holes in the secondary mould. The secondary mould is plated with a layer of metal, which forms a microneedle array.

公开(公告)号：US20060015061A1

公开(公告)日：2006-01-19

申请号：US10994105

申请日：2004-11-19

Applicant: Shih-Chi Kuo ,  Yu-Kon Chou

Inventor： Shih-Chi Kuo ,  Yu-Kon Chou

IPC: A61B17/20

CPC classification number: B81C1/00111 ,  A61B17/205 ,  A61M37/0015 ,  A61M2037/0053 ,  B81B2201/055 ,  Y10T29/302 ,  Y10T29/304 ,  Y10T29/308 ,  Y10T29/49982

Abstract: A microneedle array device and its fabrication method are provided. The microneedle array device comprises a supporting pad and plural of microneedles. Each microneedle has a top portion with a via thereon, thereby the microfluid may flow in or out. The intersection between the top portion and the inner tube of a microneedle forms a convex needle structure, and is almost perpendicular to the upper surface. For each microneedle, a hollow closed tube is formed between the top portion and the supporting pad. The fabrication method uses the substrates with high transmittance and plural of convex area thereon as the upper and lower caps, and applies a photolithography process to fabricate a microneedle array mold. It then sputters or electroplates metal material on the mold. The microneedle array is formed after having taken off the mold. It is a simple fabrication process.

Abstract translation: 提供了一种微针阵列器件及其制造方法。 微针阵列装置包括支撑垫和多个微针。 每个微针具有顶部，其上具有通孔，从而微流体可以流入或流出。 微针的顶部和内管之间的交点形成凸针结构，并且几乎垂直于上表面。 对于每个微针，在顶部和支撑垫之间形成中空封闭的管。 该制造方法使用具有高透射率和多个凸起区域的基板作为上盖和下盖，并且应用光刻工艺来制造微针阵列模具。 然后将模具上的金属材料溅射或电镀。 在脱模后形成微针阵列。 这是一个简单的制作过程。

公开(公告)号：US20040260251A1

公开(公告)日：2004-12-23

申请号：US10462628

申请日：2003-06-17

Applicant: Industrial Technology Research Institute

Inventor： Kai-Cheng Chang ,  Guang-Chyeng Fan

IPC: A61M005/32

CPC classification number: B81C1/00111 ,  A61M37/00 ,  A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  B81B2201/055

Abstract: The present invention is related to a flexible substrate structure for microneedle arrays and its manufacturing method, whose structure mainly comprising: tapered shape objects and flexible substrate. Wherein, structure of the tapered shape object is composed of a tip, sidewalls, and a base. Meanwhile, the flexible substrate winds tightly around sidewalls of tapered shape objects and is set up on, yet covers the base surface of tapered shape object which faces the tip of tapered shape object. Because the structure applies a flexible substrate along with tapered shape objects, hence, the fit-to-body capability is increased and allows thereof more appropriate for backside drug delivery, as well as sufficiently bring the characteristic of large-area manufacturing into full play.

Abstract translation: 本发明涉及一种用于微针阵列的柔性衬底结构及其制造方法，其结构主要包括：锥形形状物体和柔性衬底。 其中，锥形物体的结构由尖端，侧壁和基部构成。 同时，柔性基板紧紧地卷绕在锥形形状物体的侧壁周围，并且被设置在其上，同时覆盖面对锥形物体的尖端的锥形物体的基面。 由于该结构与锥形物体一起应用柔性基板，因此，适合身体的能力增加，并且允许其适合于背侧药物递送，并且充分地充分发挥了大面积制造的特征。

公开(公告)号：US06790372B2

公开(公告)日：2004-09-14

申请号：US10162848

申请日：2002-06-05

Applicant: Shuvo Roy ,  Aaron J. Fleischman

Inventor： Shuvo Roy ,  Aaron J. Fleischman

IPC: B61C100

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0038 ,  A61M2037/0053 ,  B81B2201/055

Abstract: A microneedle array module is disclosed comprising a multiplicity of microneedles affixed to and protruding outwardly from a front surface of a substrate to form the array, each microneedle of the array having a hollow section which extends through its center to an opening in the tip thereof. A method of fabricating the microneedle array module is also disclosed comprising the steps of: providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses; patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of the array; patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of the array; etching unmasked portions of the substrate from one and the other surfaces to first and second predetermined depths, respectively; and removing the mask layers from the one and the other surfaces. One embodiment of the method includes the steps of: providing an etch resistant mask layer to the other surface of the substrate to a predetermined thickness; patterning the etch resistant mask layer of the other surface to define a reservoir region in the substrate; and etching away the unmasked reservoir region of the substrate to form a reservoir well in the other surface of the substrate. A layer of material may be provided to the other surface to enclose the reservoir well and a passageway is provided through the layer to the well region.

公开(公告)号：US06767341B2

公开(公告)日：2004-07-27

申请号：US09880377

申请日：2001-06-13

Applicant: Steve T. Cho

Inventor： Steve T. Cho

IPC: A61M532

CPC classification number: B81C1/00111 ,  A61B5/14514 ,  A61B5/150022 ,  A61B5/150221 ,  A61B5/150282 ,  A61B5/150748 ,  A61B5/15087 ,  A61B5/150969 ,  A61B5/150984 ,  A61B5/157 ,  A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0038 ,  A61M2037/0053 ,  B81B2201/055

Abstract: The present invention provides a microneedle incorporating a base that is broad relative to a height of the microneedle, to minimize breakage. The microneedle further includes a fluid channel and a beveled non-coring tip. Preferably arrays of such microneedles are fabricated utilizing conventional semiconductor derived micro-scale fabrication techniques. A dot pattern mask is formed on an upper surface of a silicon substrate, with each orifice of the dot pattern mask corresponding to a desired location of a microneedle. Orifices are formed that pass completely through the substrate by etching. A nitride pattern mask is formed to mask all areas in which a nitride layer is not desired. A nitride layer is then deposited on the bottom of the silicon substrate, on the walls of the orifice, and on the top of the silicon substrate around the periphery of the orifice. The nitride layer around the periphery of the orifice is offset somewhat, such that one side of the orifice has a larger nitride layer. Anisotropic etching is used to remove a substantial portion of the substrate, creating a plurality of angular, blunt, and generally pyramidal-shaped microneedles. A subsequent removal of the nitride layer, followed by an isotropic etching step, softens and rounds out the blunt angular microneedles, providing generally conical-shaped microneedles. The uneven nitride layer adjacent the orifice ensures that the microneedles will include a beveled tip. Such microneedle arrays are preferably incorporated into handheld diagnostic and drug delivery systems.

公开(公告)号：US20040126707A1

公开(公告)日：2004-07-01

申请号：US10329449

申请日：2002-12-27

Applicant: Industrial Technology Research Institute

Inventor： Ming-Yueh Liu ,  Heng-Chun Huang ,  Jauh-Jung Yang ,  Kun-Chih Pan

IPC: G03F007/00

CPC classification number: B81C1/00111 ,  A61B5/14514 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150984 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055

Abstract: A method for manufacturing a 3-D high aspect-ratio microneedle array device, comprising steps of: providing a substrate, with a photoresist layer coated thereon; performing photolithography on the photoresist layer by using a gray-tone mask so as to form a patterned photoresist layer; performing high-selectivity etching on the patterned photoresist layer and the substrate by using inductively coupled plasma etching so as to transfer the pattern onto the substrate and form a structure; applying a material on the structure; and de-molding the structure from the substrate.

Abstract translation: 一种制造3-D高宽比微针阵列器件的方法，包括以下步骤：提供衬底，其上涂覆有光致抗蚀剂层; 通过使用灰色调掩模对光致抗蚀剂层进行光刻，以形成图案化的光致抗蚀剂层; 通过使用电感耦合等离子体蚀刻对图案化的光致抗蚀剂层和衬底进行高选择性蚀刻，以将图案转移到衬底上并形成结构; 在结构上施加材料; 以及从所述基底上去除所述结构。

公开(公告)号：US06565532B1

公开(公告)日：2003-05-20

申请号：US09614321

申请日：2000-07-12

Applicant: Vadim Vladimirovich Yuzhakov ,  Vladimir Gartstein ,  Grover David Owens

Inventor： Vadim Vladimirovich Yuzhakov ,  Vladimir Gartstein ,  Grover David Owens

IPC: A61M3700

CPC classification number: B81C99/0085 ,  A45D34/04 ,  A45D2200/1018 ,  A45D2200/1045 ,  A61M37/0015 ,  A61M37/0076 ,  A61M2037/003 ,  A61M2037/0053 ,  A61N1/30 ,  B29C51/00 ,  B81B2201/055

Abstract: An array of microneedles is provided to apply semi-permanent or permanent markings to skin, or to apply semi-permanent subcutaneous makeup or other cosmetic compounds to skin. The microneedles can apply identifications or other tattoo-like graphics, and will not enter into the dermal layer of the skin so that the application procedure is painless. The microneedle array is also useful for delivering specific compounds or actives into the skin, such as cosmetic compounds or nutrients, or various skin structure modifiers that can be delivered subcutaneously without having to visit a cosmetic surgery clinic.

Abstract translation: 提供一系列微针，以将半永久性或永久性标记施用于皮肤，或将半永久性皮下化妆或其他化妆品化合物施用于皮肤。 微针可以应用标识或其他纹身图形，并且不会进入皮肤的真皮层，使得应用程序是无痛的。 微针阵列还可用于将特定的化合物或活性物质递送到皮肤中，例如化妆品化合物或营养物，或可以皮下递送而不必访问整容手术诊所的各种皮肤结构修饰剂。

公开(公告)号：US20020155737A1

公开(公告)日：2002-10-24

申请号：US10162848

申请日：2002-06-05

Applicant: The Cleveland Clinic Foundation

Inventor： Shuvo Roy ,  Aaron J. Fleischman

IPC: H01R012/00

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0038 ,  A61M2037/0053 ,  B81B2201/055

Abstract: A microneedle array module is disclosed comprising a multiplicity of microneedles affixed to and protruding outwardly from a front surface of a substrate to form the array, each microneedle of the array having a hollow section which extends through its center to an opening in the tip thereof. The substrate includes an array of holes which align with the hollow sections of the microneedles and extend through the substrate to a back surface thereof, whereby a liquid applied to the back surface of the substrate may be forced through the holes in the substrate and out through the tips of the microneedle array thereof. In one embodiment, the substrate includes a reservoir well in the back surface thereof. The well extends over the array of holes in the back surface and may be covered by a layer of material which is affixed to the back surface peripheral the well, the layer including an interconnecting passageway to the well. A method of fabricating the microneedle array module is also disclosed comprising the steps of: providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses; patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of the array; patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of the array; etching unmasked portions of the substrate from one and the other surfaces to first and second predetermined depths, respectively; and removing the mask layers from the one and the other surfaces. One embodiment of the method includes the steps of: providing an etch resistant mask layer to the other surface of the substrate to a predetermined thickness; patterning the etch resistant mask layer of the other surface to define a reservoir region in the substrate; and etching away the unmasked reservoir region of the substrate to form a reservoir well in the other surface of the substrate. A layer of material may be provided to the other surface to enclose the reservoir well and a passageway is provided through the layer to the well region.

公开(公告)号：US06451240B1

公开(公告)日：2002-09-17

申请号：US09579798

申请日：2000-05-26

Applicant: Faiz Feisal Sherman ,  Vadim Vladimirovich Yuzhakov ,  Vladimir Gartstein ,  Grover David Owens

Inventor： Faiz Feisal Sherman ,  Vadim Vladimirovich Yuzhakov ,  Vladimir Gartstein ,  Grover David Owens

IPC: B26F124

CPC classification number: B29C51/082 ,  A61M37/00 ,  A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0053 ,  B26F1/24 ,  B29C33/0033 ,  B29C33/42 ,  B29C37/0053 ,  B29C45/2628 ,  B29C51/00 ,  B29C2059/023 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/036

Abstract: A microneedle array is manufactured using a mold preparation procedure that begins by placing an optical mask over a layer of PMMA material, exposing the PMMA material to x-rays, then developing using a photoresist process. The remaining PMMA material is then electroplated with metal. Once the metal has reached an appropriate thickness, it is detached to become a metal mold that is used in a microembossing procedure, in which the metal mold is pressed against a heated layer of plastic material. Once the mold is pressed down to its proper distance, the plastic material is cooled until solidified, and the mold is then detached, thereby leaving behind an array of microneedles.

Abstract translation: 使用模具制备程序制造微针阵列，其通过在PMMA材料层上放置光学掩模开始，将PMMA材料暴露于x射线，然后使用光致抗蚀剂工艺显影。 然后将剩余的PMMA材料用金属电镀。 一旦金属达到适当的厚度，就将其分离成为用于微压制程序的金属模具，其中金属模具被压在加热的塑料材料层上。 一旦将模具按压到适当的距离，塑料材料被冷却直到固化，然后将模具分离，从而留下一组微针。

公开(公告)号：EP1985579B1

公开(公告)日：2018-01-10

申请号：EP08154893.5

申请日：2008-04-21

Applicant: IMEC VZW ,  Katholieke Universiteit Leuven ,  Albert-Ludwigs-Universität Freiburg

Inventor： Aarts, Arno ,  Neves, Hercules Pereira ,  Van Hoof, Chris ,  Beyne, Eric ,  Puers, Robert ,  Ruther, Patrick

IPC: B81C3/00 ,  A61N1/05 ,  A61B5/04 ,  A61B5/0478

CPC classification number: B81C3/008 ,  A61B5/04001 ,  A61B5/0478 ,  A61B2562/125 ,  A61N1/0529 ,  A61N1/0531 ,  B81B2201/055 ,  Y10T29/49222

Abstract: In the present invention a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Also connections to external circuitry can be realised. Also microfluidic channels (10) in the microstructures (20) can be connected to external equipment. Also a method to fabricate and assemble the device is provided.