STRAIN MEASUREMENT OF ROTATING COMPONENTS
    91.
    发明申请
    STRAIN MEASUREMENT OF ROTATING COMPONENTS 审中-公开
    旋转组件的应变测量

    公开(公告)号:WO2010060518A3

    公开(公告)日:2010-08-05

    申请号:PCT/EP2009007719

    申请日:2009-10-28

    CPC classification number: G01L3/045 G01L1/103

    Abstract: A strain sensor apparatus (40) for a rotatable shaft (34) comprising a radiation emitter/receiver (42), a vibration element (44, 60) attached to the shaft (34) and a radiation-reflective annulus (46) surrounding the shaft and vibration element.

    Abstract translation: 一种用于可旋转轴(34)的应变传感器装置(40),所述可旋转轴包括辐射发射器/接收器(42),附接到所述轴(34)的振动元件(44,60)和围绕所述轴 轴和振动元件。

    TORQUE MEASUREMENT
    92.
    发明申请
    TORQUE MEASUREMENT 审中-公开
    扭矩测量

    公开(公告)号:WO2010060517A1

    公开(公告)日:2010-06-03

    申请号:PCT/EP2009/007709

    申请日:2009-10-28

    CPC classification number: G01L3/08 G01L1/103 G01L3/045

    Abstract: A strain sensor apparatus (40) for a rotatable shaft (34) comprising a radiation emitter/receiver (42), a vibration element (44, 60) attached to the shaft (34) and a reflector (56a, 56b, 62) that is positioned to reflect radiation onto the vibration element (44a, 44b, 66).

    Abstract translation: 一种用于可旋转轴(34)的应变传感器装置(40),包括辐射发射器/接收器(42),附接到轴(34)的振动元件(44,60)和反射器(56a,56b,62) 被定位成将辐射反射到振动元件(44a,44b,66)上。

    DEVICE FOR IMPROVED RESPONSE WHEN MEASURING VIBRATION FREQUENCY OF A VIBRATING OBJECT
    93.
    发明申请
    DEVICE FOR IMPROVED RESPONSE WHEN MEASURING VIBRATION FREQUENCY OF A VIBRATING OBJECT 审中-公开
    测量振动对象的振动频率时改进响应的装置

    公开(公告)号:WO2009102242A1

    公开(公告)日:2009-08-20

    申请号:PCT/SE2008/000679

    申请日:2008-12-03

    Inventor: TYREN, Carl

    CPC classification number: G01L9/0014 G01H9/00 G01L1/103 G01L3/045

    Abstract: A device for measuring a vibration frequency of a mechanically vibrating string (11) or rod (41), comprising a microwave transmitter (14) for directing microwaves towards the vibrating string and a microwave receiver (17) for receiving the microwaves amplitude modulated by the frequency of mechanical vibration. A member (18) is arranged close to a vibration maximum of the vibrating string. The member is arranged on one side of the vibrating object and the microwave receiver is arranged on the other side thereof. The device is used for measuring temperature, pressure, torque, force or identity.

    Abstract translation: 一种用于测量机械振弦(11)或杆(41)的振动频率的装置,包括用于将微波引导到振动弦的微波发射器(14)和用于接收由所述振荡器调制的振幅的微波接收器(17) 机械振动频率。 构件(18)被布置成接近于振动弦的振动最大值。 该构件设置在振动对象的一侧,微波接收器设置在其另一侧。 该装置用于测量温度,压力,扭矩,力或身份。

    HIGH TEMPERATURE RESONANT INTEGRATED MICROSTRUCTURE SENSOR
    94.
    发明申请
    HIGH TEMPERATURE RESONANT INTEGRATED MICROSTRUCTURE SENSOR 审中-公开
    高温共振微结构传感器

    公开(公告)号:WO99034186A1

    公开(公告)日:1999-07-08

    申请号:PCT/US1998/025932

    申请日:1998-12-07

    CPC classification number: G01P15/097 G01L1/103 G01L1/186 G01L9/0011 G01L9/002

    Abstract: A very high temperature microbeam sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperatures up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside the very or ultra high temperature sensing environment, and then using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.

    Abstract translation: 具有静电束驱动器和用于来自光束的感测光的光纤拾取器的谐振集成微结构的非常高温的微束传感器。 高温传感器没有易受温度高达600摄氏度影响的组件。用于检测,处理和驱动的相关组件远离传感器环境。 通过在梁组件中使用不同的材料,例如用于梁的钨,以及用于衬底和壳的蓝宝石,传感器可以承受高达1000摄氏度的温度。此外,光纤可用于处理电子器件之间的长距离连接 以及感测装置中的驱动器,通过将光电检测器定位在非常或超高温感测环境之外,然后使用光纤将长距离信号从处理器发送到驱动器光电检测器,以消除电信号 - 噪音问题。

    IMPROVED FIBER OPTIC REMOTE SENSOR
    95.
    发明申请
    IMPROVED FIBER OPTIC REMOTE SENSOR 审中-公开
    改进的光纤远程传感器

    公开(公告)号:WO1985005178A1

    公开(公告)日:1985-11-21

    申请号:PCT/US1985000808

    申请日:1985-05-03

    Abstract: An optically driven, electromagnetically oscillating resonant sensor subjected to a stress force wherein the optical driving energy and the optically communicated signal generated in response to the stress force are both communicated a substantial distance along a single optical fiber (14). A portion of the supply energy (19) drives the oscillatory mechanism (20) and a portion is reflected to a frequency detector (18) by the shuttering action of the resonant element. The device may be configured so as to be electrically driven and optically sensed, optically driven and electrically sensed, or both optically driven and optically sensed for maximum retrofit versatility in past, present, and future process control systems.

    Abstract translation: 经受应力的光驱动的电磁振荡谐振传感器,其中响应于应力的力产生的光学驱动能量和光通信信号都沿着单根光纤(14)传送相当长的距离。 供应能量(19)的一部分通过谐振元件的快门动作驱动振荡机构(20)并且一部分被反射到频率检测器(18)。 该器件可以被配置为电过驱动和光学感测,光学驱动和电感测,或者被光学驱动和光学感测,以便在过去,现在和未来的过程控制系统中实现最大的改进的多功能性。

    STRAIN MEASUREMENT OF ROTATING COMPONENTS
    96.
    发明公开
    STRAIN MEASUREMENT OF ROTATING COMPONENTS 有权
    旋转组件的应变测量

    公开(公告)号:EP2350593A2

    公开(公告)日:2011-08-03

    申请号:EP09744967.2

    申请日:2009-10-28

    CPC classification number: G01L3/045 G01L1/103

    Abstract: A strain sensor apparatus (40) for a rotatable shaft (34) comprising a radiation emitter/receiver (42), a vibration element (44, 60) attached to the shaft (34) and a radiation-reflective annulus (46) surrounding the shaft and vibration element.

    Abstract translation: 一种用于可旋转轴(34)的应变传感器装置(40),所述可旋转轴包括辐射发射器/接收器(42),附接到所述轴(34)的振动元件(44,60)和围绕所述轴 轴和振动元件。

    HIGH TEMPERATURE RESONANT INTEGRATED MICROSTRUCTURE SENSOR
    97.
    发明授权
    HIGH TEMPERATURE RESONANT INTEGRATED MICROSTRUCTURE SENSOR 有权
    集成谐振微结构传感器适用于高温

    公开(公告)号:EP0981725B1

    公开(公告)日:2004-04-07

    申请号:EP98960786.6

    申请日:1998-12-07

    Applicant: Honeywell Inc.

    CPC classification number: G01P15/097 G01L1/103 G01L1/186 G01L9/0011 G01L9/002

    Abstract: A very high temperature microbeam sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperatures up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside the very or ultra high temperature sensing environment, and then using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.

    High temperature resonant integrated microstructure sensor
    98.
    发明公开
    High temperature resonant integrated microstructure sensor 有权
    输入谐振器Mikrostruktur-Sensorfürhohe温度

    公开(公告)号:EP1376087A1

    公开(公告)日:2004-01-02

    申请号:EP03077111.7

    申请日:1998-12-07

    Applicant: Honeywell Inc.

    CPC classification number: G01P15/097 G01L1/103 G01L1/186 G01L9/0011 G01L9/002

    Abstract: A very high temperature sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperature up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside, the very high temperature sensing environment and than using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.

    Abstract translation: 具有静电束驱动器和用于来自光束的感测光的光纤拾取器的谐振集成微结构的非常高的温度传感器。 高温传感器没有易受温度高达600摄氏度影响的组件。用于检测,处理和驱动的相关组件远离传感器环境。 通过在光束组件中使用不同的材料,例如用于光束的钨,以及用于衬底和壳体的蓝宝石,传感器可以承受高达1000摄氏度的温度。此外,光纤可用于处理电子器件之间的长距离连接 和传感器中的驱动器,通过将光电探测器定位在外部,非常高的温度感测环境以及使用光纤将长距离信号从处理器发送到驱动器光电检测器,以消除电信号到噪声问题 。

    HIGH TEMPERATURE RESONANT INTEGRATED MICROSTRUCTURE SENSOR
    99.
    发明公开
    HIGH TEMPERATURE RESONANT INTEGRATED MICROSTRUCTURE SENSOR 有权
    集成谐振微结构传感器适用于高温

    公开(公告)号:EP0981725A1

    公开(公告)日:2000-03-01

    申请号:EP98960786.6

    申请日:1998-12-07

    Applicant: Honeywell Inc.

    CPC classification number: G01P15/097 G01L1/103 G01L1/186 G01L9/0011 G01L9/002

    Abstract: A very high temperature microbeam sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperatures up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside the very or ultra high temperature sensing environment, and then using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.

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