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    Method of fabricating a copper plated aluminium wire, a plated aluminium wire, an insulating plated aluminium wire, methods of fabricating thereof, and a composite lightweighted plated aluminium wire
    100.
    发明公开
    Method of fabricating a copper plated aluminium wire, a plated aluminium wire, an insulating plated aluminium wire, methods of fabricating thereof, and a composite lightweighted plated aluminium wire 有权
    一种用于生产铜包铝线的方法，包铝线，绝缘的，包铝线，制造方法，和更容易包层复合铝线

    公开(公告)号：EP0924320A3

    公开(公告)日：2001-09-12

    申请号：EP98308393.2

    申请日：1998-10-14

    Applicant: Totoku Electric Co., Ltd.

    Inventor： Kitazawa, Hiroshi ,  Yamaguchi, Tatsuo ,  Tsukada, Etsuro

    IPC: C25D5/44 ,  C25D5/10 ,  C25D5/50

    CPC classification number: H01L24/45 ,  C25D5/10 ,  C25D5/44 ,  C25D5/50 ,  H01L24/43 ,  H01L2224/43 ,  H01L2224/431 ,  H01L2224/45015 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45573 ,  H01L2224/45574 ,  H01L2224/45601 ,  H01L2224/45618 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/4566 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49117 ,  H01L2924/0132 ,  H01L2924/01201 ,  H01L2924/01026 ,  H01L2924/01025 ,  H01L2924/01024 ,  H01L2924/01022 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/0002

    Abstract: A copper plated aluminum wire improved in the adhesion is fabricated by a method which comprises a zinc displacement step of forming a zinc thin layer by zinc displacement on the surface of an aluminum or aluminum alloy conductor, an electroplating step of coating the surface of the zinc thin layer continuously with copper layers by electroplating to have a copper coated aluminum conductor, and a thermal diffusion step of heat treating the copper coated aluminum conductor at a temperature of 120 °C to 600 °C under an inert gas atmosphere for thermal diffusion to ease the electrodeposition stress. Accordingly, the resultant copper plated aluminum wire can easily be shaped by cold plastic working process, decreased in the diameter at higher efficiency, and improved in the power of adhesion. A plated aluminum wire is provided comprising an anchor metal layer by displacement plating, a low thermally conductive metal layer by electroplating, and a high electrically conductive metal layer by electroplating which all are deposited in a sequence on the outer surface an aluminum or aluminum alloy conductor. Accordingly, the resultant plated aluminum wire or insulating plated aluminum wire can be minimized in the overall weight and prevented from disconnection caused by thermal diffusion. A plated aluminum wire is provided comprising an anchor metal layer by displacement plating and a high electrically conductive metal layer by electroplating which both are deposited in a sequence on the outer surface an aluminum or aluminum alloy conductor. Accordingly, the resultant plated aluminum wire or insulating plated aluminum wire can be minimized in the overall weight. A composite light-weighted plated wire is provided having an electrically conductive metal layer, which has a potential equal to or higher than that of zinc, deposited by electroplating on the outer surface of a zinc anchor metal layer provided on an aluminum conductor, said electroplating carried out under a condition that the concentration of hydrogen ion in an electrolyte solution is higher than 4 (pH) as an electrolysis parameter and the thickness of plating x (micrometer) is 0.2 Accordingly, the resultant composite light-weighted plated wire can be improved in the adhesion between the aluminum conductor and the electrically conductive metal layer, easily shaped by plastic forming process, decreased in the diameter at higher efficiency, and improved in the reliability of soldering work.

    Abstract translation: 镀铜铝线材在粘合改进通过包括铝或铝合金导体的表面上形成由锌置换锌薄层的锌置换步骤，以电镀锌的表面上涂覆的步骤的方法制造 薄层连续铜层通过电镀以具有铜涂覆的铝导体，以及热处理的铜涂覆的铝导体在120℃至600℃的温度下在惰性气体气氛中对热扩散来缓解下热扩散步骤 电沉积压力。 因此，所得到的铜镀铝导线可以很容易地通过冷塑性加工工艺来成形，减少在较高效率的直径，并且在粘合性的功率提高。 本发明提供一种镀敷铝电线，包括通过置换镀敷锚定金属层，通过电镀低导热金属层，和高导电性金属层，通过电镀，所有被沉积在一个序列中的铝或铝合金导体的外表面上 ， 因此，所得到的镀铝导线或绝缘的镀铝导线可以在整体重量被最小化，并从断开由热扩散引起的防止。 本发明提供一种镀敷铝电线，包括通过置换镀覆的锚定金属层和通过电镀高导电性金属层，其两者都沉积在序列铝或铝合金导体的外表面上。 因此，所得到的镀铝导线或绝缘的镀铝导线可以在整体重量被最小化。 本发明提供一种复合材料重量轻的镀线具有导电金属层，其具有的电势等于或高于锌的高，通过电镀在铝导体设置在锌锚金属层的外表面上沉积，所述电镀 的条件下进行确实氢离子的电解质的溶液中的浓度是小于4（pH值）更高，因为电解参数和电镀X（微米）的厚度为0.2

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