Abstract:
An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.
Abstract:
The disclosure describes an active network interface device (NID) enclosure having a modular construction that provides flexibility to a vendor and permits independent access to technician-accessible connections and subscriber-accessible connections while promoting resistance to environmental and security threats. The active NID enclosure includes an electronics enclosure and an access enclosure. The electronics enclosure contains active electronic components for conversion of data carried on a network signal carrier into services for delivery to subscriber devices. The access enclosure includes two separate access compartments, having separate covers, for independent access to either network terminals or subscriber terminals.
Abstract:
A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
Abstract:
Systems and methods for weatherproof cabinets with variably cooled compartments are provided. One such embodiment includes a housing having a door attached thereto, and in which a cooling compartment and a battery compartment are disposed. An electronics compartment is disposed within the cooling compartment, and an external fan is also disposed within the housing. Methods are also provided for transferring heat from inside the electronics compartment to the cooling compartment, from the cooling compartment to the outside of the housing, and from the battery compartment to the outside of the housing.
Abstract:
A wall-mounted cabinet has two components. The first, a back portion, is fixedly connected to a wall, and the second, a cover portion, is pivotally and detachably connected to the second. A vent is formed in the top of the cover portion, but in a manner that does not permit water to enter but does permit heated air generated from with the cabinet to exit. In order to accomplish this, a water-diverting plate is provided on the back portion. The plate is oriented to extend across the width of the vent at an angle, so that water entering the vent is directed towards a gap formed between the wall and the outer surface of the back portion.
Abstract:
Remote enclosure systems have now been designed and are described herein that meet the following goals: a) consolidates electrical terminations in one system; b) pre-terminates AC and DC equipment loads before site installation; c) provides multiple access points for facilitating equipment repair and installation; d) is easily expanded through the use of additional systems or expansion cabinets and e) is aesthetically functional given the cable entry and routing structure. Remote enclosure systems generally comprise: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) at least one removable radiofrequency (RF) port plate coupled to at least one of the side panels and/or the frame system; d) a bottom panel coupled to the frame system; and e) a cable management top assembly coupled to the frame system. The remote enclosure system may also comprise any number of components suitable for electronics, wireless and cable-based data and telecommunications applications, including air conditioner exhaust member, an air conditioner unit, a battery pack, a meter base, a power receptacle box, an alarm system or alarm device, an expansion cabinet, a coupling device or system, a pre-wiring system and/or a demarcation component. A remote enclosure system may be produced by: a) providing a frame system having at least two side panels, at least one door coupled to the frame system. at least one removable RF port plate coupled to at least one of the side panels, a bottom panel coupled to the frame system, and a cable management top assembly coupled to the frame system; b) providing an expansion cabinet; and c) coupling the frame system to the expansion cabinet through a coupling interface.
Abstract:
A repeater case for high density subscriber lines includes a repeater base and a repeater housing forming a sealed enclosure and having interior walls. A plurality of module slots receive HDSL-4 circuit board modules. A heat conductive material in the housing contacts HDSL-4 modules in the slots and the housing to form a heat escape path to ambient. The HDSL-4 modules are cooled through thermal conductivity with thermally conductive contact with the interior wall of the repeater housing. The heat conductive material is not required for structural support of the modules or their electrical functioning.
Abstract:
A Compact Peripheral Component Interconnect (CPCI) system is provided that can map PCI Industrial Computer Manufactures Group (PICMG) states describing the state of a hot-swap CPCI card into Telecommunication Management Network (TMN) plug-in unit states. Specifically, the hardware/Operating System (OS) states for the CPCI card are specified in PICMG states in accordance with the PICMG hot-swap specification. The present system identifies or defines the meaning (e.g., the definition, identification, function, and/or status) of the states on the CPCI card. The system then maps these states into intermediate states. The intermediate states are then mapped into TMN plug-in unit states (e.g., OperationalState and/or AvailiableStatus). The TMN plug-in unit states corresponding to the CPCI card will then comprise the proper identification information for the CPCI card. Accordingly, a management ware having plug-in units based on the TMN standard can now use these mapped states to manage the state (or status) of the CPCI card.
Abstract:
A method and apparatus for upgrading in-service or legacy telecommunications cabinets that improves power, cooling, space and EMI capabilities, allowing the cabinet to house updated, telecommunications equipment. The upgrade modules include an extension collar that replaces legacy doors, allowing the attachment of replacement doors having integral heat exchanger units. The extension collar also has support for Electro-magnetic Interference (EMI) shielding gaskets so provide EMI shielding capable of meeting FCC mandated levels. Additional upgrade modules include a battery chamber attached beneath the base of legacy cabinet, cooled and vented by one or more of the heat exchanger doors, thereby providing longer battery life.
Abstract:
A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.