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公开(公告)号：JP4118990B2
公开(公告)日：2008-07-16
申请号：JP34122797
申请日：1997-12-11
Applicant: 長野計器株式会社
CPC classification number: G01L19/003 , G01L9/0051 , G01L19/0084 , G01L19/147
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公开(公告)号：JPWO2006006677A1
公开(公告)日：2008-05-01
申请号：JP2006529156
申请日：2005-07-14
Applicant: 長野計器株式会社
IPC: G01L1/22
CPC classification number: G01L1/044 , G01L1/2206 , Y10T29/49103
Abstract: コンパクトで高い信頼性及び品質を確保しつつ、しかも低コストな荷重センサ及びその製造方法を提供する。このために、薄板状のセンサプレート5、このセンサプレート5に取り付けられた複数の歪みゲージ21a〜22dとを具備する荷重センサに関し、前記センサプレート5の一軸方向の両端を任意の対象物に固定させる固定部とする一方で、その中心点Cが変位乃至荷重をこのセンサプレート5に伝達せしめる伝達部とする。そして、前記歪みゲージ21a〜22dを前記中心点Cに対して点対称となる位置に配置すると共に、点対称となる位置に配された歪みゲージ21a〜22d同士を電気的に並列又は直列に接続してゲージペアを構成し、さらに、各ゲージペア同士を電気的に直列に接続して、これら歪みゲージ21a〜22dでブリッジ回路を構成する。
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103.发明专利Nonlinear sensor temperature compensation using summed temperature compensation signal 有权使用夏季温度补偿信号的非线性传感器温度补偿
公开(公告)号：JP2008070354A
公开(公告)日：2008-03-27
申请号：JP2007196621
申请日：2007-07-27
Applicant: Ami Semiconductor Inc , Nagano Keiki Co Ltd , エイエムアイ セミコンダクター インコーポレイテッド , 長野計器株式会社
Inventor： TSUCHIYA SOSUKE , PIQUET LUCAS LAREN , PETERSEN LARRY
CPC classification number: G01D3/0365
Abstract: PROBLEM TO BE SOLVED: To allow temperature compensation with desired accuracy, even when the offset and the gain of an electrical sensor output signal has non-linear temperature dependences and second latent higher temperature dependences. SOLUTION: A sensor temperature compensation circuit has a sensor and a non-linear temperature compensation circuit that compensates for non-linear temperature dependences on the offset and/or the gain generated by the sensor. For instance, a summer adds two offset compensation signals, the ratio between which is a function of the temperature, to at least partially compensate for the offset temperature dependences. The summed signal may then be used to provide the non-linear temperature compensation to the offset. Alternatively or additionally, the summer adds two gain compensation signals, a ratio between which is a function of temperature, to at least partially compensate for the gain temperature dependences. The summed signal may then be used to provide non-linear temperature compensation to the gain. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：即使当电传感器输出信号的偏移和增益具有非线性温度依赖性和第二潜在较高温度依赖性时，为了允许具有期望精度的温度补偿。 解决方案：传感器温度补偿电路具有传感器和非线性温度补偿电路，可补偿由传感器产生的偏移和/或增益的非线性温度依赖性。 例如，夏天会增加两个偏移补偿信号，其之间的比率是温度的函数，以至少部分地补偿偏移温度依赖性。 然后可以将求和的信号用于向偏移提供非线性温度补偿。 或者或另外，夏季将增加两个增益补偿信号，其之间的比率是温度的函数，以至少部分地补偿增益温度依赖性。 然后可以将求和的信号用于向增益提供非线性温度补偿。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2007196251A
公开(公告)日：2007-08-09
申请号：JP2006016093
申请日：2006-01-25
Applicant: Nagano Keiki Co Ltd , Ykk Corp , Ykk株式会社 , 長野計器株式会社
Inventor： KATSUMI TETSUYA , OFUNA HITOSHI , YAMAGUCHI MASASHI , NAGASAKA HIROSHI , YOSHIDA NAOKI
CPC classification number: G01L9/0051 , B22D15/02
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a physical quantity detector by which a resilient section with high dimensional precision and surface flatness can be formed without causing pores (gaseous holes) and defective filling inside the resilient section, and consequently the physical quantity detector excellent in sensor characteristic can be manufactured inexpensively by few number of steps.
SOLUTION: The method for manufacturing the physical quantity detector having a cylinder section closed at one end with the resilient section and a sensor section formed above the resilient section is characterized in that the cylinder section is manufactured by filling a metallic mold (10) with a molten alloy material having the composition enabling an amorphous alloy to be formed, after that cooling the molten alloy material to be converted to the amorphous alloy, and in that the metallic mold is constituted of two or more split dies (11, 12) forming a cavity (14) and an insert pin (19) which is inserted in the cavity to regulate the inner shape of the cylinder section and further, the the metallic mold is equipped with an insert core (16) which is inserted into the metallic mold so as to form the face corresponding to the resilient section in the cavity. In another embodiment, the parting plane of the metallic mold is formed with the cavity so as to correspond to the resilient section surface.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 解决问题的方案：提供一种用于制造物理量检测器的方法，通过该方法可以形成具有高尺寸精度和表面平坦度的弹性部分，而不会在弹性部分内产生孔（气孔）和缺陷填充，因此 传感器特性优异的物理量检测器可以通过少量的步骤廉价地制造。 解决方案：用于制造物理量检测器的方法，其具有在一端与弹性部分封闭的气缸部分和形成在弹性部分上方的传感器部分的特征在于，气缸部分通过填充金属模具（10 ），其中具有能够形成非晶合金的组成的熔融合金材料，然后冷却待转化为非晶合金的熔融合金材料，并且金属模具由两个或更多个分模（11,12） ）形成空腔（14）和插入所述腔体中的插入销（19），以调节所述气缸部分的内部形状，并且所述金属模具配备有插入所述壳体（16）的插入芯体（16） 金属模具，以形成对应于空腔中的弹性部分的面。 在另一个实施例中，金属模具的分型平面形成有空腔以对应于弹性部分表面。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2007155505A
公开(公告)日：2007-06-21
申请号：JP2005351254
申请日：2005-12-05
Applicant: Nagano Keiki Co Ltd , 長野計器株式会社
Inventor： SATO YUZURU , YANAGISAWA YASUSHI , HOSHINA TOMOAKI
IPC: G01L19/14
Abstract: PROBLEM TO BE SOLVED: To provide a pressure sensor device capable of suppressing increase in size of a case member with respect to a board.
SOLUTION: When a pressure sensor device 100 is assembled, the board 410 is attached to the case member 300, and cover nail parts 660, 670 are locked to the case member 300 from the outer surface side to attach a cover member 600 in such a state that the case member 300 is covered. A holder member 700 and the case member 300 are locked by a tongue piece protruded part, the movement of the cover nail parts 660, 670 in the direction separating from the outer surface of the case member 300 is prevented by a side protruded part 721A and a side part 731, and the cover member 600 is covered. In such a state, the holder member 700 is attached.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供一种能够抑制壳体部件相对于板的尺寸增大的压力传感器装置。 解决方案：当组装压力传感器装置100时，板410附接到壳体构件300，并且盖钉部分660,670从外表面侧锁定到壳体构件300以附接盖构件600 在壳体部件300被覆盖的状态下。 保持器构件700和壳体构件300被舌片突出部分锁定，通过侧突出部分721A和/或侧面突出部721A防止了盖钉部分660,670在与壳体构件300的外表面分离的方向上的移动 侧面部分731，盖部件600被覆盖。 在这种状态下，安装保持器构件700。 版权所有（C）2007，JPO＆INPIT
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Patent Agency Ranking
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108.发明专利Fluid control structure of micro flow passage, blocking member, microchip, manufacturing method for microchip, device applying fluid control structure, and blocking member operation device 有权微流量通道的流体控制结构，阻塞构件，MICROCHIP，MICROCHIP的制造方法，应用流体控制结构的装置和阻塞构件操作装置
公开(公告)号：JP2006283965A
公开(公告)日：2006-10-19
申请号：JP2005263112
申请日：2005-09-09
Applicant: Kanagawa Acad Of Sci & Technol , Nagano Keiki Co Ltd , 財団法人神奈川科学技術アカデミー , 長野計器株式会社
Inventor： SEKIMORI YUKIMITSU , KITAMORI TAKEHIKO
Abstract: PROBLEM TO BE SOLVED: To provide a fluid control structure of a micro flow passage having no restriction on a substrate material of a microchip and capable of blocking the flow passage securely to ensure pressure proof property and to provide a blocking member, the microchip, various application devices, and a blocking member operation device. SOLUTION: This structure is constituted by pushing a valve 30 into a hole 20 of the microchip 1 to block the flow passage FA, a movable part for blocking the flow passage FA is the valve 30 itself, and there is no necessity for blocking the flow passage FA by deforming substrates 11, 12. For this reason, even a hard material can be used in the substrates 11, 12 of the microchip 1 to improve reliability and general-purpose property greatly. Since an elastic member 32 comes into close contact with a peripheral fringe 21 of the hole 20 and an end part 142 of a channel 14 due to elastic deformation, the flow passage FA is securely blocked to ensure pressure proof property. The operation device provided with a pressing means of the valve 30 arranged in the microchip 1 is also provided. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：为了提供一种微流路的流体控制结构，其对微芯片的基板材料没有限制，并且能够牢固地阻塞流路以确保耐压性并提供阻挡构件， 微芯片，各种应用装置，以及阻挡构件操作装置。 解决方案：该结构通过将阀30推入微芯片1的孔20来阻塞流路FA构成，用于阻塞流路FA的可动部件是阀30本身，并且不需要 通过使基板11,12变形而阻塞流路FA。由于这个原因，即使在微芯片1的基板11,12中也可以使用硬质材料，可以大大提高可靠性和通用性。 由于弹性构件32由于弹性变形而与孔20的周边边缘21和通道14的端部142紧密接触，所以流路FA被牢固地封闭以确保耐压性。 还设置有设置在微芯片1中的阀30的按压装置的操作装置。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2006194181A
公开(公告)日：2006-07-27
申请号：JP2005007814
申请日：2005-01-14
Applicant: Nagano Keiki Co Ltd , 長野計器株式会社
Inventor： NISHIKAWA JUN , YAMAGISHI KAZUYA , SAKAGUCHI SHINICHI , ASAMA KIICHI
IPC: F04B45/047 , F04B43/04 , H02K33/16
Abstract: PROBLEM TO BE SOLVED: To provide a diaphragm pump with stable pump efficiency. SOLUTION: The diaphragm pump 10 is provided with an insertion part for inserting and retaining a connection part 33 of a movable element 30; a meandering spring part formed so as to be meandered from the insertion part in a radial direction of the movable element 30; and an outer peripheral mounting part provided on an end of the meandering spring part and fixed to a spring fixing part 212A of a case 20. The diaphragm pump 10 is provided with a spring member 50 in which the insertion part, the meandering spring part and the outer peripheral mounting part are arranged on a spring formation surface approximately crossing to an axis of the movable element 30. Therefore, since the insertion part is supported approximately on the axis of the case 20 by the meandering spring part and movement in a direction that the meandering spring part is provided is restricted, movement in a radial direction of the movable element 30 is restricted and deviation of the axis of the movable element 30, inclination and contact with an electro-magnet part can be prevented. Accordingly, the movable element 30 can be stably vibrated on the axis and the pump efficiency of the diaphragm pump 10 can be stabilized. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供具有稳定泵效率的隔膜泵。 解决方案：隔膜泵10设置有用于插入和保持可移动元件30的连接部分33的插入部分; 弯曲的弹簧部分形成为在可移动元件30的径向方向上从插入部分曲折; 以及外周安装部，其设置在蜿蜒弹簧部的端部并固定到壳体20的弹簧固定部212A。隔膜泵10设置有弹簧构件50，弹性构件50中插入部，蜿蜒弹簧部和 外周安装部分布置在大致与可移动元件30的轴线交叉的弹簧形成表面上。因此，由于插入部分被蜿蜒弹簧部分大致支撑在壳体20的轴线上，并且沿着 蜿蜒的弹簧部分被限制，可动元件30的径向移动被限制，并且可以防止可动元件30的轴线的偏移，与电磁体部分的倾斜和接触。 因此，可动元件30可以在轴上稳定地振动，并且可以使隔膜泵10的泵效率稳定。 版权所有（C）2006，JPO＆NCIPI
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110.发明专利
公开(公告)号：JP2006119053A
公开(公告)日：2006-05-11
申请号：JP2004308904
申请日：2004-10-22
Applicant: Kanagawa Acad Of Sci & Technol , Nagano Keiki Co Ltd , 財団法人神奈川科学技術アカデミー , 長野計器株式会社
Inventor： SEKIMORI YUKIMITSU , KITAMORI TAKEHIKO
IPC: G01L9/00
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component capable of extensively miniaturizing and easily manufacturing and a sensor equipped with the electronic component.
SOLUTION: By the structure of the substrates 21 and 22 which are mutually piled while holding the conductive patterns 221-223 in between, the holes on the substrates 21 and 22 can be eliminated because the substrate piled body 20 makes a continuity through the conductive patterns 221-223. Therefore, the dead space necessary for providing the holes can be eliminated. Consequently the extensive miniaturization can be attained, and the conductive patterns 221-223 and the substrates 21, 22 are only connected while dispensing with boring, and the easy and low cost manufacturing can be allowed. Therefore, both end faces 23, 24 of the substrate piled body 20 can be brought in continuity and at the same time communication of the air is allowable i.e. field through structure can be realized, and the ultra small pressure sensor 1 can be manufactured.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供能够广泛地小型化和容易制造的电子部件以及配备有电子部件的传感器。 解决方案：通过在保持导电图案221-223之间相互堆叠的基板21和22的结构，可以消除基板21和22上的孔，因为基板堆叠体20通过 导电图案221-223。 因此，可以消除提供孔所需的死空间。 因此，可以实现广泛的小型化，并且导电图案221-223和基板21,22仅在分配钻孔的同时连接，并且可以允许容易且低成本的制造。 因此，可以使基板堆叠体20的两端面23,24保持连续性，同时可以实现空气的通气，即可实现通孔结构，能够制造超小型压力传感器1。 版权所有（C）2006，JPO＆NCIPI
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