Abstract:
PURPOSE: A scale index device, a substrate thereof, a forming method thereof, a deformation measuring method thereof, and a device thereof are provided to reduce processing costs by directly checking the thermal deformation of a substrate during a substrate manufacturing process. CONSTITUTION: A scale index device is embedded into a substrate. The scale index device comprises a register and at least one electrode pair. The register is formed on the upper side of the polymer core of the substrate. The electrode pair is contacted with the upper side of the register. The electrode pair is exposed to the surface of the substrate. The register is made of Ni-Cr alloy or Ni-Co alloy. The electrode pair is made of Cu or Cu alloy.
Abstract:
PURPOSE: A casting method for an engine bracket and a compressor case for a vehicle is provided to reduce a failure rate in casting by optimizing the casting process including degasification and loading of molten metal. CONSTITUTION: A casting method for an engine bracket and a compressor case for a vehicle comprises steps of: melting AC4C aluminum alloy to 790~810°C in order to obtain molten metal, injecting argon gas into the molten metal for 3~7 minutes for degasification of the molten metal, carrying out additional degasification for 5~15 minutes using a GBF apparatus while injecting argon gas and flux into the molten metal, and putting the degasified molten metal into a mold while maintaining the temperature of 700~740°C.
Abstract:
본 발명은 카트리지를 이용한 임베디드 반도체 패키지 및 그 제조 방법에 관한 것이다. 본 발명에 따른 임베디드 반도체 패키지의 제조 방법은 외부에 탄성 부재를 구비하는 카트리지로 반도체 칩의 적어도 일부를 둘러싸는 단계, 그리고 상기 탄성 부재가 압축된 상태로 상기 카트리지를 절연체 기판과 라미네이션(lamination)하는 단계를 포함하는 포함한다. 본 발명은 반도체 칩이 탄성 부재를 구비한 카트리지로 둘러싸인 상태로 절연체 기판에 내장됨으로써 재활용이 용이한 임베디드 반도체 패키지를 제공할 수 있다. 임베디드, 반도체 칩, 절연체 기판