公开(公告)号：EP3394889A1

公开(公告)日：2018-10-31

申请号：EP15911562.5

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios, C. ,  NAIR, Vijay, K.

IPC: H01L23/66 ,  H01L23/28 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/16 ,  H01L24/20 ,  H01L25/105 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15192 ,  H01L2924/18162 ,  H01L2924/19011 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes an overmolded component having a first die with a silicon based substrate. A second die is coupled to the first die with the second die being formed with compound semiconductor materials in a different substrate. A substrate is coupled to the first die. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：EP4356174A1

公开(公告)日：2024-04-24

申请号：EP22825489.2

申请日：2022-03-28

Applicant: INTEL Corporation

Inventor： ALEKSOV, Aleksandar ,  KAMGAING, Telesphor ,  STRONG, Veronica ,  PRABHU GAUNKAR, Neelam ,  DOGIAMIS, Georgios C.

IPC: G02B6/42

CPC classification number: G02B2006/1203820130101 ,  G02B6/122 ,  G02B6/4246 ,  G02B6/4214 ,  G02B6/4259 ,  G02B6/12002 ,  G02B6/4274 ,  G02B6/4292 ,  G02B6/428 ,  G02B6/42

公开(公告)号：EP4163970A1

公开(公告)日：2023-04-12

申请号：EP22205663.2

申请日：2016-07-01

Applicant: INTEL Corporation

Inventor： KAMGAING, Telesphor ,  ELSHERBINI, Adel ,  OSTER, Sasha

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/525

Abstract: An antenna package, comprising a plurality of dielectric redistribution layers, an interface layer on the top side of the plurality of dielectric redistribution layers, a die above the interface layer, a first dielectric layer on the bottom side of the plurality of dielectric redistribution layers, a via in the first dielectric layer, a first antenna element coupled to the via, a second dielectric layer on the first dielectric layer and on the first antenna element, a second antenna element on the second dielectric layer, the second antenna element vertically beneath the first antenna element, and a third dielectric layer on the second dielectric layer and on the second antenna element.

公开(公告)号：EP4106099A1

公开(公告)日：2022-12-21

申请号：EP22163739.0

申请日：2022-03-23

Applicant: INTEL Corporation

Inventor： KAMGAING, Telesphor ,  ALEKSOV, Aleksandar ,  DOGIAMIS, Georgios C. ,  STRONG, Veronica ,  PRABHU GAUNKAR, Neelam

IPC: H01P1/203 ,  H01P7/08 ,  H01P11/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related creating millimeter wave components within a glass core of a substrate within a semiconductor package. These millimeter wave components, which include resonators, isolators, directional couplers, and circulators, may be combined to form other structures such as filters or multiplexers. Other embodiments may be described and/or claimed.

公开(公告)号：EP4105982A1

公开(公告)日：2022-12-21

申请号：EP22169613.1

申请日：2022-04-25

Applicant: INTEL Corporation

Inventor： KAMGAING, Telesphor ,  STRONG, Veronica ,  DOGIAMIS, Georgios ,  PRABHU GAUNKAR, Neelam ,  ALEKSOV, Aleksandar

IPC: H01L23/15 ,  H01L23/498

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to creating coaxial structures within glass package substrates. These techniques, in embodiments, may be extended to create other structures, for example capacitors within glass substrates. Other embodiments may be described and/or claimed.

公开(公告)号：EP3712938A1

公开(公告)日：2020-09-23

申请号：EP20156735.1

申请日：2020-02-11

Applicant: INTEL Corporation

Inventor： BRAUNISCH, Henning ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel ,  DOGIAMIS, Georgios ,  DISCHLER, Richard ,  SWAN, Johanna ,  PROKOFF, Victor

IPC: H01L23/66 ,  H01L25/065

Abstract: Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：EP3394928A1

公开(公告)日：2018-10-31

申请号：EP15911606.0

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K.

IPC: H01Q3/34 ,  H01Q21/06

CPC classification number: H04B1/44 ,  H01Q3/36 ,  H01Q3/42 ,  H01Q21/06 ,  H01Q21/22 ,  H01Q23/00 ,  H04B1/401

Abstract: Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.

公开(公告)号：EP3140859A1

公开(公告)日：2017-03-15

申请号：EP14891343.7

申请日：2014-05-06

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  ELSHERBINI, Adel A. ,  FRANK, Torrey W.

IPC: H01L23/12

CPC classification number: H01L23/49838 ,  G06F1/1613 ,  H01L21/288 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5223 ,  H01L23/562 ,  H01L23/66 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3511

Abstract: Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a first layer having a first side and a second side disposed opposite to the first side a second layer coupled with the first side of the first layer, one or more antenna elements coupled with the second layer and a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了具有天线和相关联的技术和配置的多层封装。 在一个实施例中，集成电路（IC）封装组件包括具有第一侧的第一层和与第一侧相对设置的第二层，第二层与第一层的第一侧耦合，一个或多个天线元件与 所述第二层和与所述第一层的第二侧耦合的第三层，其中所述第一层是具有大于所述第二层和所述第三层的拉伸模量的拉伸模量的增强层。 可以描述和/或要求保护其他实施例。

公开(公告)号：EP4456329A1

公开(公告)日：2024-10-30

申请号：EP23216334.5

申请日：2023-12-13

Applicant: INTEL Corporation

Inventor： WAGNER, Thomas ,  SEIDEMANN, Georg ,  YANG, Tae Young ,  GOSSNER, Harald ,  KAMGAING, Telesphor ,  WAIDHAS, Bernd

IPC: H01Q21/20 ,  H01Q1/22 ,  H01L23/66

Abstract: Embodiments disclosed herein include a communication module. In an embodiment, the communication module comprises a package substrate, and a die on the package substrate. In an embodiment, a plurality of antennas are around the die. In an embodiment, the plurality of antennas are coupled to the die by a plurality of traces, and heights of each of the plurality of antennas is greater than a thickness of the traces.

公开(公告)号：EP4268279A1

公开(公告)日：2023-11-01

申请号：EP20967195.7

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： ACIKALIN, Tolga ,  AMADJIKPE, Arnaud ,  CARLTON, Brent, R. ,  CHIU, Chia-Pin ,  COX, Timothy, F. ,  FOUST, Kenneth, P. ,  HORINE, Bryce, D. ,  KAMGAING, Telesphor ,  LIU, Renzhi ,  MIX, Jason, A. ,  VADLAMANI, Sai ,  YANG, Tae, Young ,  ZHOU, Zhen

IPC: H01L23/66 ,  H01L23/528 ,  H01L23/48 ,  H01L23/532 ,  H01L23/538 ,  H01L25/065