公开(公告)号：US08361566B2

公开(公告)日：2013-01-29

申请号：US12099556

申请日：2008-04-08

Applicant: James L. Maxwell

Inventor： James L. Maxwell

IPC: C23C16/48

CPC classification number: C23C16/4418 ,  B81C99/0095 ,  B81C2201/0188 ,  C23C16/4415 ,  C23C16/455 ,  C23C16/4551 ,  C23C16/483

Abstract: A method of growing a plurality of free-standing structures comprises providing a plurality of free-standing structures, each free-standing structure having a first end coupled to a substrate, and a terminal end; providing at least one laser beam, the laser beam having a beam waste at a point proximate to the terminal end of the free-standing structure; and moving one of the plurality of freestanding structures or the beam waste to provide a growth zone proximate to the terminal end of each of the free-standing structures such that the free-standing structures grow into the growth zones by addition of decomposing precursor components. The growth rates of each of the free-standing structures are substantially the same.

Abstract translation: 生长多个独立结构的方法包括提供多个独立结构，每个独立结构具有耦合到衬底的第一端和终端; 提供至少一个激光束，所述激光束在靠近所述独立结构的终端的点处具有光束废料; 并且移动所述多个独立结构或束废料中的一个以提供靠近每个独立结构的末端的生长区，使得通过添加分解的前体组分而使自立结构生长到生长区中。 每个独立结构的增长率基本相同。

公开(公告)号：US20040012124A1

公开(公告)日：2004-01-22

申请号：US10192228

申请日：2002-07-10

Inventor： Xiaochun Li ,  Yong Yang ,  Hongseok Choi

IPC: H05B006/00

CPC classification number: B81C99/0095 ,  B22F3/004 ,  B22F2003/1056 ,  B22F2003/1058 ,  B22F2999/00 ,  B29C31/02 ,  B29C41/36 ,  B29C64/153 ,  B29C2793/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81C99/0025 ,  B81C2201/0188 ,  C23C24/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  Y02P10/295 ,  B22F3/1055 ,  B22F2202/01

Abstract: A method of fabricating a three-dimensional heterogeneous small-scale device includes the steps of depositing a fine heterogeneous materials (such as dry powders and biological materials) towards a substrate. In addition, the method includes sintering/cladding the material with a laser so as to produce a pattern. Then, the pattern is micro machined according to the particular design. The depositing step preferably includes providing a feed mechanism having an input to receive the material, an output, and a source of ultrasonic vibration to discharge the material from the output.

Abstract translation: 一种制造三维异质小规模装置的方法包括以下步骤：向衬底沉积精细的异质材料（如干粉和生物材料）。 此外，该方法包括用激光烧结/包覆材料以产生图案。 然后，根据具体设计对图案进行微加工。 沉积步骤优选地包括提供进料机构，其具有用于接收材料的输入端，输出端和超声波振动源，以从输出端排出材料。

公开(公告)号：US06566251B2

公开(公告)日：2003-05-20

申请号：US09871200

申请日：2001-05-31

Applicant: Mark G. Allen ,  Florent Cros ,  Jin-Woo Park ,  Kim Kieun

Inventor： Mark G. Allen ,  Florent Cros ,  Jin-Woo Park ,  Kim Kieun

IPC: H01L214763

CPC classification number: B81C99/009 ,  B81C2201/0188

Abstract: Methods for creating one or more structures in a micromachined device. In one arrangement, the methods include the steps of providing a substrate, forming upstanding nonconductive mold walls on the substrate so that first and second wells are formed, the second well being wider than the first well. The method further includes applying a first material to the surface of the wells so that the first well fills with the first material before the second well, and removing the first material from the second well while leaving a portion in the first well.

公开(公告)号：WO2015080550A1

公开(公告)日：2015-06-04

申请号：PCT/MY2014/000118

申请日：2014-05-26

Applicant: MIMOS BERHAD

Inventor： ABD WAHID Khairul Anuar Bin ,  LEE, Wai Yee ,  Daniel BIEN Chia Sheng ,  ABD RASHID Amirul Bin

IPC: B81C1/00

CPC classification number: B81C1/00206 ,  B81B2201/0214 ,  B81C2201/0188

Abstract: A method of forming nanomaterials (10) on packaged sensor- device platform, the method comprising the steps of fabricating (11) a sensor device platform on full scale wafer to form a fully packaged sensor device platform for nanomaterials forming process (10) which comprises the steps of protecting the wire bond with epoxy while leaving the sensing area exposed for receiving coating of catalyst precursor for the nanomaterial growth, nucleating (1.6) the coated catalyst precursor at low temperature for forming an active nanoparticle, and providing the active nanoparticle nucleation with nutrient solution for turning them into solid and forming nanostructures for integration of readout circuit for sensing.

Abstract translation: 一种在封装的传感器装置平台上形成纳米材料（10）的方法，所述方法包括以下步骤：（11）在全尺寸晶片上制造（11）传感器装置平台，以形成用于纳米材料形成工艺（10）的完全封装的传感器装置平台，其包括 保护引线与环氧树脂的步骤，同时留下感测区域，以暴露出用于接纳纳米材料生长的催化剂前体的涂层，在低温下成核（1.6）涂覆的催化剂前体以形成活性纳米颗粒，并提供活性纳米颗粒成核 营养液将其转化为固体并形成纳米结构，用于集成用于感测的读出电路。

公开(公告)号：WO2012162271A2

公开(公告)日：2012-11-29

申请号：PCT/US2012/038899

申请日：2012-05-21

Applicant: UNIVERSITY OF UTAH RESEARCH FOUNDATION ,  TABIB-AZAR, Massood

Inventor： TABIB-AZAR, Massood

IPC: H01L21/027 ,  G03F7/20

CPC classification number: B81C1/00373 ,  B81C2201/0176 ,  B81C2201/0188 ,  C23C16/01 ,  C23C16/04 ,  C23C16/047 ,  C23C16/46 ,  G01Q10/045 ,  G01Q20/04 ,  G01Q80/00 ,  H01L29/0665

Abstract: A method of fabricating an integrated circuit includes forming (52) a metallic trace over a substrate. Resonance in the metallic trace can be induced (54), resulting in a resonating metallic trace and a localized heated target deposition region. A semiconductor material can be deposited on the target deposition region via gas decomposition (56) of a semiconductor precursor gas.

Abstract translation: 一种制造集成电路的方法包括在衬底上形成（52）金属迹线。 可以诱导金属痕迹的共振（54），导致共振的金属痕迹和局部加热的目标沉积区域。 半导体材料可以通过半导体前体气体的气体分解（56）沉积在靶沉积区上。

公开(公告)号：WO2010090254A1

公开(公告)日：2010-08-12

申请号：PCT/JP2010/051599

申请日：2010-02-04

Applicant: 株式会社IHI ,  重田 諭吉 ,  青柳 邦彦 ,  野瀬 裕之

Inventor： 重田　諭吉 ,  青柳　邦彦 ,  野瀬　裕之

IPC: C23C14/24 ,  B82B3/00 ,  H01L29/06

CPC classification number: C23C14/0605 ,  B81C1/00031 ,  B81C2201/0188 ,  C23C14/04 ,  C23C14/14 ,  C23C14/22 ,  C23C14/24

Abstract: 　圧電体１１の表面に間隔を隔てて位置する少なくとも１対の電極１２，１３を有する表面弾性波素子１０と、表面弾性波素子の表面に２以上の物質Ａ，Ｂを真空蒸着可能な真空蒸着装置２０と、表面弾性波素子の電極間に高周波電圧を印加する高周波印加装置３０とを備え、前記高周波電圧の印加により表面弾性波素子の表面に表面弾性波の定在波を発生させた状態で、複数の薄膜層を構成し、定在波の特定位置に微細構造物を蒸着する。

Abstract translation: 该装置配备有：具有在压电体（11）的表面上间隔设置的至少一对电极（12,13）的表面弹性波形元件（10）。 能够在表面弹性波元件的表面上真空沉积两种或多种物质（A，B）的真空沉积装置（20）; 以及在表面弹性波元件的电极之间施加高频电压的高频波施加装置（30）。 当通过施加高频电压在表面弹性波元件的表面上产生表面弹性波的驻波时，形成多个薄膜层，并将微结构沉积在驻波的特定位置。

公开(公告)号：WO2004104704A3

公开(公告)日：2005-05-26

申请号：PCT/EP2004005428

申请日：2004-05-19

Applicant: INST MIKROTECHNIK MAINZ GMBH ,  SINGLETON LAURENCE ,  SCHEURER JOERG

Inventor： SINGLETON LAURENCE ,  SCHEURER JOERG

IPC: B81C1/00 ,  G03F7/00 ,  G03F7/038 ,  G03F7/11 ,  G03F7/40 ,  G03F7/42

CPC classification number: G03F7/40 ,  B81B2203/0361 ,  B81C1/00619 ,  B81C2201/0159 ,  B81C2201/0181 ,  B81C2201/0188 ,  G03F7/0035 ,  G03F7/038 ,  G03F7/11 ,  G03F7/405

Abstract: The invention relates to a lithographic method for producing microcomponents having a submillimeter structure, whereby the resist material can be dissolved in a simple manner. According to the invention, a structurable adhesive layer is applied to a metallic starting layer, a layer consisting of photostructurable epoxy resin is applied to the adhesive layer, and the epoxy resin is structured by means of selective illumination and dissolution of the unexposed regions in order to create supporting structures and free spaces between the supporting structures. Only the free spaces provided for the microcomponent and located between the epoxy resin supporting structures are then filled with metal according to a galvanic method, and the epoxy resin is removed, the remaining free spaces being filled with etching agents.

Abstract translation: 它是描述了用于在亚毫米范围内产生具有器件结构的微平版印刷工艺，其中所述抗蚀剂材料的溶解是可能以简单的方式。 该方法提供了光致环氧树脂的层施加到金属籽晶层上的结构化的粘合剂层和粘合剂层，所述环氧树脂通过选择性曝光的装置构造并溶解出来的未曝光区域的支持结构的形成和支撑结构之间的自由区域，则只有 设置用于Epoxyharzstützstrukturen之间的微小间隙成分电镀工艺的装置用金属填充，最后，环氧树脂被去除，蚀刻剂被引入到其余的自由空间。

公开(公告)号：WO2003090937A1

公开(公告)日：2003-11-06

申请号：PCT/US2003/012848

申请日：2003-04-23

Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION

Inventor： LI, Xiaochun ,  YANG, Yong ,  CHOI, Hongseok

IPC: B05C11/00

CPC classification number: B81C99/0095 ,  B22F3/004 ,  B22F2003/1056 ,  B22F2999/00 ,  B29C31/02 ,  B29C41/36 ,  B29C64/00 ,  B29C2793/00 ,  B29K2995/0056 ,  B33Y30/00 ,  B81C99/0025 ,  B81C2201/0188 ,  C23C24/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  Y02P10/295 ,  B22F3/1055 ,  B22F2202/01

Abstract: A method of fabricating a three-dimensional heterogeneous small-scale device includes the steps of depositing fine heterogeneous materials (such as dry powders and biological materials) towards a substrate (45). In addition, the method includes sintering or cladding the material with a laser so as to produce a pattern (46). Then, the pattern is micro machined according to the particular design (47). The depositing step preferably includes providing a feed mechanism having an input to receive the material, an output, and a source of ultrasonic vibration to discharge the material from the output.

Abstract translation: 一种制造三维异质小规模装置的方法包括以下步骤：向衬底（45）沉积微细异质材料​​（如干粉和生物材料）。 此外，该方法包括用激光烧结或包覆材料以产生图案（46）。 然后，根据具体设计（47）对图案进行微加工。 沉积步骤优选地包括提供进料机构，其具有用于接收材料的输入端，输出端和超声波振动源，以从输出端排出材料。

公开(公告)号：EP2969913B1

公开(公告)日：2017-05-10

申请号：EP14710849.2

申请日：2014-03-12

Applicant: Robert Bosch GmbH

Inventor： HEUCK, Friedjof ,  SCHELLING, Christoph

IPC: B81C1/00

CPC classification number: B81C1/00619 ,  B81C1/00412 ,  B81C2201/0177 ,  B81C2201/0188

公开(公告)号：EP3064471A1

公开(公告)日：2016-09-07

申请号：EP13896608.0

申请日：2013-11-19

Applicant: Industry-University Cooperation Foundation Sogang University

Inventor： LEE, Jung Chul ,  LEE, Il

IPC: B81C1/00 ,  G01N33/00

CPC classification number: B81C1/0015 ,  B29C35/0805 ,  B29C64/135 ,  B29C2035/0827 ,  B29K2071/02 ,  B29K2105/0061 ,  B29K2995/0027 ,  B29L2031/756 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B81B3/0021 ,  B81B2201/12 ,  B81B2203/0118 ,  B81C99/0025 ,  B81C2201/0188 ,  B81C2201/034 ,  B81C2203/038 ,  G01D11/30 ,  G01Q70/14 ,  G01Q70/16

Abstract: Disclosed is a method for manufacturing a microcantilever having a predetermined thickness that includes forming a liquid synthetic resin for cantilevers to a thickness corresponding to the thickness of the microcantilever on an upper surface of a base block having an adhesive base and a non-adhesive base, and curing the liquid synthetic resin for cantilevers via a boundary between the adhesive base and the non-adhesive base, wherein the adhesive base has stronger adhesivity to the cured synthetic resin for cantilevers than the non-adhesive base.