Abstract:
A solid-state image pickup device comprising: a multilayer wiring board 2 having an opening portion 21; a spacer 3 covered with a conductive film 32, and fixed to the multilayer wiring board 2 in a state of making the conductive film 32 face contact with a reference potential electrode exposed into the opening portion 21 of the multilayer wiring board 2; a solid-state image pickup element 4 fixed to the spacer 3 in a state of face contact with the conductive film 32 of the spacer 3, and arranged in the opening portion 21; and an optical element 5 fixed at a position opposing the solid-state image pickup element 4 via the spacer 3, and transmitting light into the opening portion.
Abstract:
An optical device comprises a body, the body housing a detector, a diffraction grating and a lens for focusing light reflected by the diffraction grating onto the detector. The body is provided with a window, the window for allowing light to pass from outside of the optical device to the diffraction grating. The diffraction grating, in a preferred embodiment, has a variable pitch, to achieve a linear imaging. The lens comprises a low numerical aperture lens, and the detector is aligned at an angle that is non-perpendicular to the optical axis of the imaging lens.
Abstract:
In a system for scanning a document (43), a light source (22) illuminates the document; an imager (24, 41, 41', 61, 62) receives light from the document and directs it toward a detector array (25) which produces a corresponding array of electrical signals. The imager has several optical properties that are useful either individually or in combination. The imager is telecentric and thereby ensures that image size and magnification are insensitive to object displacement along the optical axis (46, 46') and image brightness is uniform independent of object off-axis distance. An aspheric element (33) within the imager balances focus variation (82-81-83) within the depth of field with spherical aberration and thereby provide nearly uniform image resolution. A diffraction pattern (33'), carried by the imager, corrects for spectral dispersion which occurs when light passes (63) from air into a refractive material (61, 62). An imager with a reflecting surface (32, 33) provides a system that is subject to little or no chromatic aberration. A solid imager (61, 62) with multiple internal reflecting surfaces (32, 33, 42) in optical series (32-33-32-42), configured to include the previously mentioned optical properties, also provides for highly stable alignment of reflecting surfaces.
Abstract:
A reading pen for reading text has an elongate casing with a reading opening (3) formed in one end thereof, a printed circuit board (5) which is arranged inside the casing, light-emitting diodes (7a, 7b) arranged inside the reading opening and adapted to illuminate the text that is to be read, and a light-sensitive sensor (9) arranged inside the reading opening and adapted to read the illuminated text. The printed circuit board (5) has an end portion at said one end of the casing. The end portion essentially corresponds to the form of the casing. The light-emitting diodes (7a, 7b) and the light-sensitive sensor (9) are arranged on said end portion.
Abstract:
An image sensor has a supporting member for integrally supporting a reading system including illuminating means for illuminating an original document, a photoelectrically converting means and imaging means for imaging light reflected by the surface of the original document onto the photoelectrically converting means, and has a member disposed on the side surface of the supporting member. The image sensor has two or more substantially independent spaces formed in the supporting member. The illuminating means, the imaging means and the photoelectrically converting means are accommodated in one of the spaces.
Abstract:
An imager (50-1) for imaging a document (12) moving in a document track (14) in a table top document processing machine (10) includes a housing which is made of several portions which are designed to be assembled quickly with a minimum of fasteners. A first line of green LEDs (82-1) and a second line of red LEDs (82-2) are located in the housing to illuminate a scanning line (84) from which image data about the document is obtained by an optical system including a CCD device (100). The imager (50-1) is also designed so that it can be used on either side of the document track (14) to image the front or rear of the document. When two such imagers are used, a white reference member (198) located in one of the imagers is used by the other imager for calibrating the imager to ensure repeatable and uniform data.
Abstract:
Process and apparatus for fabricating an extended scanning or printing array in which several smaller scanning or printing chips (5) are bonded end-to-end onto the surface of a glass substrate (10) having an opaque thermally and/or electrically conductive coating (19) thereon, with the coating removed at discrete sites (24) to allow a photocurable adhesive (30) placed at the sites to be cured through exposure to UV light from underneath the substrate, the photocurable adhesive holding the chips in place while a chip-bonding adhesive (38) deposited on the conductive coating where the chips are located is cured to provide a permanent structure.
Abstract:
A contact-type linear image sensor has two separate substrates (l2, l4) aligned adjacent to each other A linear array (D) of amorphous silicon photoelectric converting elements serving as photoelectric cells and a matrix wiring unit (28) are provided on a first substrate (l2) Driver IC chips (34, 36) are mounted on a second substrate (l4) Connection pad patterns (20a) for common cell electrodes (20) of cell groups (Dl, D2,..., Dm) and connection pad patterns (32a, 32b, 32c, 32d) for row signal lines (26) of the matrix wiring unit (28) are provided concentrically at a peripheral edge of the first substrate (l2) to be alinged along a junction edge line defined between the substrates (l2, l4). Connection pad patterns (38) for the IC chips (34, 36) are linearly aligned at a peripheral edge of the second substrate (l4) and along the substrate junction edge line to oppose the pad patterns (20a, 32a, 32b, 32c, 32d) of the first substrate (l2). A connector unit for electrically connecting the pad patterns of the first and second substrates (l2, l4) may be provided at only one position of the junction edge portion of the first and second substrates (l2, l4).
Abstract:
An image sensor (S1) is provided that comprises: light guides (1,2) for irradiating light onto an irradiated object; a lens (15) that focuses reflected light that was reflected by the irradiated object; a sensor (16) that receives the reflected light that was focused by the lens (15); and a housing (10). The housing (10) houses or holds the light guides (1, 2), the lens (15), and the sensor (16), and is formed by integrating a housing metal portion (110) and a housing resin portion (210).