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    Adjustable Sound Bar End Cap
    101.
    发明公开
    Adjustable Sound Bar End Cap 审中-公开

    公开(公告)号：US20240098395A1

    公开(公告)日：2024-03-21

    申请号：US18388860

    申请日：2023-11-13

    Applicant: Nicholas Charles Berry

    Inventor： Nicholas Charles Berry

    IPC: H04R1/02

    CPC classification number: H04R1/025 ,  H04R2201/02

    Abstract: Improvements in an adjustable sound bar end cap to allow for the end caps to be outwardly adjustable relative to the frame. The end caps translate from the frame to provide movement of the end caps to match exact variations due to differences in finishes widths per different brands. Springs push the end caps from the frame to maintain a constant pressure between the frame and the end cap(s). This configuration gives 0 to 1 inch of movement per side. The fastener compresses the spring to remain in compression. Multiple fasteners allow for even compression and perpendicular fit of the end cap relative to the frame. A cover plate that covers the adjustment mechanism and adjustment screws. The cover is made from a ferrous material that is attracted to a magnet within the frame to allow for secure holding of the cover plate and easy removal.

    Conical electrostatic speaker
    102.
    发明公开
    Conical electrostatic speaker 审中-公开

    公开(公告)号：US20230388720A1

    公开(公告)日：2023-11-30

    申请号：US17803355

    申请日：2022-05-31

    Applicant: Robert Grant Oliver, III

    Inventor： Robert Grant Oliver, III

    IPC: H04R19/02 ,  H04R7/12

    CPC classification number: H04R19/02 ,  H04R7/12 ,  H04R2400/11 ,  H04R2201/02

    Abstract: An electrostatic speaker driver having specially configured stators and diaphragm for multi-directional sound projection is described. The stators and diaphragm may be frustoconical for example. Stators may have apertures to enable sound generated by vibration of the diaphragm to project in desired directions. The speaker drivers may stand alone, or alternatively, may be part of a speaker assembly including one or more speaker drivers.

    Electronic device with multiple modes of attachment
    103.
    发明授权
    Electronic device with multiple modes of attachment 有权

    公开(公告)号：US11812242B1

    公开(公告)日：2023-11-07

    申请号：US17727793

    申请日：2022-04-24

    Applicant: Noxgear, LLC

    Inventor： Simon Curran ,  Thomas Walters

    IPC: H04R5/02 ,  H04R1/02

    CPC classification number: H04R5/02 ,  H04R1/025 ,  H04R1/026 ,  H04R2201/02

    Abstract: An electronic device with multiple modes of attachment is disclosed herein. In one or more embodiments, the electronic device includes a device assembly having a housing; a clip member coupled to the housing; a first magneto coupler coupled to the housing; and a removable member having a second magneto coupler. The second magneto coupler of the removable member is capable of being magnetically coupled to the first magneto coupler that is coupled to the housing, so the magnetic coupling allows the housing to be attached to a non-edge portion of a non-metallic and/or non-magnetic item when the item is placed between the first magneto coupler and the removable member. The clip member allows the housing to be attached to, and detached from, an edge of a non-metallic and/or non-magnetic item when the removable member is magnetically coupled to the housing, and there is no item between the first magneto coupler and removable member.

    PIEZOELECTRIC SOUNDING COMPONENT
    105.
    发明申请
    PIEZOELECTRIC SOUNDING COMPONENT 审中-公开

    公开(公告)号：US20180270583A1

    公开(公告)日：2018-09-20

    申请号：US15982340

    申请日：2018-05-17

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yuko Yokoi ,  Masakazu Yamauchi ,  Junichi Murakami ,  Kazuchika Yamada ,  Takaaki Kaji

    IPC: H04R17/00 ,  H04R1/02 ,  G10K9/122

    CPC classification number: H04R17/00 ,  B06B1/0666 ,  G10K9/122 ,  G10K9/22 ,  H04R1/02 ,  H04R17/005 ,  H04R31/006 ,  H04R2201/02

    Abstract: A piezoelectric sounding component includes a diaphragm that includes a metal plate and a piezoelectric body formed on the metal plate. The diaphragm bends and vibrates according to application of voltage to the piezoelectric body. A casing includes a bottom wall, side walls which, in combination with the diaphragm define a sound chamber. The diaphragm is supported by a support portion formed in the casing such that outer peripheral edges of the diaphragm are spaced from inner surfaces of the casing. A terminal is located on the casing and is electrically connected to the diaphragm. At least two elastic adhesives join the diaphragm to the casing and respective conductive adhesives extend over its associated elastic adhesive from the diaphragm to a respective terminal. A frame-like sealing portion seals a gap between the outer peripheral edge of the diaphragm and the inner surfaces of the casing. A recessed portion is formed in a portion of the support portion facing the terminal such that the first elastic adhesive extends over the recessed portion.

    System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille
    109.
    发明授权
    System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille 有权
    具有嵌入布置，MEMS模具和格栅的封装MEMS器件的系统和方法

    公开(公告)号：US09584889B2

    公开(公告)日：2017-02-28

    申请号：US14011566

    申请日：2013-08-27

    Applicant: Infineon Technologies AG

    Inventor： Irmgard Escher-Poeppel ,  Edward Fuergut ,  Alfons Dehe

    IPC: H01L29/84 ,  H04R1/02 ,  H04R19/00 ,  H04R31/00 ,  H04R1/08

    CPC classification number: H04R1/021 ,  H04R1/086 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003 ,  H04R2201/02 ,  H04R2231/003

    Abstract: A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped MEMS die embedded into the embedding material. The MEMS die may include a diaphragm for sound transduction. The sound transducer component may further include a sound port within the embedding material in fluidic or acoustic contact with the diaphragm. Further embodiments relate to a method for packaging a MEMS device or to a method for manufacturing a sound transducer component.

    Abstract translation: 封装的MEMS器件可以包括嵌入布置，布置在嵌入布置中的MEMS器件，布置在嵌入布置中并声耦合到MEMS器件的声音端口和声音端口内的格栅。 一些实施例涉及包括嵌入材料和嵌入到嵌入材料中的剥离衬底的MEMS芯片的声音传感器部件。 MEMS管芯可以包括用于声音传导的隔膜。 声音传感器组件还可以包括与隔膜流体或声学接触的嵌入材料内的声音端口。 另外的实施例涉及用于封装MEMS装置的方法或用于制造声换能器部件的方法。

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