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公开(公告)号:ES2930448T3
公开(公告)日:2022-12-13
申请号:ES15167573
申请日:2015-05-13
Applicant: KIDDE TECH INC
Inventor: KERN MARK T , BELL KEN , ROGERS AARON STANLEY
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公开(公告)号:DE102013103520B4
公开(公告)日:2022-07-07
申请号:DE102013103520
申请日:2013-04-09
Applicant: GEN ELECTRIC
Inventor: SPALDING MICHAEL CHARLES , GLESIUS FREDERICK LOUIS , LOMBARDO LEO RAYMOND , LIU JIYUAN , JOHANNING JEFFREY LOUIS , CHOU FRED YU-FENG , SCHNEIDER DONALD ALBERT
Abstract: Flammensensorvorrichtung, die aufweist:einen Sensor (80) zur Bestimmung spezifischer Eigenschaften einer Flamme (8) innerhalb einer Brennkammer (10), wobei der Sensor (80) eine Siliziumcarbid-Photodiode (100) enthält, wobei der Sensor (80) in einer Entfernung von der Brennkammer (10) beabstandet ist; undeine Glasfaserkabelanordnung (60), die sich zwischen dem Sensor (80) und der Brennkammer (10) erstreckt, wobei die Glasfaserkabelanordnung (60) konfiguriert ist, um die spezifischen Eigenschaften der Flamme (8) von der Brennkammer (10) zu dem Sensor (80) zu übermitteln, wobei die Glasfaserkabelanordnung (60) als ein Teil einer abgedichteten Gruppe, die mit einem Inertgas gefüllt ist, enthalten ist;wobei die Glasfaserkabelanordnung (60) an einem ersten Endabschnitt (82) des Sensors (80) befestigt ist, wobei der Sensor (80) ferner eine Linse (96) enthält, die innerhalb einer inneren Kammer (86, 94) des Sensors (80) zwischen dem ersten Endabschnitt (82) und der Siliziumcarbid-Photodiode (100) positioniert ist, wobei die Linse (96) konfiguriert ist, um elektromagnetische Strahlungsenergie aus der Glasfaserkabelanordnung (60) auf die Siliziumcarbid-Photodiode (100) zu fokussieren;wobei die innere Kammer (86, 94) des Sensors (80) eine erste Sensorkammer (86), die zwischen dem ersten Endabschnitt (82) des Sensors (80) und der Linse (96) positioniert ist, und eine zweite Sensorkammer (94) enthält, die zwischen der Linse (96) und einem entgegengesetzten zweiten Ende (84) des Sensors (80) positioniert ist, wobei die Siliziumcarbid-Photodiode (100) in der zweiten Sensorkammer (94) positioniert ist; undwobei die erste Sensorkammer (86) wenigstens eine Ventilanordnung (90, 92) enthält, die einen Strömungspfad zwischen der ersten Sensorkammer (86) und einer Außenseite des Sensors (80) definiert, wobei die wenigstens eine Ventilanordnung (90, 92) konfiguriert ist, um die erste Sensorkammer (86) mit trockenem Stickstoff zu spülen und Feuchtigkeit aus der ersten Sensorkammer (86) zu entfernen.
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公开(公告)号:SE533458C2
公开(公告)日:2010-10-05
申请号:SE0702532
申请日:2007-11-17
Applicant: HF HEAT FINDER AB
Inventor: SVENSSON LARS
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公开(公告)号:SE0702532L
公开(公告)日:2009-05-18
申请号:SE0702532
申请日:2007-11-17
Applicant: HF HEAT FINDER AB
Inventor: SVENSSON LARS
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公开(公告)号:US11686623B2
公开(公告)日:2023-06-27
申请号:US17200713
申请日:2021-03-12
Applicant: PIXART IMAGING INC.
Inventor: Ming-Han Tsai , Chih-Ming Sun , Jian-Cheng Liao
IPC: G01J5/04 , G01J5/12 , G01J5/0875 , G01J5/00 , G01J5/05 , G01J5/0802
CPC classification number: G01J5/048 , G01J5/0025 , G01J5/05 , G01J5/0802 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号:US20230273070A1
公开(公告)日:2023-08-31
申请号:US18143565
申请日:2023-05-04
Applicant: PIXART IMAGING INC.
Inventor: MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
IPC: G01J5/04 , G01J5/12 , G01J5/0875 , G01J5/00 , G01J5/05 , G01J5/0802
CPC classification number: G01J5/048 , G01J5/12 , G01J5/0875 , G01J5/0025 , G01J5/05 , G01J5/0802
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号:US11740134B2
公开(公告)日:2023-08-29
申请号:US16763278
申请日:2018-11-13
Inventor: Gerwin Hermanus Gelinck
CPC classification number: G01J5/20 , G01J5/0215 , G01J5/0225 , G01J5/046 , G01J5/051 , G01J5/061 , G01J2005/202 , H01L23/467
Abstract: A microbolometer for measuring thermal radiation comprises an electrical circuit on a perforated plastic substrate. The electrical circuit comprises at least one thermistor having a temperature dependent electric resistance, wherein the thermistor is arranged to receive the thermal radiation for changing its temperature depending on a flux of the received thermal radiation. The electrical circuit is configured to measure the electric resistance of the thermistor for calculating the thermal radiation. The microbolometer is configured to cause a gas flow through the perforations for improving thermal characteristics.
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公开(公告)号:US12158375B2
公开(公告)日:2024-12-03
申请号:US18143565
申请日:2023-05-04
Applicant: PIXART IMAGING INC.
Inventor: Ming-Han Tsai , Chih-Ming Sun , Jian-Cheng Liao
IPC: G01J5/04 , G01J5/00 , G01J5/05 , G01J5/0802 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号:US20240183719A1
公开(公告)日:2024-06-06
申请号:US18061918
申请日:2022-12-05
Applicant: STMICROELECTRONICS S.r.l.
IPC: G01J5/0806 , G01J5/05 , G01J5/068
CPC classification number: G01J5/0806 , G01J5/05 , G01J5/068
Abstract: A sensor device includes a passive infrared sensor, a control circuit, and a lens that directs infrared radiation onto the passive infrared sensor. The lens includes an obstruction that asymmetrically blocks transmission of infrared radiation through the lens. The control circuit is configured to determine the direction of crossing of individuals passing in front of the sensor device based on sensor signals from the passive infrared sensor.
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公开(公告)号:US20250044157A1
公开(公告)日:2025-02-06
申请号:US18922683
申请日:2024-10-22
Applicant: PIXART IMAGING INC.
Inventor: MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
IPC: G01J5/04 , G01J5/00 , G01J5/05 , G01J5/0802 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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