READING METHOD FOR A MEMORY
    111.
    发明公开

    公开(公告)号:US20240304224A1

    公开(公告)日:2024-09-12

    申请号:US18583568

    申请日:2024-02-21

    CPC classification number: G11C7/08 G11C7/1048 G11C7/1069

    Abstract: The present disclosure relates to a method of reading a word in a memory device, wherein the word is comprised in a first set of words that can be read by the memory device, each word of the first set comprising at least one byte of data, each word being contained in memory cells, the method comprising a pre-charging step during which the first set and at least a second set of words are pre-charged, a first terminal of each cell of the first and second sets being floating during the pre-charging step.

    Sigma-delta analog-to-digital converter circuit with data sharing for power saving

    公开(公告)号:US12088326B2

    公开(公告)日:2024-09-10

    申请号:US17940236

    申请日:2022-09-08

    CPC classification number: H03M3/464 H03K3/356 H03M1/0626 H03M3/43

    Abstract: A continuous time, sigma-delta analog-to-digital converter circuit includes a sigma-delta modulator circuit configured to receive an analog input signal. A single bit quantizer of the modulator generates a digital output signal at a sampling frequency. A data storage circuit stores bits of the digital output signal and digital-to-analog converter (DAC) elements are actuated in response to the stored bits to generate an analog feedback signal for comparison to the analog input signal. A filter circuit includes polyphase signal processing paths and a summation circuit configured to sum outputs from the polyphase signal processing paths to generate a converted output signal. A fan out circuit selectively applies the stored bits from the data storage circuit to inputs of the polyphase signal processing paths of the filter circuit.

    PROCESS FOR MANUFACTURING LOCALIZED ION IMPLANTS IN SILICON-CARBIDE POWER ELECTRONIC DEVICES

    公开(公告)号:US20240297044A1

    公开(公告)日:2024-09-05

    申请号:US18583752

    申请日:2024-02-21

    CPC classification number: H01L21/0465

    Abstract: A manufacturing process provides for: forming a semiconductor body of silicon carbide, having a front surface; performing a localized ion implantation to form implanted regions in implant portions in the semiconductor body. The step of performing a localized ion implantation provides for: forming damaged regions at the front surface, separated from each other by the implant portions in a direction parallel to the front surface; performing a channeled ion implantation, for implanting doping ions within the semiconductor body and forming the implanted regions at the implant portions of the semiconductor body. The channeled ion implantation is performed in a self-aligned manner with respect to the damaged regions, which represent damaged regions of the silicon-carbide crystallographic lattice such as to block a propagation of the channeled ion implantation along a vertical axis orthogonal to the front surface, in a depth direction of the semiconductor body.

    VOLTAGE COMPENSATION OF DIFFERENTIAL VOLTAGE SWING

    公开(公告)号:US20240291488A1

    公开(公告)日:2024-08-29

    申请号:US18582446

    申请日:2024-02-20

    CPC classification number: H03K19/00369 H03K19/017545 H03K19/017581

    Abstract: The present disclosure is directed to a voltage driver, where a combination of first and second resistance blocks controls a differential voltage swing on the outputs of the voltage driver. Variations of an input voltage are compensated by adding different values of the first resistance block to the second resistance block, while keeping a summation of the first and second resistance blocks at a constant value. Three different circuit diagrams are disclosed to generate these different resistances. In each circuit diagram, one or more control signals change the resistance of the combination of first and second resistance blocks. In some embodiments, the value of the second resistance block is changed by the first resistance block to maintain an impedance matching between a transmitter and a receiver, while changing of the first resistance block compensates for the differential voltage swing.

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