Abstract:
There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m OMEGA /sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of che total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 mu m, a specific surface area of 0.5-5.0 m /g, and the scaly conductive powder having a mean particle size of 1.0-10.0 mu m and a specific surface area of 0.5-5.0 m /g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40 - 95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.
Abstract:
A low melting point powder toner the surface of which is coated with a thermosetting resin. The powder toner allows the achievement of satisfactory anti-blocking property with no elevation of the softening temperature, resulting in fixing at a low temperature. Such an effect is markedly significant in particular when the thermoplastic resin is a urea based resin and when the powder toner is a polymerization toner. The use of the above surface coated toner having a low softening temperature and low blocking tendency results in low temperature fixing, which allows the reduction of th e heat energy and time required for fixing, leading to energy saving and speed - up in a fixing step.
Abstract:
An adhesive composition having natural rubber fine particles uniformly dispersed in a radiation hardenable compound. The adhesive composition, when subjected to radiation hardening to thereby form a pressure sensitive adhesi ve layer on a substrate, exhibits satisfactory bonding strength. The adhesive composition can be satisfactorily compounded with various fillers, and dryin g time after coating can be short. Both overall surface coating and pattern coating can be easily performed, and the adhesive composition can be applied to various substrates, realizing satisfactory bonding strength between the substrate and the pressure sensitive adhesive layer. The adhesive compositio n can be produced by mixing water base emulsion (31) containing natural rubber fine particles (30) with radiation hardenable compound (32) and heating the mixture under agitation so as to evaporate off water from the water base emulsion, with the result that the medium wherein natural rubber fine particles are dispersed is changed from water to the radiation hardenable compound.
Abstract:
PROBLEM TO BE SOLVED: To ensure that a soft ink ribbon can be certainly cut, with regard to an ink ribbon cutting device which cuts a used heat transfer ink ribbon to small pieces. SOLUTION: The used ink ribbon roll 41 of a heat transfer type is twisted out of a band-like form into a twisted ink ribbon 41A by rotating the ink ribbon roll 41 in the conveyance direction and also rotating perpendicularly in an ink ribbon supply part 12. Further, the twisted ink ribbon 41A is conveyed and compacted by conveyance compacting rollers 15A and 15B into a twisted compact ink ribbon. After that, the twisted compact ink ribbon is cut to small pieces per prescribed length using a receiving blade 16 and a rotary cutter 17. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a packaging box which is equipped with handle pieces easy to grip. SOLUTION: The packaging box 1 has a pair of the front and rear side walls 2, 3, and a pair of the right and left side walls 4, 5, with the respective topmost ends of the pair of the front and rear side walls 2, 3 having lid pieces 8, 9 continuously installed thereto, through the medium of folding sections 30, 31, the lid pieces having their depths being of the same length as the widths of the pair of the right and left side walls 4, 5 and having folding sections 6, 7 at the centers in the direction of the depth. Handle pieces 10, 11 having finger-inserting holes 18, 22 are continuously attached respectively to the edge ends opposite to the connecting ends of these lid pieces 8, 9 with the pair of the front and rear side walls 2, 3, while engagement notches 12, 13, 14, 15 are provided on the vertical sections 8b, 9b of the lid pieces 8, 9, and engagement pieces 16, 17 that are engaged with the engagement notches 12, 13, 14, 15 are respectively installed on the respective topmost edge ends of the pair of the right and left side walls 4, 5. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
An IC card is provided with a module having an inlet; an adhesive layer covering the module; and a first base material and a second base material sandwiching the module by having the adhesive layer in between. The module is arranged on one surface of the first base material by having a cohesive layer in between. The cohesive layer has different thicknesses depending on the thickness of the portion of the module. The cohesive layer has both end portions thinner than other portions when viewed from the outer surface side of the first base material or the outer surface side of the second base material. Thus, the IC card having a flat surface is provided without generating distortion of an IC chip housed in the IC card.
Abstract:
A noncontact IC label includes an electrically insulating first board; an antenna coil provided on one plane of the first board; an IC chip electrically connected to the antenna coil; a magnetic layer provided to cover the antenna coil and the IC chip on the one plane of the first board; a first adhesive layer provided through the magnetic layer; an electrically insulating second board provided through the first adhesive layer; a second adhesive layer provided through the second board; peeling paper provided through the second adhesive layer; and an upper member provided on the other plane of the first board through a third adhesive layer.
Abstract:
A non-contact IC label comprising an electrically insulating first substrate; an electrically connected antenna coil and IC chip provided on one surface of said substrate; a magnetic layer provided on said one surface of said substrate so as to cover said antenna coil and said IC chip, a first adhesive layer provided on said magnetic layer, an electrically insulating second substrate provided on said first adhesive layer, a second adhesive layer provided on said second substrate, a release paper provided on said second adhesive layer, and an overlay material provided on a third adhesive layer on the other surface of said first substrate.
Abstract:
The present invention relates to a sheet with at least one built-in IC chip, the sheet being scarcely influenced by a mechanical external force and being free from loss or damage of the IC chip, and relates to a tape with at least one built-in IC chip used for the sheet with at least one built-in IC chip. The tape with at least one built-in IC chip is characterized in that a part or all of the IC chip 10 is embedded in a recessed portion 20a formed on a tape body, and the tape body 20 includes: a first base material 21; an adhesive layer 22 laminated on the first base material and formed of an adhesive; and a second base material 23 laminated on the adhesive layer; the second base material 23 being removed from the recessed portion 20a and the periphery thereof, and the adhesive in the recessed portion 20a of the adhesive layer 22 being pushed to the periphery thereof, and the pushed adhesive filling in a gap between the periphery of the IC chip 10 and the second base material 23.