公开(公告)号：EP2085914A1

公开(公告)日：2009-08-05

申请号：EP07831391.3

申请日：2007-11-07

Applicant: Toppan Forms Co., Ltd.

Inventor： SAKURAI, Takahiro ,  ITO, Yuichi

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

CPC classification number: G06K19/077 ,  B32B3/08 ,  B32B3/18 ,  B32B5/024 ,  B32B7/12 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/16 ,  B32B27/20 ,  B32B27/28 ,  B32B27/281 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2307/40 ,  B32B2307/402 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2307/714 ,  B32B2307/734 ,  B32B2425/00 ,  G06K19/07703 ,  Y10T29/49146

Abstract: The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material. According to the present invention, a card with embedded module is offered, which incorporates a display element as an electronic component, which renders the display section of this display element visible from the outside, and which is easy to manufacture.

Abstract translation: 本发明的窗基础材料上设置有在中间层具有透明树脂构成的窗部和有色部分围绕所述窗部的着色树脂构成的，并且透明的第一基底材料和第二基体材料夹住中间层 ， 与本发明的嵌入式模块的卡设置有具有一个模块的显示元件，粘合剂层上覆盖模块，以及成对的第三基材和第四基底材料，其与粘合剂层的插入夹持模块，worin第三 基体材料是由窗基础材料，和显示元件的显示部被设置成面对窗口基材的窗部。 。根据本发明，带有嵌入模块卡被提供，这包括显示器元件，如电子元件，这使得从外面该显示元件可见的显示部，并且所有这些都容易制造。

公开(公告)号：EP2093704B1

公开(公告)日：2012-05-30

申请号：EP07831392.1

申请日：2007-11-07

Applicant: Toppan Forms Co., Ltd.

Inventor： SAKURAI, Takahiro ,  ITO, Yuichi

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An IC card is provided with a module having an inlet; an adhesive layer covering the module; and a first base material and a second base material sandwiching the module by having the adhesive layer in between. The module is arranged on one surface of the first base material by having a cohesive layer in between. The cohesive layer has different thicknesses depending on the thickness of the portion of the module. The cohesive layer has both end portions thinner than other portions when viewed from the outer surface side of the first base material or the outer surface side of the second base material. Thus, the IC card having a flat surface is provided without generating distortion of an IC chip housed in the IC card.

公开(公告)号：EP2093704A1

公开(公告)日：2009-08-26

申请号：EP07831392.1

申请日：2007-11-07

Applicant: Toppan Forms Co., Ltd.

Inventor： SAKURAI, Takahiro ,  ITO, Yuichi

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.

Abstract translation: 该IC卡设置有具有入口的模块，覆盖模块的粘合剂层，以及插入粘合剂层的第一基材和夹着模块的第二基材。 模块设置在第一基材的一个表面上，插入粘性层，该粘性层的厚度根据模块的每个区域处的厚度而变化，并且当从外部观察时，其两端比其它部分窄 第一基材的表面侧或第二基材的外表面侧。 根据该IC卡，可以向IC卡提供平坦的表面，并且在嵌入式IC芯片中不产生应变。

公开(公告)号：EP2085914B1

公开(公告)日：2014-03-12

申请号：EP07831391.3

申请日：2007-11-07

Applicant: Toppan Forms Co., Ltd.

Inventor： SAKURAI, Takahiro ,  ITO, Yuichi

IPC: G06K19/077 ,  G06K19/07 ,  B32B5/14

CPC classification number: G06K19/077 ,  B32B3/08 ,  B32B3/18 ,  B32B5/024 ,  B32B7/12 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/16 ,  B32B27/20 ,  B32B27/28 ,  B32B27/281 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2307/40 ,  B32B2307/402 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2307/714 ,  B32B2307/734 ,  B32B2425/00 ,  G06K19/07703 ,  Y10T29/49146