公开(公告)号：EP2596534B1

公开(公告)日：2017-08-30

申请号：EP11739022.9

申请日：2011-07-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： WEIDNER, Karl ,  RAMCHEN, Johann ,  KALTENBACHER, Axel ,  WEGLEITER, Walter ,  BARCHMANN, Bernd ,  GRUBER, Stefan ,  BOGNER, Georg

IPC: H01L33/38 ,  H01L33/58 ,  H01L33/60 ,  H01L25/075 ,  H01L33/46 ,  G02F1/1335 ,  H01L33/40

CPC classification number: H01L33/60 ,  G02F1/133603 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/20 ,  H01L33/38 ,  H01L33/405 ,  H01L33/46 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1728280B1

公开(公告)日：2017-05-17

申请号：EP05715076.5

申请日：2005-03-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BRUNNER, Herbert ,  WINTER, Matthias ,  ZEILER, Markus ,  BOGNER, Georg ,  HÖFER, Thomas

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/60 ,  H01L33/54 ,  H01S5/022

CPC classification number: H01L33/60 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/54 ,  H01L2924/0002 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02292 ,  H01L2924/00

公开(公告)号：EP1771891B1

公开(公告)日：2015-11-11

申请号：EP05770747.3

申请日：2005-07-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  ENGL, Moritz ,  GRÖTSCH, Stefan ,  KROMOTIS, Patrick

IPC: H01L33/58 ,  H01L33/60 ,  H01L25/075 ,  F21S8/10

CPC classification number: H01L33/60 ,  F21S41/143 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP2591502A1

公开(公告)日：2013-05-15

申请号：EP11726076.0

申请日：2011-05-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： REILL, Joachim ,  BOGNER, Georg ,  GRÖTSCH, Stefan

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/64 ,  H01L27/15 ,  H01L33/46

CPC classification number: H01L25/13 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0203 ,  H05K1/05 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

Abstract: The invention relates to a light-emitting diode, comprising a carrier (1) having a mounting surface (11) and at least two light-emitting diode chips (2), which are fixed at least indirectly to the mounting surface (11) on the carrier (1), wherein the carrier (1) comprises a metal main body (12), an outer face (121) of the metal main body (12) comprises the mounting surface (11) and the at least two light-emitting diode chips (2) are connected in parallel to each other.

Abstract translation: 发光二极管包括具有安装面的载体，并且包括金属基体和至少两个至少两个发光二极管芯片，其至少间接地固定在安装面上，其中金属基体的外表面包括 所述至少两个发光二极管芯片彼此并联连接，所述至少两个发光二极管芯片嵌入在反射涂层中，所述反射涂层覆盖所述安装面和所述发光二极管的侧面 二极管芯片，并且发光二极管芯片以其辐射出射表面突出出反射涂层，并且辐射出射表面背离载体。

公开(公告)号：EP2436242A1

公开(公告)日：2012-04-04

申请号：EP10721292.0

申请日：2010-04-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  GRUBER, Stefan

IPC: H05K1/18 ,  H05K1/00 ,  H05K3/34 ,  H01K7/00

CPC classification number: H05K1/183 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

Abstract: An optoelectronic module is provided, which comprises a radiation-emitting semiconductor component (1), an electric component (2) and a carrier substrate (3). The carrier substrate (3) has an upper side (31) and an underside (33), wherein first electric connections (8) are disposed on the underside (33) and second electric connections (5a, 5b, 6a, 6b, 7a, 7b) on the upper side (31). The electric component (2) is disposed on the upper side (31) of the carrier substrate (3) and connected to the first electric connections (8) in an electrically conductive manner. The radiation-emitting semiconductor component (1) is disposed on the side of the electric component (2) that faces away from the carrier substrate (3). The radiation-emitting semiconductor component (1) further has conducting structures (4a, 4b), which are connected to the second electric connections (5a, 5b, 6a, 6b, 7a, 7b) in an electrically conductive manner. Furthermore, a method for producing such an optoelectronic module is provided.

公开(公告)号：EP2332186A1

公开(公告)日：2011-06-15

申请号：EP09744315.4

申请日：2009-08-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  HAHN, Berthold ,  HERRMANN, Siegfried

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/3442 ,  H01L2924/00

Abstract: At least one layer stack (1) of a substrate-less LED is arranged on a top of a substrate (4).  Contact surfaces are located on a side surface (14) of the substrate (4) which adjoins the top. Connections of the LED are connected to the contact surface by connecting lines (10, 20). The contact surfaces can in particular by formed by conductor layers (6) in solder fillets (5) on vertical edges of the substrate (4). For production, through-platings can be formed in a wafer provided with LEDs at the top, which after separating the wafer form metalized solder fillets on lateral edges of the substrate (4).

公开(公告)号：EP2328778A1

公开(公告)日：2011-06-08

申请号：EP09776096.1

申请日：2009-08-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  REILL, Joachim ,  ZEILER, Thomas

IPC: B60Q1/10

CPC classification number: B60Q1/0088 ,  F21S41/141 ,  F21S41/143 ,  F21S41/663 ,  F21Y2115/10

Abstract: The invention relates to a headlight having a plurality of luminescent diode emitters. Of the luminescent diode emitters, at least one first group is disposed in a matrix having at least two columns and at least two rows, wherein in the first group the electrical connections of a first connection type of the luminescent diode emitter of a column and the electrical connections of a second connection type of the luminescent diode emitters of a row are electrically connected to each other. The electrical connections of the first connection type of different columns and the electrical connections of the second type of different rows of the matrix are electrically isolated from each other.

Abstract translation: 头灯包括多个发光二极管发射器。 至少一个第一组发光二极管发射器被布置在具有至少两列和至少两行的矩阵中，其中在第一组中，第一连接类型的发光二极管发射极和电的电连接 一行的发光二极管发射器的第二连接类型的连接在每种情况下彼此电连接。 不同列的第一连接类型和矩阵的不同行的第二连接类型的电连接的电连接彼此电绝缘。

公开(公告)号：EP2218118A1

公开(公告)日：2010-08-18

申请号：EP08861500.0

申请日：2008-11-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  GRUBER, Stefan ,  ZITZLSPERGER, Michael

IPC: H01L33/00 ,  H01L25/16 ,  H01L25/075

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014

Abstract: The invention relates to an arrangement comprising at least one optoelectronic semiconductor component (101), said arrangement comprising a carrier element arrangement (108) suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body (103) consisting of a light-absorbent plastic material, which is arranged on the carrier element arrangement. The housing body comprises a raised area (104) and a set-back area (105) between which an inclined flank (115) is formed. The set-back area extends up to the optoelectronic semiconductor component, in order to reduce reflections.

公开(公告)号：EP1440481B1

公开(公告)日：2007-09-19

申请号：EP02776861.3

申请日：2002-10-28

Applicant: Osram Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  BRUNNER, Herbert ,  KRÄUTER, Gertrud ,  WAITL, Günter

IPC: H01L33/00 ,  H01L31/0203

CPC classification number: H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: The invention concerns an optoelectronic component, in particular an optoelectronic component adapted to be surface-mounted, comprising a housing body (2), an optoelectronic semiconductor chip (3) arranged in particular in a recess (6) of the housing body, and electrical connections (1A, 1B), the semiconductor chip being in electroconductive connection with the electrical connections of the conductor network. The housing body (2) is made of a sheathing material, in particular a plastic material, filled with a filler material having a high degree of reflection in a wavelength range less than about 500 nm.

公开(公告)号：EP1728280A1

公开(公告)日：2006-12-06

申请号：EP05715076.5

申请日：2005-03-09

Applicant: Osram Opto Semiconductors GmbH

Inventor： BRUNNER, Herbert ,  WINTER, Matthias ,  ZEILER, Markus ,  BOGNER, Georg ,  HÖFER, Thomas

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/54 ,  H01L2924/0002 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02292 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component (1) comprising a housing body (2) and at least one semiconductor chip (8) that is situated on the housing body. Said housing body comprises a base part (13), with a connection body (16) that is provided with a conductive connection material (6, 7) and a reflector part (14) comprising a reflector body (23), provided with a reflector material (9). The connection body and the reflector body are pre-formed separately and the reflector body is then placed on the connection body as a reflector attachment.

Abstract translation: 提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13） 导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在该反射器部分上，其中所述连接器主体和所述反射器主体被预成型 彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。