Abstract:
An electrical contact for an electric switching apparatus which includes a contact carrier and contact overlay soldered to one of the surfaces of the carrier. The improvement of the invention comprises at least one longitudinal slot disposed in the contact along the arc travel direction thereof which forms a blind hole in the contact open at the end thereof along the arc travel direction.
Abstract:
A weld tip for bonding fine electrical conductor wire to electrical components is formed of chemically vapor deposited high melting point refractory material, such as tungsten, free of lower melting point cementitious bonding material, by chemical vapor deposit of said material about a mold which provides a mold smooth guide passage for the wire.
Abstract:
A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy for joining electronic parts comprising Sn, Ag, Bi, Cu and In as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 81 to 91 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.
Abstract:
A method of transferring conductive balls via a suction head without picking up errors and mounting errors includes moving a suction head with pores towards the conductive balls located in a case and applying a vacuum pressure to the pores to suck and pick up the conductive balls. While the suction head is moved away from the case, the suction head is vibrated by oscillators at different frequencies changed within a predetermined frequency range, thereby dropping redundant conductive balls from the suction head. Further, the suction head is moved to a position above a work piece and moved towards the work piece. The pores are communicated with atmosphere to mount the conductive balls onto the work piece. While the suction head is away from the work piece, the suction head is vibrated by oscillators at different frequencies changed within a predetermined frequency range.
Abstract:
A method of forming a solder ball structure comprising the steps of 1) obtaining a first object having at least one high melting point solder ball, each solder ball having a corresponding BLM containing a low melting point solder, each solder ball having an outer surface, top and bottom, each BLM having a top and bottom, the bottom of each solder ball in contact with the top of the corresponding BLM over a portion of the outer surface, the bottom of each BLM in electrical communication with the first object; 2) obtaining a template having a first surface; 3) applying a disjoint area of low melting point solder paste to the first surface of the template; 4) interacting the top of each solder ball and the solder paste; and 5) reflowing each solder ball and disjoint area of solder paste while each solder ball and disjoint area of solder paste are interacted.
Abstract:
Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.5 and 6.5 weight percent Ag, between 0.5 and 8.0 weight percent Bi, and optionally including one or more of the following elements: between 0.1 and 10.0 weight percent In, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.1 and 0.8 weight percent Ag, between 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 1.0 weight percent, Ga in an amount of not greater than 1.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent.
Abstract:
A single reservoir contains brazing filler metal. A first electromagnetic induction pump extends vertically along a vertical plate portion at a workpiece inlet side. A second electromagnetic induction pump extends vertically along a vertical plate portion at the workpiece outlet side. Heaters for melting the brazing filler metal are disposed between the first electromagnetic induction pump and the second electromagnetic induction pump. Each electromagnetic induction pump has a first iron core having an induction coil wound therearound disposed at the outer side of a vertical plate portion at the workpiece inlet side or the workpiece outlet side respectively. A second iron core is disposed at the inner side of the respective vertical plate portion. A brazing filler metal rising gap is disposed between the second iron cores.
Abstract:
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.