Electrical contact construction
    111.
    发明授权
    Electrical contact construction 失效
    电接触结构

    公开(公告)号:US4015097A

    公开(公告)日:1977-03-29

    申请号:US579545

    申请日:1975-05-21

    CPC classification number: H01H11/043 B23K1/20 B23K2201/36

    Abstract: An electrical contact for an electric switching apparatus which includes a contact carrier and contact overlay soldered to one of the surfaces of the carrier. The improvement of the invention comprises at least one longitudinal slot disposed in the contact along the arc travel direction thereof which forms a blind hole in the contact open at the end thereof along the arc travel direction.

    Abstract translation: 一种用于电气开关设备的电接触件,其包括焊接到所述载体的一个表面的接触载体和接触覆盖层。 本发明的改进包括沿着其电弧行进方向设置在接触件中的至少一个纵向狭槽,其沿着电弧移动方向在其端部处在接触开口处形成盲孔。

    Solder alloy of electrode for joining electronic parts and soldering
method
    115.
    发明授权
    Solder alloy of electrode for joining electronic parts and soldering method 失效
    用于接合电子零件的电极焊接合金和焊接方法

    公开(公告)号:US6077477A

    公开(公告)日:2000-06-20

    申请号:US011393

    申请日:1998-02-05

    Abstract: A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy for joining electronic parts comprising Sn, Ag, Bi, Cu and In as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 81 to 91 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.

    Abstract translation: PCT No.PCT / JP97 / 01969 Sec。 371日期:1998年2月5日 102(e)日期1998年2月5日PCT提交1997年6月6日PCT公布。 公开号WO97 / 46350 PCT 日期1997年12月11日提出了一种用于接合电子部件质地细小且耐热疲劳特性优异的电极的无铅焊料合金。 这是用于连接包含Sn,Ag,Bi,Cu和In的电子部件作为主要组分的焊料合金,更具体地说,用于接合含有81至91重量%的电子部件的电极用焊料合金。 Sn的%,3.0〜6.0重量% 的Ag,0.1〜2.0重量%。 %的铜。 通过向主要由Sn组成的焊料中添加少量的Ag,形成微细的合金织构,并且纹理变化减小,从而获得耐热疲劳性优异的合金。 此外,通过添加少量的Cu,形成金属间化合物,结合强度提高。

    Method of transferring conductive balls onto work piece
    116.
    发明授权
    Method of transferring conductive balls onto work piece 失效
    将导电球转移到工件上的方法

    公开(公告)号:US6065201A

    公开(公告)日:2000-05-23

    申请号:US64748

    申请日:1998-04-23

    Applicant: Tadahiko Sakai

    Inventor: Tadahiko Sakai

    Abstract: A method of transferring conductive balls via a suction head without picking up errors and mounting errors includes moving a suction head with pores towards the conductive balls located in a case and applying a vacuum pressure to the pores to suck and pick up the conductive balls. While the suction head is moved away from the case, the suction head is vibrated by oscillators at different frequencies changed within a predetermined frequency range, thereby dropping redundant conductive balls from the suction head. Further, the suction head is moved to a position above a work piece and moved towards the work piece. The pores are communicated with atmosphere to mount the conductive balls onto the work piece. While the suction head is away from the work piece, the suction head is vibrated by oscillators at different frequencies changed within a predetermined frequency range.

    Abstract translation: 一种通过吸头传递导电球而不引起误差和安装误差的方法包括将具有孔的吸头朝向位于壳体中的导电球移动,并向孔隙施加真空压力以吸引和拾取导电球。 当吸头离开壳体时,吸头由在预定频率范围内变化的不同频率的振荡器振动,从而从吸头放下多余的导电球。 此外,吸头移动到工件上方的位置并朝向工件移动。 孔与大气连通以将导电球安装到工件上。 当吸头远离工件时,吸头由在预定频率范围内变化的不同频率的振荡器振动。

    High strength lead-free solder materials
    118.
    发明授权
    High strength lead-free solder materials 失效
    高强度无铅焊料

    公开(公告)号:US5985212A

    公开(公告)日:1999-11-16

    申请号:US764293

    申请日:1996-12-12

    CPC classification number: B23K35/262 B23K2201/36

    Abstract: Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.5 and 6.5 weight percent Ag, between 0.5 and 8.0 weight percent Bi, and optionally including one or more of the following elements: between 0.1 and 10.0 weight percent In, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.1 and 0.8 weight percent Ag, between 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 1.0 weight percent, Ga in an amount of not greater than 1.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent.

    Abstract translation: 由至少75.0重量%Sn,0.01至9.5重量%Cu,约0.1至10.0重量%之间的In和任选地包括一种或多种以下元素组成的无铅焊料组合物:不大于 9.0重量%,不大于5.0重量%的Se或Te,不大于5.0重量%的Ga,不大于1.0重量%的Sb,不大于 1.0重量%。 由至少75.0重量%的Sn,0.5至6.5重量%的Ag,0.5至8.0重量%的Bi,以及任选地包括一个或多个以下元素组成的无铅焊料组合物:0.1至10.0重量%的In,Se 或Te不大于5.0重量%的量,Ga不大于5.0重量%。 由至少75.0重量%Sn,0.1至0.8重量%Ag,0.1至10.0重量%之间的In和任选地包括以下元素中的一种或多种组成的无铅焊料组合物:不大于9.0的Zn 重量百分数,不大于1.0重量%的Se或Te,不大于1.0重量%的Ga,不大于1.0重量%的Sb,不大于1.0的Al 重量百分比。

    Brazing apparatus having electromagnetic induction pumps for moving a
brazing filler metal in contact with a workpiece
    119.
    发明授权
    Brazing apparatus having electromagnetic induction pumps for moving a brazing filler metal in contact with a workpiece 失效
    具有用于移动与工件接触的钎料的电磁感应泵的钎焊装置

    公开(公告)号:US5981922A

    公开(公告)日:1999-11-09

    申请号:US11453

    申请日:1998-06-11

    CPC classification number: B23K3/0653 B23K2201/36

    Abstract: A single reservoir contains brazing filler metal. A first electromagnetic induction pump extends vertically along a vertical plate portion at a workpiece inlet side. A second electromagnetic induction pump extends vertically along a vertical plate portion at the workpiece outlet side. Heaters for melting the brazing filler metal are disposed between the first electromagnetic induction pump and the second electromagnetic induction pump. Each electromagnetic induction pump has a first iron core having an induction coil wound therearound disposed at the outer side of a vertical plate portion at the workpiece inlet side or the workpiece outlet side respectively. A second iron core is disposed at the inner side of the respective vertical plate portion. A brazing filler metal rising gap is disposed between the second iron cores.

    Abstract translation: PCT No.PCT / JP97 / 01982 Sec。 371日期:1998年6月11日 102(e)1998年6月11日日期PCT 1997年6月10日PCT公布。 第WO97 / 47422号公报 日期1997年12月18日单个储存器含有钎料。 第一电磁感应泵在工件入口侧沿垂直板部分垂直延伸。 第二电磁感应泵在工件出口侧沿垂直板部分垂直延伸。 用于熔化钎料的加热器设置在第一电磁感应泵和第二电磁感应泵之间。 每个电磁感应泵具有分别设置在工件入口侧或工件出口侧的垂直板部分的外侧的缠绕在其周围的感应线圈的第一铁芯。 第二铁芯设置在相应垂直板部分的内侧。 在第二铁芯之间设置有钎料填充金属上升间隙。

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