公开(公告)号：CN108140589A

公开(公告)日：2018-06-08

申请号：CN201680053556.4

申请日：2016-08-17

Applicant: EO科技股份有限公司

Inventor： 李学龙 ,  朴相永 ,  金洛训 ,  崔淏喆

IPC: H01L21/66 ,  H01L21/268

CPC classification number: H01L21/268 ,  B23K26/032 ,  B23K26/362 ,  B23K26/40 ,  B23K2101/40 ,  B23K2201/40 ,  H01L22/30

Abstract: 本发明揭示一种用于检查激光加工装备的加工品质的检查装置及方法。激光加工装备向加工对象物的内部照射激光束而形成重整区域。所揭示的自动检查装置包括：图像薄膜，涂布至上述加工对象物的下表面；图像检测单元，检测因照射上述激光束而形成于上述图像薄膜的上述加工对象物的损伤图像；以及图像处理单元，对借由上述图像检测单元而检测到的损伤图像进行处理。

公开(公告)号：CN108136544A

公开(公告)日：2018-06-08

申请号：CN201680058621.2

申请日：2016-10-04

Applicant: 肖特股份有限公司

Inventor： A·奥特纳 ,  A·赛德尔 ,  F-T·雷特斯 ,  F·瓦格纳

IPC: B23K26/53

CPC classification number: B23K26/53 ,  B23K26/042 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/0884 ,  B23K26/351 ,  B23K2101/40 ,  B23K2201/40

Abstract: 本发明涉及一种用于丝化非传导性的工件(1)的方法和装置，其中，所述工件具有在0.5mm和20mm之间的厚度并且此外该厚度在空间上变化和/或限定所述工件的边界面(11、12)中的至少一个具有曲率半径在0.1μm至10m之间的至少一个曲率，以及此外涉及一种具有特别构造的边沿(41)的非传导性的工件(1)。

公开(公告)号：US6145735A

公开(公告)日：2000-11-14

申请号：US150673

申请日：1998-09-10

Applicant: Michael T. Mallery ,  James K. Lake

Inventor： Michael T. Mallery ,  James K. Lake

IPC: B23K1/008 ,  B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  B23K35/12

CPC classification number: B23K1/008 ,  B23K35/0222 ,  H05K3/3484 ,  B23K2201/40 ,  B23K35/025 ,  H05K2201/10636 ,  H05K2203/0338 ,  H05K3/3442 ,  Y02P70/611

Abstract: Solder is deposited on chip elements or other potentially irregular surfaces by applying solder paste to a thin porous sheet such as cotton twill cloth so that the solder paste fills open areas therein. The solder volume is thus regulated by the texture and structure of the porous sheet. The porous sheet is then placed in compression against the surface to which solder is to be applied and the solder in the solder paste reflowed in an oven, preferably including a nitrogen atmosphere. At the same time, excess flux is absorbed by the porous sheet to facilitate subsequent cleaning while the reflow of solder is accurately and repeatably controlled. The process and resulting structure are particularly appropriate to the manufacture of discrete electronic devices which include an array of chip components such as capacitor chips sandwiched between plate structures. The process and structure also provides highly repeatable, high quality solder connections between curved surfaces.

Abstract translation: 通过将焊膏涂布到诸如棉斜纹布之类的薄多孔板上，将焊料沉积在芯片元件或其它可能不规则的表面上，使得焊膏填充其中的开放区域。 因此，焊料体积由多孔片材的质地和结构调节。 然后将多孔片材压在待施加焊料的表面上，并且焊膏中的焊料在烘箱中回流，优选地包括氮气氛。 同时，多余的片材吸收了过量的助焊剂，从而便于后续的清洗，而焊料的回流精确和可重复地被控制。 该方法和结果结构特别适用于分立电子器件的制造，其包括诸如夹在板结构之间的电容器芯片的芯片组件阵列。 该工艺和结构还提供了弯曲表面之间高度可重复，高质量的焊接连接。

公开(公告)号：US6142361A

公开(公告)日：2000-11-07

申请号：US458483

申请日：1999-12-09

Applicant: Francis J. Downes, Jr. ,  Robert M. Japp ,  Mark V. Pierson

Inventor： Francis J. Downes, Jr. ,  Robert M. Japp ,  Mark V. Pierson

IPC: H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  B23K1/20 ,  B23K31/02

CPC classification number: H01L24/81 ,  B23K2201/40 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/303 ,  H05K3/3436 ,  Y10T29/4913 ,  Y10T29/53196

Abstract: A method, and associated structure, for adhesively coupling a chip to an organic chip carrier. The chip is attached to a top surface of the organic chip carrier by interfacing a solder bump between a C4 solder structure on the chip and a pad on a top surface of the chip carrier. The melting temperature of the solder bump is less than the melting temperature of the C4 solder structure. A block of ferrous material is placed on a top surface of the chip. A temporary or permanent stiffener of ferrous material is placed on the top surface of the chip carrier. A permanent magnet is coupled to a bottom surface of the chip carrier. Alternatively, an electromagnetic could be utilized instead of the electromagnet. Due to the permanent magnet or the electromagnet, a magnetic force on the stiffener is directed toward the magnet and substantially flattens the first surface of the chip carrier. Similarly, a magnetic force on the block is directed toward the magnet such that the electronic component and the chip carrier are held in alignment. The solder bump is reflowed at a temperature between the melting temperature of the solder bump and the melting temperature of the C4 solder structure. The reflowing reconfigures the solder bump. The magnetic force on the block frictionally clamps the reflowed solder between the C4 solder structure and the pad. The chip and carrier are cooled, resulting in the C4 solder structure being adhesively and conductively coupled to the pad.

Abstract translation: 一种用于将芯片粘合地耦合到有机芯片载体的方法和相关联的结构。 芯片通过在芯片上的C4焊料结构和芯片载体的顶表面上的焊盘之间接合焊料凸块来附接到有机芯片载体的顶表面。 焊料凸点的熔化温度小于C4焊料结构的熔化温度。 将一块黑色金属材料放置在芯片的上表面上。 铁芯材料的临时或永久性加强件被放置在芯片载体的顶表面上。 永磁体耦合到芯片载体的底表面。 或者，可以使用电磁来代替电磁体。 由于永磁体或电磁体，加强件上的磁力被引向磁体并且基本平坦化芯片载体的第一表面。 类似地，块上的磁力指向磁体，使得电子部件和芯片载体保持对准。 在焊料凸块的熔化温度和C4焊料结构的熔化温度之间的温度下回流焊料凸点。 回流重新配置焊料凸块。 块上的磁力摩擦地夹住C4焊料结构和焊盘之间的回流焊料。 芯片和载体被冷却，导致C4焊料结构被粘性地导电耦合到焊盘。

公开(公告)号：US6142358A

公开(公告)日：2000-11-07

申请号：US866954

申请日：1997-05-31

Applicant: Michael B. Cohn ,  Roger T. Howe

Inventor： Michael B. Cohn ,  Roger T. Howe

IPC: B23K1/00 ,  B81B7/00 ,  H01L21/68 ,  B23K31/02 ,  B23K1/018 ,  H01L23/52 ,  B65G49/07

CPC classification number: H01L21/6835 ,  B23K1/0016 ,  B81B7/00 ,  B23K2201/40 ,  H01L2221/68359 ,  H01L2924/30105 ,  Y10S414/135 ,  Y10S414/136

Abstract: Break-away tethers to secure electronic, mechanical, optical, or other microstructures, during release from one substrate and transfer to another. Microstructures are fabricated with integrated tethers attaching them to a first substrate. The structures are undercut by etching and contacted and bonded to a second substrate. First and second substrates are separated, breaking the tethers.

Abstract translation: 脱离系绳以在从一个基板释放并转移到另一个基板时固定电子，机械，光学或其他微结构。 微结构制造具有将其附接到第一基底的集成系绳。 该结构通过蚀刻被切割并接触并结合到第二基底。 分离第一和第二底物，破坏系绳。

公开(公告)号：US6142356A

公开(公告)日：2000-11-07

申请号：US310341

申请日：1999-05-12

Applicant: Masao Yamazaki ,  Terumitsu Santo

Inventor： Masao Yamazaki ,  Terumitsu Santo

IPC: H01L21/52 ,  B23K1/002 ,  H01L21/00 ,  H01L21/68 ,  B23K37/00 ,  B23K1/14 ,  B23K37/04 ,  B23K1/00 ,  B23K5/00 ,  B23K20/00 ,  B23Q15/00 ,  B23Q16/00

CPC classification number: H01L21/6835 ,  B23K1/002 ,  H01L21/67144 ,  H01L24/75 ,  B23K2201/40 ,  H01L2224/83192 ,  H01L2924/14

Abstract: An object of the invention is to surely bond a semiconductor chip onto a chip substrate by heat-melting a brazing filler metal as required. A die bonding apparatus which is provided with a substrate holder for holding a chip substrate, a collet for conveying and pressing a semiconductor chip onto the chip substrate held by the substrate holder, a heater for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip, a temperature sensor for detecting the heating temperature of the brazing filler metal, and controlling means for controlling the heater based on the temperature detected by the temperature sensor. The temperature sensor is disposed in the collet.

Abstract translation: 本发明的目的是通过根据需要对钎焊料进行加热熔融来将半导体芯片确实地粘接在芯片基板上。 一种芯片接合装置，其具有用于保持芯片基板的基板保持件，用于将半导体芯片输送并按压到由基板保持器保持的芯片基板上的夹头，用于将插入在芯片之间的钎料加热熔融的加热器 基板和半导体芯片，用于检测钎料的加热温度的温度传感器，以及用于基于由温度传感器检测到的温度来控制加热器的控制装置。 温度传感器设置在夹头中。

公开(公告)号：US6138894A

公开(公告)日：2000-10-31

申请号：US199526

申请日：1998-11-25

Applicant: Kenneth R. Ulmer

Inventor： Kenneth R. Ulmer

IPC: B23K20/10 ,  H01L21/60 ,  H05K3/34 ,  B23K1/06

CPC classification number: H01L24/81 ,  B23K20/10 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/13144 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0367 ,  H05K2203/0278 ,  H05K2203/0285 ,  H05K3/3494 ,  Y02P70/613

Abstract: A technique is utilized for coupling a circuit component to a substrate. The circuit component, such as a die, includes a plurality of contacts on one of its surfaces. The contacts may take the form of gold bumps. Solder is placed between the contacts of the circuit component and the contact pads of a substrate. The substrate is heated to about the melting point of the solder, and pressure and ultrasonic energy are used to cause the solder to couple the contacts of the circuit component to the contact pads of the substrate.

Abstract translation: 利用一种将电路组件耦合到衬底的技术。 诸如管芯的电路部件在其一个表面上包括多个触点。 触点可能采取金块的形式。 焊料放置在电路部件的触点和基板的接触焊盘之间。 衬底被加热到焊料的熔点，并且使用压力和超声波能量使焊料将电路部件的触点耦合到衬底的接触焊盘。

公开(公告)号：US6138891A

公开(公告)日：2000-10-31

申请号：US350692

申请日：1999-07-09

Applicant: Sven Evers ,  Craig T. Clyne

Inventor： Sven Evers ,  Craig T. Clyne

IPC: B23K20/00 ,  H01L21/00 ,  H01L21/687 ,  B23K37/04 ,  B23Q3/06

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K2201/40 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/78703 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

公开(公告)号：US06138562A

公开(公告)日：2000-10-31

申请号：US208959

申请日：1998-12-10

Applicant: Allen D. Hertz ,  Eric L. Hertz ,  Dennis D. Epp

Inventor： Allen D. Hertz ,  Eric L. Hertz ,  Dennis D. Epp

IPC: B23K1/08 ,  B41F15/12 ,  B41M1/12 ,  H05K3/12 ,  H05K3/34

CPC classification number: B23K1/085 ,  B41F15/12 ,  B41M1/125 ,  H05K3/1233 ,  B23K2201/40 ,  B41P2215/13 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K3/3415

Abstract: Solder Paste, adhesives and other materials are screen printed onto Printed Circuit Boards (PCB's) during the assembly process for electronic circuit assemblies. Pressure forces may be applied to the material to aid in separating the material from the apertures within the stencil. The pressure forces are created from sound pressure waves generated from a vibrational energy source located some distance from the stencil. Examples of non-contacting vibrational energy sources include Ultrasonic transducers, horns, speakers, and tuning forks. Additional assistance to separate the material from the apertures may be applied by a vibrational source by contacting to the stencil. Examples of the contacting vibrational energy sources may be off-balanced motors, piezo-electric transducers, and mass-resonant vibrators.

Abstract translation: 在电子电路组件的组装过程中，焊膏，粘合剂和其他材料被丝网印刷到印刷电路板（PCB）上。 可以将压力施加到材料上以帮助将材料与模板中的孔分离。 压力由距离模板一定距离的振动能源产生的声压波产生。 非接触振动能源的实例包括超声波换能器，喇叭，扬声器和调音叉。 可以通过与模板接触的振动源来应用从孔中分离材料的附加帮助。 接触振动能源的示例可以是不平衡的电动机，压电换能器和质量共振振动器。

公开(公告)号：US6135344A

公开(公告)日：2000-10-24

申请号：US123869

申请日：1998-07-28

Applicant: Seiki Sakuyama ,  Taro Matsuoka

Inventor： Seiki Sakuyama ,  Taro Matsuoka

IPC: B23K1/008 ,  B23K1/012 ,  F27B9/06 ,  F27B9/10 ,  F27B9/24 ,  F27D7/04 ,  H05K3/34 ,  B23K31/02 ,  B23K1/00 ,  B23K5/00 ,  D06E75/24 ,  F27B14/00

CPC classification number: F27B9/243 ,  B23K1/012 ,  F27B9/10 ,  B23K2201/40 ,  F27B9/066 ,  F27D7/04 ,  H05K3/3494

Abstract: A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.

Abstract translation: 将印刷基板和安装在其上的多个电子部件进行回流焊接的回流焊炉。 该炉包括回流焊炉体，其包括由炉壁限定的多个加热区，热气施加器和辐射加热器。 热气体施加器包括热源和用于将每个区域的温度低于目标温度的热气体相对于印刷板吹送的风扇。 辐射加热器包括用于将高于目标温度的温度的辐射热施加到印刷板的加热器。 借助于来自加热器的辐射热将印刷电路板和其上的电子部件加热到目标温度，焊料的熔点。 在这些电子部件中，通过来自热气体加热器的低温热气，能够抑制热容量相对较小的小型化部件的过热。