公开(公告)号：US07324348B2

公开(公告)日：2008-01-29

申请号：US11171081

申请日：2005-06-28

Applicant: Robin Berg, Jr. ,  Todd Husom ,  Derek Sayres

Inventor： Robin Berg, Jr. ,  Todd Husom ,  Derek Sayres

IPC: H05K5/00

CPC classification number: H04Q1/10 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/1425 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一边缘上的翅片。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

公开(公告)号：US07126820B2

公开(公告)日：2006-10-24

申请号：US10869179

申请日：2004-06-15

Applicant: Wen Wei

Inventor： Wen Wei

IPC: H05K7/20

CPC classification number: H05K7/20563 ,  H04Q1/035 ,  H04Q1/15 ,  H04Q2201/06 ,  H04Q2201/12

Abstract: A modular platform is provided. The modular platform includes a modular platform shelf configured to receive modular platform boards, and a dual plenum coupled to the modular platform shelf, the modular platform configured to couple to a plenum portion of a dual plenum of another modular platform or a stand-alone plenum.

Abstract translation: 提供了一个模块化平台。 模块化平台包括被配置为接收模块化平台板的模块化平台架，以及耦合到模块化平台架的双重增压室，所述模块化平台被配置为连接到另一模块化平台或独立集气室的双重增压室的增压室部分 。

公开(公告)号：US20060110117A1

公开(公告)日：2006-05-25

申请号：US10993376

申请日：2004-11-19

Applicant: Sam Denovich ,  Bruce Barry ,  James Eberle ,  John Hoffer

Inventor： Sam Denovich ,  Bruce Barry ,  James Eberle ,  John Hoffer

IPC: G02B6/00

CPC classification number: H04Q1/06 ,  G02B6/4452 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q2201/02 ,  H04Q2201/06

Abstract: A cable management system includes an equipment system, and at least one patch panel having a connectivity interface. The connectivity interface is configured to connect with at least one cable extending from the equipment system. The cable management system also includes a manifold configured to be located between the equipment system and the patch panel. The manifold includes an inlet and an outlet, and the manifold is configured to direct the at least one cable from the equipment system to the connectivity interface.

公开(公告)号：US20060002098A1

公开(公告)日：2006-01-05

申请号：US11171081

申请日：2005-06-28

Applicant: Robin Berg ,  Todd Husom ,  Derek Sayres

Inventor： Robin Berg ,  Todd Husom ,  Derek Sayres

IPC: H05K7/18

CPC classification number: H04Q1/10 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/1425 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

公开(公告)号：US20050276017A1

公开(公告)日：2005-12-15

申请号：US10865532

申请日：2004-06-10

Applicant: Farid Aziz ,  Thomas Currie ,  Marko Nicolici

Inventor： Farid Aziz ,  Thomas Currie ,  Marko Nicolici

IPC: H04Q1/02 ,  H05K7/20

CPC classification number: H04Q1/035 ,  H04Q1/023 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K7/20572

Abstract: An air flow distribution system for a telecommunication equipment assembly is disclosed. The telecommunications equipment assembly includes a chassis. The chassis is formed by wall panels and includes a first side, a second side, a bottom end section, a top end section, electronic apparatuses regions and a plenum region having plenum region boundaries. The telecommunication equipment assembly also includes a first side air input port and a second side air input port in the bottom end section of the chassis. The input ports permit cooling air to be drawn into the chassis. An output port is provided in the top end section of the chassis. A fan holder is located along one of the plenum region boundaries. The fan holder receives a fan to facilitate air movement in conjunction with the plenum region. The air movement includes movement along air flow paths through the electronic apparatuses regions. The electronic apparatuses and plenum regions are located above the input ports and below the output port. The electronic apparatuses regions border another of the plenum region boundaries.

Abstract translation: 公开了一种用于电信设备组件的气流分配系统。 电信设备组件包括底盘。 底盘由墙板形成，包括第一侧，第二侧，底端部分，顶端部分，电子设备区域和具有增压区域边界的集气室区域。 电信设备组件还包括在底盘的底端部分中的第一侧空气输入端口和第二侧空气输入端口。 输入端口允许冷却空气被吸入机箱。 输出端口设置在机箱的顶端部分。 一个风扇架位于其中一个增压室区域边界。 风扇架接收风扇以便于与集气室区域一起运动空气。 空气运动包括沿着通过电子设备区域的空气流动路径的运动。 电子设备和增压区域位于输入端口的上方和输出端口下方。 电子设备区域与另一个气室区域边界相交。

公开(公告)号：US20050078449A1

公开(公告)日：2005-04-14

申请号：US10947895

申请日：2004-09-23

Applicant: Babak Makooi ,  George Guzik ,  Guy Cole ,  Arthur Croone ,  Earl Edwards ,  Don Harlan ,  Christian Polacek-Attenberger ,  Siegwald Schuster

Inventor： Babak Makooi ,  George Guzik ,  Guy Cole ,  Arthur Croone ,  Earl Edwards ,  Don Harlan ,  Christian Polacek-Attenberger ,  Siegwald Schuster

IPC: H04Q1/02 ,  H04Q1/14 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K7/20563 ,  H04Q1/035 ,  H04Q2201/06 ,  H05K7/1425

Abstract: Retarding a fire condition of a telecommunications component mounted on a module to be inserted into a telecommunications box is provided. The module may have a planar surface having a first side and a second side generally opposed to the first side. A ventilator provides a cross air flow generally in a direction from the first side to the second side. A first opening in the telecommunications box in an area adjacent of the first side of the planar surface forms a substantial portion of the cross air flow emanating from the first side. A second opening in the telecommunications box arranged in an area adjacent to the second side of the planar surface exhausts the cross flow air, such that the cross flow air sub-stantially retards the fire condition. An air flow guide is provided to simulate an air resistance of a module.

Abstract translation: 提供了安装在要插入电信箱的模块上的电信部件的火情状态。 模块可以具有平坦的表面，该平坦表面具有与第一侧大致相对的第一侧和第二侧。 通气机一般在从第一侧到第二侧的方向上提供十字空气流。 电信箱中在与平面的第一侧相邻的区域中的第一开口形成从第一侧发出的交叉气流的实质部分。 布置在与平坦表面的第二侧相邻的区域中的电信箱中的第二开口排出横流空气，使得横流空气基本上延迟了火情。 提供气流引导器来模拟模块的空气阻力。

公开(公告)号：US06657861B2

公开(公告)日：2003-12-02

申请号：US10203910

申请日：2002-08-15

Applicant: Günter Irmer

Inventor： Günter Irmer

IPC: H05K720

CPC classification number: H04Q1/14 ,  H02B1/013 ,  H02B1/50 ,  H02B1/565 ,  H04Q1/025 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10

Abstract: A distribution cabinet (1) for accommodating weak-current distribution installations, in particular for arranging outdoors, having a base box (2), an outer cabinet body (3) with at least one door (4), a cabinet cover (5), and an inner installation frame (6), the installation frame (6) being made up of profile sections (50), of which the cross-sectional shapes has two insertion pockets (51a,b), of which the insertion directions (52a,b) run at right angles to one another.

Abstract translation: 一种用于容纳弱电流分配装置的配电柜（1），特别用于布置在户外，具有底盒（2），具有至少一个门（4）的外柜主体（3），柜盖（5） 安装框架（6）由轮廓部分（50）构成，其横截面形状具有两个插入口（51a，b），其中插入方向（52a，b） ）彼此直角运行。

公开(公告)号：US06625019B1

公开(公告)日：2003-09-23

申请号：US10114231

申请日：2002-04-01

Applicant: Joseph Steinman ,  Greg Lowe

Inventor： Joseph Steinman ,  Greg Lowe

IPC: H05K720

CPC classification number: H04Q1/035 ,  H04Q1/023 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12

Abstract: A subassembly includes a plurality of card guides formed to receive card assemblies and also to conduct air for cooling purposes to improve cooling of components on the card guide. The card guides are particularly formed to place the cards in a location to facilitate airflow and to more evenly distribute the airflow. The invention further includes a method for designing the card guides to achieve the stated functionality. The method of designing the card guides includes determining a first and a second volume of space that is desired in relation to the amount of expected heat that is to be generated within the first and second volumes of space.

Abstract translation: 子组件包括多个卡引导件，其形成为接收卡组件，并且还用于传导空气用于冷却目的，以改善卡引导件上部件的冷却。 卡引导件特别地形成为将卡放置在一个位置以便于气流和更均匀地分布气流。 本发明还包括一种用于设计卡引导件以实现所述功能的方法。 设计卡引导件的方法包括确定相对于将在第一和第二体积的空间内产生的期望的热量所需的第一和第二空间体积。

公开(公告)号：US06603660B1

公开(公告)日：2003-08-05

申请号：US10217041

申请日：2002-08-12

Applicant: Michael W. Ehn ,  Todd Theisen

Inventor： Michael W. Ehn ,  Todd Theisen

IPC: H05K720

CPC classification number: H04Q1/14 ,  H04Q1/021 ,  H04Q1/026 ,  H04Q1/035 ,  H04Q2201/06 ,  H04Q2201/10

Abstract: A frame enclosure for use with electrical communication devices includes joined front and rear cabinets. Patch connectors are mounted in the front cabinet on a divider wall separating the front cabinet into separately accessible first and second compartments, each accessible through a separate, lockable door. External conductors pass through one side of the front cabinet and are terminated on one side of the electrical connectors in a patch field mounted on the divider wall. Conductors from electrical devices in the rear cabinet are engagable with the opposite end of the connectors in the other front compartment after passing through aligned apertures in the cabinet. Industry standard rack mounts are provided in the front and rear cabinets for mounting the electrical connectors and the electrical components in a vertically extending orientation to minimize overall cabinet depth. The rear cabinet has pivotal doors on opposite ends allowing access to the front and rear ends of each electrical device. An optional heat removal device is mounted on the rear cabinet for removing heat generated by the electrical devices.

Abstract translation: 与电气通信设备一起使用的框架外壳包括连接的前后机柜。 拼接连接器安装在分隔墙上的前机柜中，将前机柜分为独立可访问的第一和第二隔间，每个隔间可通过一个独立的可锁门进入。 外部导体穿过前机柜的一侧，并在安装在分隔壁上的贴片区域中端接在电连接器的一侧。 后柜中的电气设备的导体可以在通过机柜中对齐的孔之后与另一前隔室中的连接器的相对端接合。 在前后机柜中提供行业标准机架安装座，用于将电气连接器和电气部件安装在垂直延伸的方向，以最大限度地减少整体机柜深度。 后机柜在相对端部具有枢转门，允许进入每个电气设备的前端和后端。 可选的散热装置安装在后机柜上，用于除去电气装置产生的热量。

公开(公告)号：US06590782B2

公开(公告)日：2003-07-08

申请号：US09825163

申请日：2001-04-03

Applicant: Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Todd Husom ,  Eric Sit

Inventor： Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Todd Husom ,  Eric Sit

IPC: H05K700

CPC classification number: H05K7/1425 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/155 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K7/186 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.