Abstract:
Das Leuchtmodul (2) weist mindestens einen flexiblen, insbesondere bandförmigen, Träger (4) für mehrere Wärmequellen, einschliesslich Lichtquellen (6), auf, wobei der Träger dazu vorgesehen ist, über zumindest einen Teil seiner Breite gebogen zu werden. Die Leuchtvorrichtung weist eine gebogene Unterlage (9) und mindestens ein Leuchtmodul auf, wobei das Leuchtmodul zumindest bereichsweise mit seinem in seiner Breite gebogenen Teil flächig an der Unterlage befestigt ist
Abstract:
Provided is a nanoimprint method for transferring a pattern formed on the surface of a mold, to a transfer layer formed on the partial or whole surface of a substrate of a generally cylindrical or columnar shape. Also provided is a nanoimprint apparatus comprising a first jig for contacting with the substrate, a second jig for supporting the first jig rotatably, a pushing portion connected to the second jig for pushing the substrate onto the mold through the first jig and the second jig, and a movable holding portion for holding the mold and for moving the mold in a direction generally perpendicular to the pushing force. The apparatus transfers a pattern formed on the surface of the mold, to a transfer layer formed on the partial or whole side face of the generally cylindrical or columnar substrate.
Abstract:
Selon l'invention, on recouvre uniformément la surface non développable (6) d'une couche de matière électriquement conductrice (9), que l'on recouvre à son tour, par projection, d'un patron (10) en une matière de protection polymérisable, ledit patron étant polymérisé au fur et à mesure de sa formation, après quoi on élimine sélectivement, à travers les ouvertures (10.8) dudit patron (10), les portions de ladite couche de matière électriquement conductrice (9) qui ne recouvrent pas lesdits motifs électriquement conducteurs.
Abstract:
Procédé pour la réalisation de motifs électriquement conducteurs sur une surface non développable d'un substrat isolant, et dispositif obtenu. Selon l'invention, on recouvre uniformément la surface non développable (6) d'une couche d'une matière électriquement conductrice (9), que l'on recouvre à son tour d'une couche d'une matière de protection (10), après quoi, à l'aide d'une tête laser mobile, on élimine par ablation laser les portions de ladite couche de matière de protection (10) qui ne recouvrent pas lesdits motifs électriquement conducteurs, puis on élimine les portions de ladite couche de matière électriquement conductrice (9) découvertes par l'élimination desdites portions de ladite couche de matière de protection (10).
Abstract:
The invention relates to a method for producing an electrically conductive structure on a non-planar surface (1) comprising the following steps: a) electrochemical deposition of a photo resist layer (2) on the surface (1) b) exposure of sections of the photo resist layer (2) c) removal of one section of the photo resist layer (2) by a developing process d) deposition of an electrically conductive material (3) on the sections of the surface (1) that are devoid of the photo resist layer (2). The invention also relates to a method for producing miniaturised coils. The electrochemical deposition of the photo resist on the non-planar surface enables an extremely uniform thickness to be achieved for the layer.
Abstract:
An apparatus and method for forming a conical or domed ring light having a plurality of light sources arranged at a desired angle with respect to an optical axis. Some of the dimensions of the illumination apparatus are first determined and, then using the appropriate formulas, the remaining dimensions of the circuit board are calculated. Thereafter, the calculated dimensions are employed to cut, from a planar flexible circuit board, the desired arcuate section(s). The light sources are then installed at desired locations on a first surface of the flexible circuit board and are each coupled to a common electrical connector, having one or a plurality of power sources, to facilitate supplying electrical power to each one of the light sources. The circuit board is then folded into a conical or domed configuration, with the light sources facing inward, and each abutted end and lateral surfaces of the folded circuit board is suitably secured or fastened to one another to permanently retain the flexible circuit board in its folded state.
Abstract:
The invention relates to a method of manufacturing a device provided with a body (1) with a surface (2), at least a portion (3, 4) of the surface (2) being provided with a radiation-sensitive layer (6), after which portions (7, 8) of the radiation-sensitive layer (6) are exposed to radiation (10) through a mask (12) and brought into a pattern. Such a method is particularly suitable for the manufacture of devices in which bodies (1) are used as, for example, printed circuit boards, connections foils for, for example, ICs, or adapter plates between ICs and printed circuit boards. A method of the kind mentioned above is known whereby conductor patterns are provided on an upper and a lower side (22, 24, respectively) of a printed circuit board of a complicated three-dimensional (3-D) shape. For this purpose, a photosensitive layer (6) is provided on a conductive layer through electrodeposition and is illuminated through an upper and a lower mask, developed, and patterned. This known method as described has the disadvantage that several masks are used. The method is complicated and expensive as a result. According to the invention, the method is characterized in that a portion of the radiation-sensitive layer (6) is irradiated directly through the mask (12), while another portion is radiated indirectly via the mask (12) and a surface (13) which reflects the radiation (10). It is achieved thereby that several portions (7, 8) of the radiation-sensitive layer (6) can be illuminated by means of one mask. The use of one mask (12) and a reflecting surface (13) is simpler and cheaper.
Abstract:
A method of making and using a printed circuit board tool (9) to produce circuit boards (10) with bonded or laminated pads (62A) in grooves (41-43). The circuit board tool (9) includes a metallized male mold substrate (50 or 60) having a plurality of groove-forming projections in the substrate surface. Making the metallized mold (50 or 60) includes forming a female predecessor master tool (9) to produce the metallized male molds (50 or 60). The circuit board (10) includes a substrate (11) made of a high heat deflective plastic, and a plurality of grooves (41-43) molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken bonds or lands (62A) are adhered or bonded within the grooves (41-43) for establishing an electrical path within each groove.