Abstract:
A method for inspecting a solar cell and configured to inspect a peeling state of a three-dimensional pattern of the solar cell includes obliquely illuminating the three-dimensional pattern of the solar cell using a light beam. An image of the solar cell is normally captured. An intensity of the light beam is increased to increase a contrast between the three-dimensional pattern and a shadow of the three-dimensional pattern in the image and increase a contrast between an ink pattern of the solar cell and the shadow in the image to overexpose the ink pattern in the image. Determine if the three-dimensional pattern is peeling according to the shadow of the three-dimensional pattern in the image.
Abstract:
A method is provided for testing a semi-finished battery cell. The semi-finished battery cell is charged with a constant current when a voltage difference between the first conductor and the second conductor is less than a voltage threshold. The semi-finished battery cell is charged with a constant voltage when the voltage difference between the first conductor and the second conductor is equal to or larger than the voltage threshold. An overall electric quantity is obtained after a default time period, wherein the overall electric quantity is an electric quantity charged to the semi-finished battery cell with the constant current during the default time period. Accordingly, an insulation related to electrodes of the semi-finished battery cell is determined as poor when the overall electric quantity is larger than an electric quantity threshold.
Abstract:
A support apparatus is configured to support electronic components. The support apparatus includes a tray and a plurality of recessed structures. The tray has a cavity therein and at least one intake hole communicated with the cavity. The recessed structures are disposed on the tray and recessed toward the cavity. Each of the recessed structures is configured to accommodate at least a part of a corresponding one of the electronic components and includes a support surface and a plurality of first spacers. The support surface has an exhaust hole communicated with the cavity. The first spacers are disposed on the support surface of a corresponding one of the recessed structures. When a corresponding one of the electronic components is supported on the first spacers, any adjacent two of the first spacers and the corresponding electronic component form a first flow channel.
Abstract:
A measurement fixture for a battery cell is provided when the battery cell is connected to an apparatus. The measurement fixture comprises a chamber, a pressure sensor and an expansion sensor. The chamber defines a sealed space for receiving the battery cell. The pressure sensor is mounted to the chamber to sense a change of pressure in the sealed space due to a volume change of the battery cell to calculate pressure in the battery cell and the volume change of the battery cell non-contactly. The expansion sensor is mounted to the chamber to sense a deformation of the battery cell to calculate a correlation between the pressure in the battery cell and the volume change of the battery cell non-contactly.
Abstract:
An automatic test system and method are provided. The automatic test system includes at least one formation apparatus and a test fixture. The formation apparatus receives a first control command from a network and executes a test procedure according to the first control command. The test procedure includes a charging mode and a discharging mode. The test fixture is selectively coupled to the formation apparatus. During the test procedure, when the test fixture is coupled to the formation apparatus, the test fixture generates a first measurement result. The test fixture transmits the first measurement result to the formation apparatus via a wireless communication interface of the test fixture.
Abstract:
An apparatus for testing a package-on-package semiconductor device includes a top cover, a lower base, a heat dissipation module, and a plurality of probes. The lower base is disposed under the top cover so as to form an internal accommodation space for receiving an upper chip. The heat dissipation module includes a heat sink arranged in the internal accommodation space and attached to an upper surface of the upper chip. The probes are arranged in the lower base so as to electrically connect the upper chip with a lower chip. By the heat sink arranged in the internal accommodation space formed of the top cover and the lower base, heat generated from the upper chip during operation of the upper chip can be greatly dissipated so that the performance and the service life of the upper chip can be improved.
Abstract:
A probe includes a first electrical conductor, a second electrical conductor and a voltage measurer. The first electrical conductor has a first through hole, and the first through hole extends through two ends of the first electrical conductor. The second electrical conductor is detachably disposed on the first electrical conductor, and the second electrical conductor has a working surface and a second through hole. The working surface is located at an end of the second electrical conductor away from the first electrical conductor. Two ends of the second through hole that are opposite to each other are located at the working surface and an end of the first through hole, respectively. The first through hole is communicated with the second through hole. The voltage measurer is penetrating through the first through hole and the second through hole.
Abstract:
A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.
Abstract:
The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.
Abstract:
An apparatus for testing a package-on-package semiconductor device includes a top cover, a lower base, a heat dissipation module, and a plurality of probes. The lower base is disposed under the top cover so as to form an internal accommodation space for receiving an upper chip. The heat dissipation module includes a heat sink arranged in the internal accommodation space and attached to an upper surface of the upper chip. The probes are arranged in the lower base so as to electrically connect the upper chip with a lower chip. By the heat sink arranged in the internal accommodation space formed of the top cover and the lower base, heat generated from the upper chip during operation of the upper chip can be greatly dissipated so that the performance and the service life of the upper chip can be improved.