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1.发明申请公开(公告)号：US20180113151A1
公开(公告)日：2018-04-26
申请号：US15790185
申请日：2017-10-23
Applicant: Chroma Ate Inc.
Inventor： Xin-Yi WU , Chien-Hung LO , Jui-Chih CHOU , Hao-Che YANG , Nan-Yi KUO
CPC classification number: G01R1/0458 , G01R31/2831 , G01R31/2877 , G01R31/2881
Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.
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公开(公告)号：US20150007973A1
公开(公告)日：2015-01-08
申请号：US14302442
申请日：2014-06-12
Applicant: Chroma Ate Inc.
Inventor： Ben-Mou YU , Ming-Chieh LIN , Ching-Wen CHANG , Xin-Yi WU
CPC classification number: F25B49/00 , F25B21/02 , G05D23/1919
Abstract: A wide range of temperature control equipment for controlling a tested object to a predetermined temperature is provided. The wide range of temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.
Abstract translation: 提供了用于将测试对象控制到预定温度的各种温度控制设备。 各种温度控制设备包括导热板，温度调节模块，承载板和热电冷却模块。 温度调节模块热连接到用于将导热板调节到参考温度的导热板。 承载板用于容纳被测物体。 热电冷却模块热连接在导热板和承载板之间，用于基于参考温度经由载板将测试对象控制到预定温度。
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公开(公告)号：US20140176170A1
公开(公告)日：2014-06-26
申请号：US14108167
申请日：2013-12-16
Applicant: CHROMA ATE INC.
Inventor： Xin-Yi WU , Hsuan-Jen SHEN , Hung-Ta KAO
IPC: G01R31/26
CPC classification number: G01R31/2635
Abstract: A test table including a chuck base, a flow guide mechanism and a dry air generator is provided. The chuck base includes a test area. The flow guide mechanism is disposed around the chuck base. The dry air generator connects to the flow guide mechanism for generating a dry air. The flow guide mechanism guides the dry air to flow toward the test area to cover the test area and the object to be tested and to create a dry environment to prevent dew condensation.
Abstract translation: 提供一种包括卡盘底座，导流机构和干燥空气发生器的测试台。 卡盘底座包括测试区域。 流动引导机构围绕卡盘基座设置。 干燥空气发生器连接到流动引导机构以产生干燥空气。 流动引导机构引导干燥空气流向测试区域，以覆盖测试区域和被测物体，并产生干燥的环境以防止结露。
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4.发明公开公开(公告)号：US20240151746A1
公开(公告)日：2024-05-09
申请号：US18307866
申请日：2023-04-27
Applicant: CHROMA ATE INC.
Inventor： I-Shih TSENG , I-Ching TSAI , Xin-Yi WU , Chin-Yi OUYANG
CPC classification number: G01R1/44 , G01R1/0458 , G01R1/06722 , H01R13/2421 , H05K7/202 , H05K7/20272 , H01R2201/20
Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.
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5.发明公开公开(公告)号：US20240142492A1
公开(公告)日：2024-05-02
申请号：US18050500
申请日：2022-10-28
Applicant: CHROMA ATE INC.
Inventor： I-Shih TSENG , Xin-Yi WU , I-Ching TSAI , Chin-Yi OUYANG
CPC classification number: G01R1/0466 , G01R31/2877
Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.
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Patent Agency Ranking
公开(公告)号：US20230349968A1
公开(公告)日：2023-11-02
申请号：US18299173
申请日：2023-04-12
Applicant: CHROMA ATE INC.
Inventor： Chin-Yi OUYANG , Xin-Yi WU , Chien-Ming CHEN , Meng-Kung LU , Chia-Hung CHIEN
IPC: G01R31/28
CPC classification number: G01R31/2896 , G01R31/2887 , G01R31/2893
Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.
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公开(公告)号：US20150323257A1
公开(公告)日：2015-11-12
申请号：US14681093
申请日：2015-04-08
Applicant: CHROMA ATE INC.
Inventor： Hsiu-Wei KUO , Xin-Yi WU , Ben-Mou YU , Ming-Chang WU , Mao-Sheng LIU , Kuei-Wen LIEN
CPC classification number: F27B1/08 , F27B17/0083 , F27D7/04 , F27D2007/045
Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.
Abstract translation: 本公开公开了一种加热炉，其包括壳体，第一齿条，腔室和至少一个风扇。 第一个机架设置在外壳中。 腔室设置在壳体中并且位于第一齿条的一侧。 腔室包括入口，第一侧壁和第二侧壁。 第一侧壁与第一机架相邻。 第一侧壁具有多个通风孔。 第一侧壁和第二侧壁被设置为彼此面对。 宽度在第一侧壁和第二侧壁之间间隔开，并且宽度大于或等于200mm。 风扇设置在壳体中以产生到入口的气流。
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8.发明公开公开(公告)号：US20230400478A1
公开(公告)日：2023-12-14
申请号：US18327148
申请日：2023-06-01
Applicant: CHROMA ATE INC.
Inventor： I-Shih TSENG , Chin-Yi OUYANG , I-Ching TSAI , Xin-Yi WU , Yan-Lin WU
IPC: G01R1/04
CPC classification number: G01R1/0458
Abstract: A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.
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公开(公告)号：US20200033399A1
公开(公告)日：2020-01-30
申请号：US16509671
申请日：2019-07-12
Applicant: Chroma Ate Inc.
Inventor： Xin-Yi WU
IPC: G01R31/28
Abstract: The present invention relates to an apparatus and a method for a high temperature test and a low temperature test. The apparatus mainly comprises a depressing head and a test base, wherein the depressing head comprises a cooling module, a heating module, and a heat dissipation module therein, the heat dissipation module comprises a finned heat sink and a heat conduction member, and the heat conduction member is thermally coupled to the heating module and the finned heat sink. When the low temperature test is performed, an electronic component is cooled by filling liquid nitrogen into the cooling module of the depressing head. When the high temperature test is performed, the electronic component is heated by the heating module. If the temperature of the electronic device is higher than a predetermined high temperature, the electronic device is cooled by the heat dissipation module.
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10.发明申请公开(公告)号：US20170227599A1
公开(公告)日：2017-08-10
申请号：US15420154
申请日：2017-01-31
Applicant: CHROMA ATE INC.
Inventor： Xin-Yi WU , Chien-Hung LO
CPC classification number: G01R31/2875 , F25B21/04 , F25B2321/021 , F25B2321/0212 , F25B2321/0252 , F28D15/00 , G01R31/2877 , G05D23/19 , G05D23/1919
Abstract: A dual loop type temperature control module and an electronic device testing apparatus having the same are provided. The temperature control module comprises a first loop through which a first working fluid of a first temperature flows, a second loop through which a second working fluid of a second temperature flows, a controller for controlling a first switching valve such that the first or second working fluid flows through a temperature regulating device, and a second switching valve such that the working fluid flowing through the temperature regulating device returns to the first or second loop. The temperature regulating device adjusts a thermoelectric cooling device to reach two different reference temperatures based on the rise/fall of its temperature dependent on the working fluid. The thermoelectric cooling device regulates the temperature of the tested object under a wide range of temperature difference and with accuracy based on the reference temperatures to facilitate the detection of high/low temperature.
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