PUSH/PULL ACTUATOR FOR MICROSTRUCTURES
    125.
    发明申请
    PUSH/PULL ACTUATOR FOR MICROSTRUCTURES 审中-公开
    用于微结构的推/拉执行器

    公开(公告)号:WO2004059678A1

    公开(公告)日:2004-07-15

    申请号:PCT/US2002/041482

    申请日:2002-12-26

    Applicant: KIONIX, INC.

    CPC classification number: H01L21/76208 H01H59/0009

    Abstract: A relay (10) for switching an electrical signal includes switching elements(14, 18), an actuator (12) for closing the switch (18), and an actuator for opening the switch (12), the latter two of which are mechanically decoupled when the relay (10) is in a mechanical rest position. When a relay close signal is applied, the closing actuator (18) electrostatically drives the switching elements (14, 18) to complete a signal path between two terminals for the switched signal (22,24). In the process of closing the switch, the opening actuator (12) remains stationary, i.e., no mass is displaced. Application of a switch open signal electrostatically drives the opening actuator, optionally in combination with a mechanical restoring force on the closing actuator (18) to open the switch (18) to break the signal conduction path for the switched signal.

    Abstract translation: 用于切换电信号的继电器(10)包括开关元件(14,18),用于闭合开关(18)的致动器(12)和用于打开开关(12)的致动器,后者两个机械地 当继电器(10)处于机械停止位置时,它被解耦。 当施加继电器闭合信号时,关闭致动器(18)静电驱动开关元件(14,18),以完成用于开关信号(22,24)的两个端子之间的信号路径。 在关闭开关的过程中,打开致动器(12)保持静止,即没有质量位移。 开关开启信号的应用静电地驱动开启致动器,可选地与闭合致动器(18)上的机械恢复力组合以打开开关(18),以断开开关信号的信号传导路径。

    ACCELEROMETER APPARATUSES AND SYSTEMS
    126.
    发明申请

    公开(公告)号:WO2022169964A8

    公开(公告)日:2022-08-11

    申请号:PCT/US2022/015100

    申请日:2022-02-03

    Applicant: KIONIX, INC.

    Abstract: A sensor having a proximal end and a distal end includes an anchor, a proof mass, a fixed finger, and a movable finger. The anchor is disposed at the proximal end. The proof mass is coupled to the anchor and disposed at a first distance from the anchor. The fixed finger and the movable finger are coupled to the anchor and disposed at a second distance from the anchor at the distal end. The fixed and movable fingers are configured to measure a first capacitance area. A ratio of the first distance over the second distance is between about 0.2 to about 0.6. The ratio is configured to deflect the movable finger at least about 1 μm relative to the fixed finger.

    EUTECTIC BONDING WITH ALGE
    127.
    发明申请

    公开(公告)号:WO2018187490A1

    公开(公告)日:2018-10-11

    申请号:PCT/US2018/026111

    申请日:2018-04-04

    Applicant: KIONIX, INC.

    Abstract: A MEMS device formed in a first semiconductor substrate is sealed using a second semiconductor substrate. To achieve this, an Aluminum Germanium structure is formed above the first substrate, and a polysilicon layer is formed above the second substrate. The first substrate is covered with the second substrate so as to cause the polysilicon layer to contact the Aluminum Germanium structure. Thereafter, eutectic bonding is performed between the first and second substrates so as to cause the Aluminum Germanium structure to melt and form an AlGeSi sealant thereby to seal the MEMS device. Optionally, the Germanium Aluminum structure includes, in part, a layer of Germanium overlaying a layer of Aluminum.

    METHOD FOR MANUFACTURING A MICRO ELECTRO-MECHANICAL SYSTEM

    公开(公告)号:WO2018187486A1

    公开(公告)日:2018-10-11

    申请号:PCT/US2018/026107

    申请日:2018-04-04

    Applicant: KIONIX, INC.

    Abstract: A method of fabricating a semiconductor device, includes, in part, growing a first layer of oxide on a surface of a first semiconductor substrate, forming a layer of insulating material on the oxide layer, patterning and etching the insulating material and the first oxide layer to form a multitude of oxide-insulator structures and further to expose the surface of the semiconductor substrate, growing a second layer of oxide in the exposed surface of the semiconductor substrate, and removing the second layer of oxide thereby to form a cavity in which a MEMS deice is formed. The process of growing oxide in the exposed surface of the cavity and removing this oxide may be repeated until the cavity depth reaches a predefined value. Optionally, a multitude of bump stops is formed in the cavity.

    PHASE-BASED MEASUREMENT AND CONTROL OF A GYROSCOPE
    129.
    发明申请
    PHASE-BASED MEASUREMENT AND CONTROL OF A GYROSCOPE 审中-公开
    基于相位的测量和陀螺仪的控制

    公开(公告)号:WO2016182993A3

    公开(公告)日:2017-01-26

    申请号:PCT/US2016031443

    申请日:2016-05-09

    Applicant: KIONIX INC

    Inventor: DEWALL JONAH

    CPC classification number: G01C19/5684 G01C19/5712 G01C19/5776

    Abstract: A gyroscope includes a resonator, a transducer, and a comparator. The comparator is designed to receive an input signal from the transducer and compare the input signal with a reference signal to produce an output signal. Rising and falling edge transitions of the output signal are substantially synchronized with a motion of the resonator along a sense-axis of the transducer.

    Abstract translation: 陀螺仪包括谐振器,换能器和比较器。 比较器被设计为从换能器接收输入信号并将输入信号与参考信号进行比较以产生输出信号。 输出信号的上升沿和下降沿跃迁基本上与谐振器沿换能器的感测轴的运动同步。

    ELECTRONIC SYSTEMS WITH THROUGH-SUBSTRATE INTERCONNECTS AND MEMS DEVICE
    130.
    发明申请
    ELECTRONIC SYSTEMS WITH THROUGH-SUBSTRATE INTERCONNECTS AND MEMS DEVICE 审中-公开
    具有通过基板互连和MEMS器件的电子系统

    公开(公告)号:WO2017004063A1

    公开(公告)日:2017-01-05

    申请号:PCT/US2016/039859

    申请日:2016-06-28

    Applicant: KIONIX, INC.

    Abstract: Disclosed are systems, methods, and computer program products for electronic systems with through-substrate interconnects and mems device. An interconnect formed in a substrate having a first surface and a second surface, the interconnect includes: a bulk region; a via extending from the first surface to the second surface; an insulating structure extending through the first surface into the substrate and defining a closed loop around the via, wherein the insulating structure comprises a seam portion separated by at least one solid portion; and an insulating region extending from the insulating structure toward the second surface, the insulating region separating the via from the bulk region, wherein the insulating structure and insulating region collectively provide electrical isolation between the via and the bulk region.

    Abstract translation: 公开了用于具有贯穿衬底互连和mems器件的电子系统的系统,方法和计算机程序产品。 形成在具有第一表面和第二表面的基底中的互连,所述互连包括:体区域; 从第一表面延伸到第二表面的通孔; 绝缘结构,其延伸穿过所述第一表面进入所述基底并围绕所述通孔限定闭合环,其中所述绝缘结构包括由至少一个实心部分分开的接缝部分; 以及从所述绝缘结构朝向所述第二表面延伸的绝缘区域,所述绝缘区域将所述通孔与所述主体区域分离,其中所述绝缘结构和绝缘区域共同地提供所述通孔和所述主体区域之间的电隔离。

Patent Agency Ranking