Abstract:
The invention relates to a transconductor circuit with a differential input and a single output, comprising two input transistors (M1, M2) whose primary conduction terminals (D1, S1, D2, S2) are respectively connected together; in this way, variations in load current and voltage can be made lower, thereby also lowering distortion from changes in their transconductance.
Abstract:
A method for in-factory testing of a flash EEPROM device comprising a matrix of memory cells (1) and redundancy memory cells (1') for functionally substituting defective memory cells (1''), comprises the steps of: programming all the memory cells (1) of the memory device; submitting all the memory cells (1) of the memory device to a preliminary electrical erasure for a time much shorter than an average erasing time of the memory cells (1); reading the information stored in all the memory cells (1) of the memory device; memorizing the addresses of defective memory cells (1'') which have been read as erased memory cell; storing the addresses of the defective memory cells (1'') in redundancy registers (15,20) associated to redundancy memory cells (1') which must substitute the defective memory cells (1'').
Abstract:
A BiCMOS capacitive charge pump circuit for low supply voltage has a bipolar part, functionally reproducing a basic charge pump circuit and a CMOS part that comprises MOS transistors (M1, M2) functionally connected in parallel with the driving switch toward ground potential (T3) of the charge transfer capacitance (C1) and in parallel with the output diode (T7) for substantially nullifying voltage drops on the respective bipolar components (T3, T7). A special driving circuit (T8, R2, I2), powered at the boosted output voltage (V OUT ) responds to the rise of the voltage on the output node above a minimum level, as ensured by the bipolar part of the charge pump circuit, to drive said MOS transistors (M1, M2), thus allowing the output voltage to reach a level that is substantially double the supply voltage (Vs), also when the latter is exceptionally low for reliably ensuring switching of the CMOS part of the circuit.
Abstract:
A fully digital, current mode, PWM control is realized by employing two distinct comparators (COMP1,COMP2), both reading the voltage drop on a sensing resistance (Rsense). The first comparator (COMP1) exerts an open-loop current mode control. The second comparator (COMP2), establishing a second higher current threshold than the current threshold set by the first comparator (COMP1), triggers a disabling circuit of the output power transistor for a preset period of time, when the current level through the output stage uncontrollably rises beyond the second threshold. This may occur because of an insufficient discharge from the load circuit inductance (L) during off-phases of the output power transistor of the extra energy stored during switching delay periods of the first (open loop control) comparator (COMP1). The frequency of the sequence of bursts may be precisely controlled to be well outside the frequency range of interest to prevent disturbances.
Abstract:
RF plasma-induced potentials on relatively thin gate dielectric layers capable of conducting by a Fowler-Nordheim mechanism may be accurately determined by employing as potential sensing structure an EEPROM cell having its control gate capacitively coupled to the substrate through a gate dielectric layer which reproduces the condition of an intervening discharge through a Fowler-Nordheim current. The connection is interrupted by a polyfuse before measuring the threshold voltage of the sensing EEPROM cell. The measured peak potential values induced by the plasma depend on the thickness of the gate dielectric layer, as they will be on production wafers. The normalization of the "antenna" area of the sensing structures will permit to precisely evaluate the electrical stress induced by the plasma on sensitive integrated structures.
Abstract:
To reduce the supply voltage (V CC ) of a nonvolatile memory (48), a read reference signal (H) is generated having a reference threshold value ranging between the maximum permissible threshold value for erased cells and the minimum permissible threshold value for written cells. To avoid reducing the maximum supply voltage, the characteristic (H) of the read reference signal is composed of two portions: a first portion (H1), ranging between the threshold value and a predetermined value (V s ), presents a slope lower than that of the characteristic (A, G) of the memory cells (50); and a second portion (H2), as of the predetermined value of the supply voltage, presents the same slope as the memory cells. The shifted-threshold, two-slope characteristic is achieved by means of virgin cells (11-13) so biased as to see bias voltages lower than the supply voltage.
Abstract:
A circuit device (1) for measuring the threshold voltage distribution among electrically programmable, non-volatile memory cells, which device comprises a differential amplifier (3) having a first input connected to a first circuit leg including at least one memory cell (2) and a second input connected to a second or reference circuit leg (4), and circuit means effective to cause an unbalance in the values of the currents flowing in the reference leg. The device is connected between a first supply voltage (Vdd) reference and a second voltage reference (GND), and said circuit means comprise a generator of a varying current as a function of the supply voltage (Vdd) which is associated with the reference leg (4).