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公开(公告)号：US20190007486A1
公开(公告)日：2019-01-03
申请号：US15638146
申请日：2017-06-29
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Nathan Brooks , Swaminathan Sankaran , Bradley Allen Kramer , Mark W. Morgan , Baher Haroun
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a tapered near field communication (NFC) field confiner located between the substrate and the port region on the housing configured to guide electromagnetic energy produced by the RF transmitter to the port region so that it can be emanated to a port region of an adjacent module.
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公开(公告)号：US20190007103A1
公开(公告)日：2019-01-03
申请号：US15638163
申请日：2017-06-29
Applicant: Texas Instruments Incorporated
Inventor： Nathan Brooks , Benjamin Stassen Cook , Swaminathan Sankaran , Bradley Allen Kramer , Mark W. Morgan , Baher S. Haroun
CPC classification number: H04B5/0062 , H01Q5/321 , H01Q5/40 , H04B5/0012 , H04B5/0037 , H04B5/02
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. An artificial magnetic conductor surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic energy with a phase shift of approximately zero degrees.
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公开(公告)号：US20190007101A1
公开(公告)日：2019-01-03
申请号：US15638212
申请日：2017-06-29
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Nathan Brooks , Swaminathan Sankaran , Bradley Allen Kramer , Mark W. Morgan , Baher Haroun
CPC classification number: H04B5/0031 , G06K7/10237 , H01Q1/3283 , H01Q1/38 , H04B5/0075 , H04W4/80
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. A reflective surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic towards the port region.
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公开(公告)号：US20180278229A1
公开(公告)日：2018-09-27
申请号：US15466961
申请日：2017-03-23
Applicant: Texas Instruments Incorporated
Inventor： Swaminathan Sankaran , Bradley Allen Kramer , Baher Haroun
Abstract: Disclosed examples include digital isolator modules, isolation circuitry and low-loss multi-order bandpass filter circuits, including a capacitive coupled galvanic isolation circuit with first and second coupling capacitors individually including a first plate and a second plate, and a bond wire connecting the first plates of the coupling capacitors, a first circuit with a first inductor coupled to form a first resonant tank circuit with a first parasitic capacitor associated with the second plate of the first coupling capacitor, and a second circuit with a second inductor coupled to form a second resonant tank circuit with a second parasitic capacitor associated with the second plate of the second coupling capacitor.
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公开(公告)号：US10027376B2
公开(公告)日：2018-07-17
申请号：US15410818
申请日：2017-01-20
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Swaminathan Sankaran , Bradley Allen Kramer , Benjamin Stassen Cook , Juan Alejandro Herbsommer , Lutz Naumann , Mark W. Morgan , Baher Haroun
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module.
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Patent Agency Ranking
公开(公告)号：US09985018B2
公开(公告)日：2018-05-29
申请号：US14864504
申请日：2015-09-24
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Russell Carlton McMullan , Binu Kamblath Pushkarakshan , Subramanian J. Narayan , Swaminathan Sankaran , Keith Edmund Kunz
IPC: H01L49/02 , H01L27/06 , H01L27/08 , H01L29/66 , H01L29/872
CPC classification number: H01L27/0676 , H01L27/0629 , H01L27/0802 , H01L28/24 , H01L29/66143 , H01L29/8725
Abstract: A high TCR tungsten resistor on a reverse biased Schottky diode. A high TCR tungsten resistor on an unsilicided polysilicon platform geometry. A high TCR tungsten resistor between two parallel polysilicon leads on remaining contact etch stop dielectric. A high TCR tungsten resistor embedded in a intermetal dielectric layer above a lower interconnect layer and below an upper interconnect layer. A method of forming a high TCR tungsten resistor on a reverse biased Schottky diode. A method of forming high TCR tungsten resistor on an unsilicided polysilicon platform geometry. A method of forming high TCR tungsten resistor between two parallel polysilicon leads on remaining contact etch stop dielectric. A method of forming high TCR tungsten resistor embedded in a inter metal dielectric layer above a lower interconnect layer and below an upper interconnect layer.
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127.发明申请公开(公告)号：US20170187094A1
公开(公告)日：2017-06-29
申请号：US14982932
申请日：2015-12-29
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Swaminathan Sankaran
CPC classification number: H01Q1/2283 , H01Q13/20 , H04B10/90
Abstract: In an example arrangement an apparatus includes a semiconductor substrate having a front side surface including circuitry and a backside surface opposing the front side surface; a plurality of metal conductors formed over a front side surface of the semiconductor substrate; at least one cavity opening etched in a backside surface of the semiconductor substrate; and a radiator formed in a portion of the metal conductors and configured to radiate signals through the cavity opening in the backside surface. Methods and additional apparatus arrangements are also disclosed.
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公开(公告)号：US09614556B2
公开(公告)日：2017-04-04
申请号：US14928872
申请日：2015-10-30
Applicant: Texas Instruments Incorporated
Inventor： Mark W. Morgan , Swaminathan Sankaran , Bradley Allen Kramer
CPC classification number: H04B1/0475 , H04B1/0483 , H04M11/066
Abstract: Data transfer devices and methods for transferring data between first and second circuits are disclosed. A data transfer device includes a first circuit having a plurality of data channels, wherein at least one of the data channels is an active data channel. A serializer has a plurality of inputs and an output, wherein the inputs are coupled to the plurality of data channels. The serializer is for coupling only one active channel at a time to the output. An isolation barrier is coupled to the output of the serializer, the isolation attenuates transients and passes the fundamental frequency. A second circuit includes a deserializer having an input and at least one output, the input is coupled to the isolation barrier, the at least one output is at least one active data channel.
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公开(公告)号：US09590699B1
公开(公告)日：2017-03-07
申请号：US14970315
申请日：2015-12-15
Inventor： Swaminathan Sankaran , Bradley Allen Kramer , Benjamin Stassen Cook , Juan Alejandro Herbsommer , Lutz Naumann , Mark W. Morgan , Baher Haroun
CPC classification number: H04B5/0031 , H04B5/0075 , H04W4/80
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module.
Abstract translation: 提供了一种系统，其中一组模块各自具有衬底，其上安装有射频（RF）发射器和/或耦合到位于衬底上的近场通信（NFC）耦合器）的RF接收器。 每个模块具有围绕并包围衬底的壳体。 壳体在壳体的表面上具有端口区域。 每个模块具有位于NFC耦合器和壳体上的端口区域之间的场约束器，其被配置成将通过端口区域从NFC耦合器发出的电磁能引导到相邻模块的端口区域。
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130.发明申请公开(公告)号：US20170012677A1
公开(公告)日：2017-01-12
申请号：US15270962
申请日：2016-09-20
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Rajaram Subramonian , Gianpaolo Lisi , Swaminathan Sankaran , Bradley Allen Kramer , Gerard Socci
IPC: H04B5/00
CPC classification number: H04B5/0087 , H04B5/0031 , H04B5/0037
Abstract: A first inductive structure includes a data coil to transfer data by inductive coupling with a second inductive structure. First and second portions of the data coil are connected to one another at a center tap to conduct respective first and second common mode currents, induced by a common mode transient between: a first ground line coupled to the center tap; and a galvanically isolated second ground line of the second inductive structure.
Abstract translation: 第一感应结构包括通过与第二感应结构的感应耦合传送数据的数据线圈。 数据线圈的第一和第二部分在中心抽头处彼此连接，以进行由共模瞬变引起的相应的第一和第二共模电流：耦合到中心抽头的第一接地线; 以及第二感应结构的电隔离的第二接地线。
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