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公开(公告)号：US20130228950A1
公开(公告)日：2013-09-05
申请号：US13859323
申请日：2013-04-09
Inventor： Joseph M. DeSimone , Jason P. Rolland , Ginger M. Denison Rothrock , Paul Resnick
IPC: B29C59/00
CPC classification number: B29C59/005 , B01L3/502707 , B01L2300/0887 , B01L2300/12 , B29C33/3878 , B29C33/405 , B29C65/48 , B29C65/4835 , B29C65/4845 , B29C65/485 , B29C65/521 , B29C66/54 , B29C66/543 , B29C66/71 , B29C66/723 , B29C66/727 , B29C66/91431 , B29C66/919 , B29C66/949 , B29C66/9534 , B29K2883/00 , B29L2031/7172 , B29L2031/756 , B81B2201/051 , B81C99/0085 , C08G18/10 , C08G18/5015 , C08G18/8175 , C08G59/30 , C08G65/007 , C08L71/02 , C08L75/16 , Y10T137/0318 , Y10T137/2224 , C08G18/50 , B29C65/00 , B29K2027/18 , B29K2027/12
Abstract: Materials and methods are provided for fabricating microfluidic devices. The materials include low surface energy fluoropolymer compositions having multiple cure functional groups. The materials can include multiple photocurable and/or thermal-curable functional groups such that laminate devices can be fabricated. The materials also substantially do not swell in the presence of hydrocarbon solvents.
Abstract translation: 提供了用于制造微流体装置的材料和方法。 这些材料包括具有多个固化官能团的低表面能含氟聚合物组合物。 这些材料可以包括多个可光固化和/或热固化的官能团，使得可以制造层压装置。 所述材料在烃溶剂存在下也基本上不溶胀。
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公开(公告)号：US20130156657A1
公开(公告)日：2013-06-20
申请号：US13693349
申请日：2012-12-04
Applicant: CANON KABUSHIKI KAISHA
Inventor： Tomohiro Saito
CPC classification number: B01L3/502707 , B01L3/502715 , B01L7/52 , B01L2300/0645 , B01L2300/0887 , B01L2300/12 , B01L2300/1805 , B01L2300/1827 , B23P15/00 , B81B2201/051 , B81C1/00817 , G01N27/44791 , H01L21/28 , H01L41/313 , Y10T29/494
Abstract: It is an object of this invention to prevent a resistor material and an electrode material from diffusing and suppress variation in electric resistance. In a device including a plurality of metal layers of different compositions on a substrate and a second structure made of a material, such as glass paste, requiring a firing process at the time of formation, an intermediate layer is formed between a first metal layer and a second metal layer forming the first structure. The intermediate layer is of an intermetallic compound including one or more metallic elements in the first metal layer and one or more metallic elements in the second metal layer. The melting point of the intermetallic compound is higher than a firing temperature when the second structure is formed, and the intermetallic compound is produced at a temperature higher than the firing temperature for forming the second structure.
Abstract translation: 本发明的目的是防止电阻材料和电极材料扩散并抑制电阻的变化。 在包括在基板上具有不同组成的多个金属层的装置和由形成材料的诸如玻璃浆料的第二结构之间需要在形成时进行烧制的装置中，在第一金属层和 形成第一结构的第二金属层。 中间层是包含第一金属层中的一种或多种金属元素和第二金属层中的一种或多种金属元素的金属间化合物。 当形成第二结构时，金属间化合物的熔点高于烧制温度，并且在高于用于形成第二结构的烧成温度的温度下制备金属间化合物。
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公开(公告)号：US08404193B2
公开(公告)日：2013-03-26
申请号：US13057466
申请日：2009-07-13
Applicant: Kanji Sekihara , Takehiko Goshima
Inventor： Kanji Sekihara , Takehiko Goshima
CPC classification number: B81C99/009 , B01J2219/00891 , B01L3/502707 , B01L3/502715 , B01L2200/027 , B01L2200/141 , B01L2300/0816 , B29C45/2628 , B29C45/40 , B29C65/02 , B29C66/54 , B29L2031/756 , B81B2201/051 , B81B2203/0338 , B81B2203/0384 , B81C2201/034
Abstract: A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.
Abstract translation: 一种微芯片，包括：具有形成在其一侧上的多个细通道的树脂基底，一个或多个从另一侧突出设置的圆柱形部分，以及沿着其轴线刺穿每个圆柱形部分的通孔， 与细通道连通，使得通孔的内壁的直径从圆筒部的前端朝向第一倾斜角的细通道逐渐减小; 以及与形成有微细通道的树脂基底的该侧接合的树脂覆盖部件。 微芯片已经被构造成使得液体样品可以通过通孔从每个圆柱形部分的末端引入。 通过在它们之间形成一个台阶，使得待引入液体样品的端侧的圆筒部分的壁厚比通过形成圆柱形部分的基底侧的壁厚小。
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公开(公告)号：US20120256354A1
公开(公告)日：2012-10-11
申请号：US13438431
申请日：2012-04-03
Applicant: Joseph M. DeSimone , Jason P. Rolland , Ginger M. Denison Rothrock , Paul Resnick
Inventor： Joseph M. DeSimone , Jason P. Rolland , Ginger M. Denison Rothrock , Paul Resnick
CPC classification number: B29C59/005 , B01L3/502707 , B01L2300/0887 , B01L2300/12 , B29C33/3878 , B29C33/405 , B29C65/48 , B29C65/4835 , B29C65/4845 , B29C65/485 , B29C65/521 , B29C66/54 , B29C66/543 , B29C66/71 , B29C66/723 , B29C66/727 , B29C66/91431 , B29C66/919 , B29C66/949 , B29C66/9534 , B29K2883/00 , B29L2031/756 , B81B2201/051 , B81C99/0085 , C08G18/10 , C08G18/5015 , C08G18/8175 , C08G59/30 , C08G65/007 , C08L71/02 , C08L75/16 , Y10T137/0318 , Y10T137/2224 , C08G18/50 , B29C65/00 , B29K2027/18 , B29K2027/12
Abstract: Materials and Methods are provided for fabricating microfluidic devices. The materials include low surface energy fluoropolymer compositions having multiple cure functional groups. The materials can include multiple photocurable and/or thermal-curable functional groups such that laminate devices can be fabricated. The materials also substantially do not swell in the presence of hydrocarbon solvents.
Abstract translation: 提供材料和方法用于制造微流体装置。 这些材料包括具有多个固化官能团的低表面能含氟聚合物组合物。 这些材料可以包括多个可光固化和/或热固化的官能团，使得可以制造层压装置。 所述材料在烃溶剂存在下也基本上不溶胀。
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公开(公告)号：US20110151198A1
公开(公告)日：2011-06-23
申请号：US13059359
申请日：2009-08-10
Applicant: Takashi Washizu , Hiroshi Hirayama
Inventor： Takashi Washizu , Hiroshi Hirayama
CPC classification number: B01J19/0093 , B01J2219/00783 , B01J2219/00833 , B01J2219/0086 , B01L3/502707 , B01L2300/044 , B01L2300/0816 , B01L2300/0887 , B29C65/02 , B29C65/08 , B29C65/16 , B29C65/8253 , B29C66/0344 , B29C66/1122 , B29C66/53461 , B29C66/71 , B29C66/9141 , B29C66/91411 , B29C66/91431 , B29C66/91645 , B29C66/919 , B29C66/91921 , B29C66/91941 , B29C66/92445 , B29C66/929 , B29C66/9292 , B29C66/92921 , B29C66/949 , B29K2025/00 , B29K2033/12 , B29K2067/00 , B29K2069/00 , B29K2077/00 , B29K2995/0018 , B29K2995/0035 , B29L2031/756 , B81B2201/051 , B81B2203/0338 , B81C1/00071 , B81C2201/019 , B81C2203/032 , Y10T156/1002 , Y10T428/24612 , B29K2067/003 , B29K2033/08 , B29K2025/08 , B29K2025/06 , B29K2025/04
Abstract: A micro-channel chip is produced while preventing a resinous film from sagging into the channel. The chip hence inhibits a liquid specimen from residing therein. With the chip, quantitativeness and reproducibility are heightened. A process for producing a micro-channel chip is provided which comprises bonding a resinous film 020 to that side of a resinous substrate 010 which has channel grooves 011 formed. The deflection temperature under load of the resinous substrate 010 Ts (.degree. C), and the deflection temperature under load of the resinous film 020, Tf (degree. C), satisfy Ts>Tf The process includes a pressing stage in which the resinous substrate 010 and the resinous film 020 are press-bonded at a bonding temperature, T (.degree. C), satisfying Tf−5 (.degree. C)
Abstract translation: 制造微通道芯片，同时防止树脂膜下垂到通道中。 因此，芯片抑制液体样品驻留在其中。 随着芯片的发展，量化和重现性得到提高。 提供了一种用于制造微通道芯片的方法，其包括将树脂膜020粘合到具有形成的沟槽槽011的树脂基板010的侧面上。 树脂基材010Tt（℃）的载荷下的挠曲温度和树脂膜020的载荷挠曲温度Tf（℃）满足Ts> Tf。该方法包括：压制阶段，其中 树脂基材010和树脂膜020在接合温度T（℃）下压合，满足Tf-5（.C.C）
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Patent Agency Ranking
公开(公告)号：US20110142716A1
公开(公告)日：2011-06-16
申请号：US13059370
申请日：2009-08-10
Applicant: Hiroshi Hirayama , Toshinori Takimura
Inventor： Hiroshi Hirayama , Toshinori Takimura
CPC classification number: B01L3/502707 , B01L2300/044 , B01L2300/0816 , B01L2300/0883 , B01L2300/0887 , B01L2300/12 , B29C65/02 , B29C65/06 , B29C65/0618 , B29C65/08 , B29C65/10 , B29C65/16 , B29C65/18 , B29C66/006 , B29C66/0344 , B29C66/1122 , B29C66/53461 , B29C66/71 , B29C66/73366 , B29C66/9141 , B29C66/91421 , B29C66/91431 , B29C66/91645 , B29C66/919 , B29C66/91941 , B29C66/929 , B29C66/949 , B29C2071/022 , B29K2023/06 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2031/04 , B29K2033/12 , B29K2033/20 , B29K2067/00 , B29K2069/00 , B29K2077/00 , B29K2083/00 , B29K2101/12 , B29K2995/0018 , B29K2995/0035 , B29L2031/756 , B81B2201/051 , B81B2203/0338 , B81C1/00071 , B81C1/00119 , B81C2201/019 , B81C2203/032 , G01N27/44791 , Y10T156/10 , B29K2067/003 , B29K2025/06 , B29K2023/38
Abstract: A microchip 1 in which a resinous film can be inhibited from sagging into a channel. The microchip 1 comprises: a resinous substrate 2 having a channel groove formed therein; and a resinous film bonded to a surface of the substrate on which the channel groove has been formed. A micro-channel 3 including channels 3A and channels 3B is formed by the channel groove and the resinous film 10. The total length of the channels 3B, which is parallel to the X direction for the resinous substrate 2, is larger than the total length of the channels 3A, which is parallel to the Y direction for the resinous substrate 2. The resinous substrate 2 has been bonded to the resinous film so that the sides parallel to the channels 3B are parallel to the TD direction of the resinous film and that the sides parallel to the channels 3A are parallel to the MD direction of the resinous film.
Abstract translation: 可以抑制树脂膜下垂到通道中的微芯片1。 微芯片1包括：在其中形成有沟槽的树脂基板2; 以及与已经形成有沟槽的基板的表面结合的树脂膜。 包括通道3A和通道3B的微通道3由通道槽和树脂膜10形成。与树脂基板2的X方向平行的通道3B的总长度大于总长度 与树脂基板2的Y方向平行的通道3A的树脂基板2已经结合到树脂膜上，使得平行于通道3B的边平行于树脂膜的TD方向，并且 平行于通道3A的边平行于树脂膜的MD方向。
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公开(公告)号：US20110132535A1
公开(公告)日：2011-06-09
申请号：US13026889
申请日：2011-02-14
Applicant: Kunihiko AKAI , Hiroshi KAWAZOE
Inventor： Kunihiko AKAI , Hiroshi KAWAZOE
CPC classification number: B81B3/0067 , B01L3/502707 , B01L2200/025 , B01L2200/12 , B01L2300/0838 , B01L2300/0874 , B81B2201/051 , B81B2203/0338 , Y10T428/24612 , Y10T428/24752 , Y10T428/249921
Abstract: The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof.
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公开(公告)号：US20110104025A1
公开(公告)日：2011-05-05
申请号：US12988213
申请日：2009-04-23
Applicant: Yves Fouillet
Inventor： Yves Fouillet
CPC classification number: B82Y30/00 , B01L3/502707 , B01L3/50273 , B01L2200/12 , B01L2300/0887 , B01L2400/0415 , B81B2201/051 , B81C1/00071 , B81C2201/0149
Abstract: A microfluidic device, including a microfluidic network, including: a) two parallel plates each including one or more electrodes, b) at least one channel, arranged between the two plates, made from a material obtained by solidification or hardening of a material of a first fluid, and c) a mechanism varying a physical parameter of the material constituting walls of the channel so as to cause the material to pass at least from the liquid state to the solid state.
Abstract translation: 包括微流体网络的微流体装置，包括：a）两个平行板，每个平行板包括一个或多个电极，b）布置在两个板之间的至少一个通道，由通过固化或硬化材料获得的材料制成 第一流体，以及c）改变通道的材料构成壁的物理参数以使材料至少从液态通过至固态的机构。
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公开(公告)号：US20110027873A1
公开(公告)日：2011-02-03
申请号：US12936861
申请日：2009-04-10
Applicant: Sin Kil Cho , Seok Chung
Inventor： Sin Kil Cho , Seok Chung
CPC classification number: B81C1/00103 , B01L3/502707 , B01L3/502723 , B01L3/50273 , B01L2200/16 , B01L2300/0636 , B01L2300/0663 , B01L2300/069 , B01L2300/0858 , B01L2300/0877 , B01L2300/0887 , B01L2300/16 , B01L2400/0406 , B81B3/0094 , B81B2201/0214 , B81B2201/051 , B81B2201/058 , B81B2203/0338 , B81B2203/0392 , B81C2201/019
Abstract: Disclosed is a micro-nano fluidic biochip for assaying a biological sample comprising a first substrate, a second substrate and a third substrate which are sequentially stacked from bottom to top, wherein an upper channel assembly disposed on the second substrate is coupled with the lower channel assembly provided on the first substrate, to form a microfluidic channel, and the microfluidic channel has nano interstices formed at both sides thereof, the nano interstices having a height less than that of the center of the channel.
Abstract translation: 公开了一种用于分析生物样品的微纳米流体生物芯片，包括从底部到顶部顺序堆叠的第一基底，第二基底和第三基底，其中设置在第二基底上的上部通道组件与下部通道 组装设置在第一基底上，以形成微流体通道，并且微流体通道在其两侧形成有纳米间隙，该纳米间隙的高度小于通道中心的高度。
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公开(公告)号：US07837821B2
公开(公告)日：2010-11-23
申请号：US12033958
申请日：2008-02-20
Applicant: Peng Zhou , Lincoln C. Young , Todd Roswech
Inventor： Peng Zhou , Lincoln C. Young , Todd Roswech
IPC: B32B38/04
CPC classification number: B29C66/54 , B01L3/502707 , B01L2200/12 , B01L2300/0816 , B01L2300/0861 , B01L2300/0867 , B01L2300/0887 , B01L2400/0481 , B01L2400/0655 , B01L2400/084 , B29C65/04 , B29C65/08 , B29C65/4895 , B29C65/72 , B29C66/1122 , B29C66/341 , B29C66/543 , B29C66/71 , B29L2031/756 , B81B2201/051 , B81C3/001 , B81C2201/019 , B81C2203/032 , F04B43/043 , F04B43/06 , F16K99/0001 , F16K99/0015 , F16K99/0021 , F16K99/0034 , F16K99/0055 , F16K99/0057 , F16K2099/0074 , F16K2099/0078 , F16K2099/0084 , F16K2099/0094 , B29K2069/00 , B29K2033/12 , B29K2033/08 , B29K2025/06
Abstract: A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time with RF or ultrasonic energy. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation. A laminated, polymeric microfluidic structure is also disclosed.
Abstract translation: 一种制备聚合微流体结构的方法，其中微流体结构的两个或多个组分（层）用弱溶剂粘合剂，特别是乙腈或乙腈和醇的混合物固定粘合或层压。 在一个方面，乙腈可以用作弱溶剂粘合剂以包围在非弹性聚合物如聚苯乙烯，聚碳酸酯，丙烯酸或其它线性聚合物中或其上制造的微结构，以形成三维微流体网络。 该方法包括以下步骤：在给定的较低温度范围内用弱溶剂粘合剂润湿聚合物基材组分的至少一个相对表面，相邻接触相对表面，并在比 在一定时间内，RF或超声能量的较低温度范围。 接触的聚合物基材还可以在热活化之前对准，并在热活化期间被压缩。 还公开了层压聚合物微流体结构。
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