ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION
    123.
    发明公开
    ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION 审中-公开
    带有用于散热的适合销的电气组件

    公开(公告)号:EP2831955A1

    公开(公告)日:2015-02-04

    申请号:EP13770149.6

    申请日:2013-02-07

    Abstract: An electrical assembly (11) comprises a substrate (49) having a dielectric layer (45) and one or more electrically conductive traces (46, 48) overlying the dielectric layer (45). An electrical component (44) is mounted on a first side (146) of the substrate (49). The electrical component (44) is capable of generating heat. A plurality of conductive through holes (47) in the substrate (49) are located around a perimeter of the electrical component (44). The conductive through holes (47) are connected to a conductive trace (46 or 48) for heat dissipation. A cooling cavity (26) has bores (28) that face a second side of the substrate opposite the first side. A plurality of respective compliant pins (32) are inserted into corresponding conductive through holes (47) and the bores (28), wherein a generally exposed portion of the compliant pin (32) is exposed to air or a coolant liquid within the cooling cavity (26).

    Abstract translation: 电组件(11)包括具有介电层(45)和覆盖介电层(45)的一个或多个导电迹线(46,48)的衬底(49)。 电部件(44)安装在基板(49)的第一侧(146)上。 电部件(44)能够产生热量。 基板(49)中的多个导电通孔(47)位于电气部件(44)的周边周围。 导电通孔(47)连接到用于散热的导电迹线(46或48)。 冷却腔(26)具有朝向与第一侧相对的基板的第二侧的孔(28)。 多个相应的顺应针(32)插入对应的导电通孔(47)和孔(28)中,其中顺应针(32)的大体暴露部分暴露于冷却腔内的空气或冷却剂液体 (26)。

    Ultrasonic probe
    125.
    发明公开
    Ultrasonic probe 有权
    超声波探头

    公开(公告)号:EP2660591A1

    公开(公告)日:2013-11-06

    申请号:EP13166063.1

    申请日:2013-04-30

    Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

    Abstract translation: 提供了一种超声波探头,其中释放了与cMUT结合的集成电路中产生的热量。 超声波探头包括被配置为产生超声波辐射的换能器,安装在换能器的后表面上的集成电路,安装在集成电路的后表面上并具有开口的印刷电路板,经由该开口, 所述集成电路的后表面至少部分地暴露;散热器,其具有插入所述印刷电路板的所述开口中的突起并且被配置为吸收在所述集成电路中产生的热量;以及散热模块,其被配置为释放 散热器向外部吸收的热量。

    LED-Leuchte mit Kühlkanal
    128.
    发明公开
    LED-Leuchte mit Kühlkanal 有权
    LED-Leuchte mitKühlkanal

    公开(公告)号:EP2226550A1

    公开(公告)日:2010-09-08

    申请号:EP10155454.1

    申请日:2010-03-04

    Abstract: Anordnung (1) zur Lichtabgabe mit mehreren auf einer Platine (2) angeordneten Leuchtmitteln in Form von LEDs (3) und einem Kanal (4) zur Durchführung eines Kühlmediums, wobei zumindest ein Teil der Kanalwand unmittelbar durch die Platine (2) gebildet ist, sowie ein System zur Beleuchtung mit mindestens zwei Anordnungen (1) zur Lichtabgabe und mindestens einem Verbindungselement (6), welches hohl ausgebildet ist und einen Kanal zur Durchführung eines Kühlmediums aufweist, wobei die Anordnungen (1) durch das Verbindungselement (6) in Längsrichtung miteinander verbunden sind und die Kanäle (4) der Anordnungen miteinander in Verbindung stehen.

    Abstract translation: 光输送装置(1)具有布置在板(2)上的发光二极管(3)形式的多个灯。 提供一个用于执行冷却介质的通道(4)。 通道壁的一部分由板直接形成。 还包括以下独立权利要求:(1)用于连接两种安排的连接元件; 和(2)具有两种安排的雷电系统。

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