Abstract:
A heat dissipation structure having high joining strength during a cooling/heating cycle and a high cooling efficiency, a power module, a method of manufacturing the heat dissipation structure, and a method of manufacturing the power module is provided. A power module 1 of the present invention includes: a ceramic substrate 10 having an insulation quality; a metal member 50 containing a metal or an alloy and joined by a brazing material on a surface of the ceramic substrate 10; and a heat dissipation member 40 formed by accelerating a powder containing a metal or an alloy with a gas, and by spraying and depositing the powder in a solid phase state on a surface of the metal member 50, wherein a heat pipe 60 is embedded in the heat dissipation member 40.
Abstract:
Provided is a pipe buried structure with improved adhesiveness between a pipe forming a flow path and a metal member, and a method of manufacturing the same. A pipe buried structure 1 is provided with a pipe 10 made of metal or alloy, an outer periphery on a cross section of which has a flattened shape obtained by curving both ends in a longitudinal direction, a base material 11 made of metal or alloy on which a concave portion 11a is formed, the portion including an inner wall which an outer peripheral portion 10c in the longitudinal direction abuts and to which the pipe 10 is fitted, and a deposition layer 12 formed by accelerating powder made of metal or alloy together with gas and spraying the same in a solid phase state on surfaces of the pipe 10 and the base material 11, thereby depositing the powder in a state in which the pipe 10 is fitted to the concave portion 11a, wherein a ratio h/R between a protruding amount h by which the pipe 10 protrudes from the surface of the base material 11 and a curvature R at ends 10a and 10b is not smaller than 0.25 and not larger than 0.5.
Abstract:
To provide a pipe embedded structure that improves adhesive properties between a pipe that forms a passage and a metal member, and a method of manufacturing the pipe embedded structure. A pipe embedded structure 1 includes a pipe 10, a base material 11, and a deposited layer 12. The pipe 10 is made of a metal or an alloy, and has a periphery that forms a circular shape in a transverse section. The base material 11 is made of a metal or an alloy, in which a recessed portion 11a is formed. The recessed portion 11a allows the pipe 10 to be fitted therein, and has an inner wall on which a part of the periphery abuts, and a ratio h/R of a protruding amount h by which the pipe 10 protrudes from the upper surface 11b and a curvature R of the periphery is not smaller than 0.3 and not greater than 0.7. The deposited layer 12 is formed such that powder formed of a metal or an alloy is accelerated together with a gas in a state where the pipe 10 is fitted into the recessed portion 11a, and the powder is sprayed and deposited on surfaces of the pipe 10 and the base material 11 while remaining in a solid phase state.
Abstract:
Provided is a method for manufacturing a lamination, in manufacturing a lamination in which a metal film is formed on a substrate using the cold spray method, having high adhesion strength between the substrate and the metal film. A lamination 10 according to the present invention includes a substrate 1 formed of a metal or alloy, an intermediate layer 2 formed on a surface of the substrate and is formed of a metal or alloy that is softer than the substrate 1, and a metal film 3 deposited by accelerating a powder material of a metal or alloy together with a gas heated to a temperature lower than the melting point of the powder material and spraying it onto the intermediate layer 2 while keeping it in a solid phase.
Abstract:
It is possible to obtain a laminate having high adhesion strength between ceramic and a metal coating by providing the following: an insulating ceramic substrate (10); an intermediate layer (50) formed on the surface of the ceramic substrate (10) and having a metal-containing principal component metal layer (51) and an active ingredient layer (52) including metal, a metal oxide, or a metal hydride; and a metal coating (40) formed on the surface of the intermediate layer (50) by accelerating a metal-containing powder with gas, and depositing the same on the surface thereof by spraying while in a solid state.
Abstract:
A lamination having a high interface strength, in which a copper film is laminated on an aluminum substrate, or a lamination in which an aluminum film is laminated on a copper substrate, are manufactured by a cold spray method. A lamination 10 of the present invention includes: a substrate 1 formed of aluminum or aluminum alloy; an intermediate layer 2 formed of any one metal or nonmetal selected from the group consisting of silver, gold, chromium, iron, germanium, manganese, nickel, silicon, and zinc, or an alloy containing the any one metal, on a surface of the substrate 1; and a film layer 3 formed by accelerating powder material of copper or copper alloy together with gas heated to a temperature lower than a melting point of the powder material and spraying and depositing a solid-phase powder material onto a surface of the intermediate layer 2.