公开(公告)号：US09991409B2

公开(公告)日：2018-06-05

申请号：US14968359

申请日：2015-12-14

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/0232 ,  H01L31/18 ,  H03K17/94 ,  H03K17/96 ,  H01L31/167 ,  G01S17/02 ,  G01S7/481 ,  H01L25/16 ,  G01V8/12

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L21/568 ,  H01L25/167 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167 ,  H01L31/18 ,  H01L31/186 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2924/3511 ,  H03K17/941 ,  H03K17/9631 ,  H03K17/9638 ,  H03K2217/96023 ,  Y10T156/1052 ,  Y10T156/1064

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

公开(公告)号：US09911890B2

公开(公告)日：2018-03-06

申请号：US15199390

申请日：2016-06-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Cheng-Lay Ang

IPC: H01L31/0232 ,  H01L21/00 ,  H01L31/173 ,  H01S5/183 ,  H01S5/022 ,  H01L31/12 ,  H01L31/042 ,  H01L31/047 ,  H01L31/0475 ,  H01G9/20 ,  H01L31/046

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/08 ,  H01G9/20 ,  H01L31/0203 ,  H01L31/02366 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0475 ,  H01L31/125 ,  H01S5/02252 ,  H01S5/183

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US09851328B2

公开(公告)日：2017-12-26

申请号：US14462432

申请日：2014-08-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Jerome Teysseyre ,  Yonggang Jin ,  Suman Cherian

IPC: G01N27/28 ,  G01N27/403 ,  G01N27/413 ,  G01N27/406 ,  G01N27/407 ,  H05K1/18

CPC classification number: G01N27/4065 ,  G01N27/4062 ,  G01N27/4071 ,  G01N27/4077 ,  H05K1/185 ,  H05K2201/09118 ,  H05K2201/10151

Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

公开(公告)号：US09818937B2

公开(公告)日：2017-11-14

申请号：US14982600

申请日：2015-12-29

Applicant: STMicroelectronics Pte Ltd

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: H01L21/00 ,  H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/06 ,  H01L43/10

CPC classification number: H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/065 ,  H01L43/10 ,  Y10T29/4913

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measurable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

公开(公告)号：US09793427B1

公开(公告)日：2017-10-17

申请号：US15218966

申请日：2016-07-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： David Gani

IPC: H01L27/15 ,  H01L31/024 ,  H01L31/173 ,  G01V8/10

CPC classification number: H01L31/024 ,  G01V8/10 ,  G01V8/12 ,  H01L31/173 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical sensor that includes a substrate and a sensor die. A through-hole extends through the substrate, and a trench is formed in a first surface of the substrate and is in fluid communication with the through-hole. The sensor die is attached to the first surface of the substrate and covers the first through-hole and a first portion of the trench. A second portion of the trench is left uncovered by the sensor die.

公开(公告)号：US09780080B2

公开(公告)日：2017-10-03

申请号：US14510433

申请日：2014-10-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin

IPC: H01L25/00 ,  H01L25/16 ,  G06F1/32 ,  H03K17/94 ,  G06F3/01

CPC classification number: H01L25/50 ,  G06F1/3231 ,  G06F3/017 ,  H01L25/165 ,  H01L25/167 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2217/94108 ,  H04M2250/12 ,  H01L2924/00

Abstract: A method for making an optical proximity sensor includes forming a package top plate having an optical transmit opening and an optical receive opening extending therethrough, attaching an optical transmit element to the package top plate adjacent the optical transmit opening, and attaching an optical receive element to the package top plate adjacent the optical receive opening. A package body is formed onto the package top plate to define an optical transmit cavity receiving the optical transmit element and an optical receive cavity receiving the optical receive element.

公开(公告)号：US09723186B2

公开(公告)日：2017-08-01

申请号：US14183937

申请日：2014-02-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

IPC: H04N5/225 ,  H04N17/00 ,  H04N5/217 ,  H04N5/357

CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.

公开(公告)号：US09679870B2

公开(公告)日：2017-06-13

申请号：US14565484

申请日：2014-12-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi Ma ,  Kim-Yong Goh ,  Xueren Zhang ,  Wei Zhen Goh

IPC: H01L23/00 ,  H01L23/482 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/85 ,  H01L23/3107 ,  H01L23/4822 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48177 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.

公开(公告)号：US09645238B1

公开(公告)日：2017-05-09

申请号：US14981196

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: G01J1/42 ,  G01S17/02 ,  G01J1/04

CPC classification number: G01S17/026 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/0271 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/42 ,  G01S7/4813 ,  H01L31/167 ,  H01L2224/73265

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

公开(公告)号：US09530681B2

公开(公告)日：2016-12-27

申请号：US14986130

申请日：2015-12-31

Applicant: STMicroelectronics Pte Ltd

Inventor： Calvin Leung ,  Olivier Le Neel

IPC: H01L21/683 ,  H01L21/768 ,  H01L27/06 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L27/105 ,  H01L49/02 ,  H01L29/66

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/76895 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/20 ,  H01L27/0629 ,  H01L27/1052 ,  H01L28/60 ,  H01L29/6675 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.