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公开(公告)号：WO2019219953A1
公开(公告)日：2019-11-21
申请号：PCT/EP2019/062889
申请日：2019-05-17
Applicant: HEXCEL COMPOSITES LIMITED , HEXCEL HOLDING GMBH
Inventor： VERGE, Nicholas , GANGLBERGER, Thorsten
Abstract: A curative resin containing at least 50 wt % of an epoxy phenolic resin comprising a mixture of a carboxylic hydrazide and a hydroxy substituted urone.
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公开(公告)号：WO2019122272A1
公开(公告)日：2019-06-27
申请号：PCT/EP2018/086445
申请日：2018-12-20
Applicant: HEXCEL COMPOSITES LIMITED
Inventor： TILBROOK, David , MASON, Christopher , SIMMONS, Martin
Abstract: This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.
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公开(公告)号：WO2019011984A1
公开(公告)日：2019-01-17
申请号：PCT/EP2018/068787
申请日：2018-07-11
Applicant: HEXCEL COMPOSITES LIMITED
Inventor： MORTIMER, Steve , SIMMONS, Martin
IPC: C08L63/00
Abstract: A curable polymeric resin composition comprising i. a resin system comprising at least one resin component, ii. a curative system, and iii. a particle system comprising a multistage polymeric particle comprising a polymer composition (PC1) comprising a) one stage (A) comprising a polymer (A1) having a glass transition temperature of less than 10°C b), one stage (B) comprising a polymer (B1) having a glass transition temperature of at least 60°C and c) and a polymer (C1) having a glass transition temperature of at least 30°C wherein at least the component a) and the component b) of composition (PC1) are part of a multistage polymer (MP1), and characterized in that the polymer (C1) has a mass average molecular weight Mw of at least 100 000g/mol and that the component c) represents at most 40wt% of the composition based on the total weight of.
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公开(公告)号：WO2019011774A1
公开(公告)日：2019-01-17
申请号：PCT/EP2018/068230
申请日：2018-07-05
Applicant: HEXCEL COMPOSITES LIMITED
Inventor： SIMMONS, Martin , MORTIMER, Steve , PATEL, Neal
Abstract: There is provided a curative system for epoxy resins comprising an alkyl benzene diamine and an additional aromatic amine. There is also provided the use of an alkyl benzene diamine to enhance the performance of an aromatic amine as a curative for an epoxy resin in an infusion processes for the production of fibre reinforced composites; a curable epoxy resin composition containing a mixture of an epoxy resin and a curative system according to the invention; the use of a composition according to the invention as the curable resin in the production of fibre reinforced composites and/or in the production of fibre reinforced composites by infusion processes; a fibre reinforced composite comprising fibrous reinforcement material and a cured epoxy resin obtainable by curing a curable epoxy resin composition according to the invention, and a process for the production of fibre reinforced composites wherein a fibrous reinforcement material is laid up and a curable epoxy resin composition according to the invention is infused through the fibrous reinforcement material at a temperature of 80 to 130°C and, once the composition has infused the fibrous reinforcement material, the temperature is raised to 150 to 190°C.
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公开(公告)号：WO2016055421A1
公开(公告)日：2016-04-14
申请号：PCT/EP2015/072959
申请日：2015-10-05
Applicant: HEXCEL COMPOSITES LIMITED
Inventor： ARCIDIACONO, Marco
CPC classification number: B32B3/02 , B29C70/386 , B29C70/882 , B32B3/04 , B32B3/06 , B32B5/16 , B32B27/20 , B32B2260/021 , B32B2260/046 , B32B2262/10 , B32B2264/105 , B32B2307/202 , B32B2605/18 , B64D45/02
Abstract: A surfacing material for use in an automatic tape laying device, comprising a layer of reinforcement material and a conducting surface layer in contact with the reinforcement material, wherein the surface layer extends beyond the surface of the reinforcement material. The surfacing material provides improved surface conductivity perpendicular to the tape direction.
Abstract translation: 一种用于自动铺带装置的表面材料，包括增强材料层和与增强材料接触的导电表面层，其中表面层延伸超出增强材料的表面。 表面材料提供垂直于带方向的改进的表面导电性。
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Patent Agency Ranking
公开(公告)号：WO2016046138A1
公开(公告)日：2016-03-31
申请号：PCT/EP2015/071622
申请日：2015-09-21
Applicant: HEXCEL COMPOSITES LIMITED
Inventor： HARRINGTON, Chris
CPC classification number: C08G59/4021 , C08G59/40 , C08J5/042 , C08J5/10 , C08J5/24 , C08J2363/00 , C08K5/09 , C08K5/103 , C08L63/00
Abstract: This invention relates to an epoxy resin formulation containing a curative that can be cured at 150°C to 95% cure in no more than 150 seconds, and can be cured at 120°C to 95% cure in no more than 4 minutes. This results in a cured resin having a Tg no greater than 140°C wherein the formulation further contains a mould release agent.
Abstract translation: 本发明涉及含有固化剂的环氧树脂配方，该固化剂可在不超过150秒内在150℃至95％固化下固化，并且可在不超过4分钟内在120℃至95％固化下固化。 这导致Tg不高于140℃的固化树脂，其中制剂还含有脱模剂。
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公开(公告)号：WO2015097283A1
公开(公告)日：2015-07-02
申请号：PCT/EP2014/079302
申请日：2014-12-24
Applicant: HEXCEL COMPOSITES LIMITED
Inventor： HADLEY, Philip , TIPLER, Ben , BLAIR, Dana
CPC classification number: C08J5/24 , C08J3/126 , C08J5/10 , C08J2363/00 , C08J2377/00 , C08J2400/24 , C08J2463/00 , C08J2477/00
Abstract: This invention relates to an additive for a thermoset resin matrix having a core and a reactive cross- linked thermoset coating. The reactive cross-linked thermoset coating is the reaction product of a thermoset resin and a curative in a dispersant.
Abstract translation: 本发明涉及一种具有芯和反应性交联热固性涂层的热固性树脂基质的添加剂。 反应性交联热固性涂层是热固性树脂和分散剂中的固化剂的反应产物。
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公开(公告)号：WO2014096435A3
公开(公告)日：2014-06-26
申请号：PCT/EP2013/077863
申请日：2013-12-20
Applicant: HEXCEL COMPOSITES LIMITED
Inventor： HARRINGTON, Chris
Abstract: A fast cure epoxy resin system is provided that upon curing has a Tg no greater than 140°C and a Phase angle below 20° at a temperature of 140°C or below, and prepregs and mouldings based on the system. The resin formulation matches the reactivity of the resin to the amount of curative and hardener employed.
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公开(公告)号：WO2014079565A2
公开(公告)日：2014-05-30
申请号：PCT/EP2013/003503
申请日：2013-11-20
Applicant: HEXCEL COMPOSITES LIMITED , HEXCEL HOLDING GMBH
Inventor： MOSER, Johannes , HADLEY, Philip , TIPLER, Ben , HARRINGTON, Chris , VERGE, Nicholas
CPC classification number: C08J5/18 , B29C35/0288 , B29C70/44 , B29C70/84 , B29D99/0025 , B29K2063/00 , B29L2007/002 , B29L2031/085 , C08G59/50 , C08J5/04 , C08J5/24 , C08J2363/00 , F03D1/0675 , Y02E10/721 , Y02P70/523
Abstract: A cured or partly cured fiber reinforced sheet material comprising reinforcement fibres and a reinforcement resin material, wherein the reinforcement resin material comprises an epoxy resin having an epoxy equivalent weight in the range of from 50 to 250, preferably from 100 to 200, and an amine hardener, the sheet material comprising a surface structure for spacing the sheet material from adjacent moulding materials.
Abstract translation: 一种固化或部分固化的纤维增强片材，其包含增强纤维和增强树脂材料，其中所述增强树脂材料包含环氧当量为50-250，优选为100-200的环氧树脂，以及胺 硬化剂，片材包括用于将片材与相邻成型材料隔开的表面结构。
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公开(公告)号：WO2013171292A1
公开(公告)日：2013-11-21
申请号：PCT/EP2013/060111
申请日：2013-05-15
Applicant: HEXCEL COMPOSITES LIMITED , HEXCEL HOLDING GMBH
Inventor： GANGLBERGER, Thorsten , WENIDOPPLER, Birgit , ENGLISCH, Herwig , WHITHER, Mark
CPC classification number: C08G59/4021 , C08G18/0823 , C08G18/4219 , C08G18/8048 , C08J5/24 , C08K3/36 , C08K5/0025 , C08K2201/005 , C08L9/02 , C08L63/00 , C08L87/005 , C09D175/06 , Y10T428/25
Abstract: Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle.
Abstract translation: 快速固化树脂体系包括半固体环氧树脂和粒径小于25微米的细碎固化剂。 树脂是干燥的接触，可以容易地与纤维增强剂组合以提供预浸料，其可以在短的成型周期中快速固化。
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