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131.发明专利
公开(公告)号：DE19946194A1
公开(公告)日：2000-12-14
申请号：DE19946194
申请日：1999-09-27
Applicant: INFINEON TECHNOLOGIES AG
Inventor： BEER GOTTFRIED , SHII JOHN
IPC: H01L23/495 , H01L21/60 , H01L21/56
Abstract: The lead frame is first held in position by a jig and then a soft soldering operation is performed to form the connections. The jig is then removed and the integrated circuit coated with a casing compound or voids filled with a filling compound
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