公开(公告)号：EP3732784A1

公开(公告)日：2020-11-04

申请号：EP17935989.8

申请日：2017-12-28

Applicant: INTEL Corporation

Inventor： SWAN, Johanna M. ,  EID, Feras ,  KAMGAING, Telesphor ,  NAIR, Vijay K. ,  DOGIAMIS, Georgios C. ,  LEUSCHNER, Stephan

IPC: H03H9/145 ,  H03H9/02

公开(公告)号：EP3437191A1

公开(公告)日：2019-02-06

申请号：EP17776049.3

申请日：2017-01-24

Applicant: Intel Corporation

Inventor： ELSHERBINI, Adel A. ,  EID, Feras ,  BICEN, Baris ,  KAMGAING, Telesphor ,  NAIR, Vijay K. ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M. ,  RAO, Valluri R.

IPC: H03H9/42 ,  G10K11/36 ,  H03H9/02

公开(公告)号：EP3394929A1

公开(公告)日：2018-10-31

申请号：EP15911474.3

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios, C. ,  NAIR, Vijay, K.

IPC: H01Q9/04 ,  H01Q1/38 ,  G06F1/16

CPC classification number: H04M1/0277 ,  G06F1/1613 ,  G06F1/1698 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/405 ,  H01Q3/26 ,  H01Q9/0414 ,  H01Q21/0093 ,  H01Q21/22 ,  H01Q21/28 ,  H01Q23/00 ,  H01Q25/00

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：EP2044626B1

公开(公告)日：2015-07-22

申请号：EP07799114.9

申请日：2007-06-27

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor

IPC: H01L23/538 ,  H01L21/768 ,  H01L23/48 ,  H01L23/58 ,  H01L21/8234 ,  H01L21/8238 ,  H01L21/764

CPC classification number: H01L21/823878 ,  H01L21/76224 ,  H01L21/764 ,  H01L21/76898 ,  H01L21/823481 ,  H01L23/481 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2044626A1

公开(公告)日：2009-04-08

申请号：EP07799114.9

申请日：2007-06-27

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor

IPC: H01L23/538

CPC classification number: H01L21/823878 ,  H01L21/76224 ,  H01L21/764 ,  H01L21/76898 ,  H01L21/823481 ,  H01L23/481 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The techniques described herein reduce the substrate noise current that exists when digital and analog components reside on the same microelectronic die. Single or multiple rows of isolation vias form isolation barriers between the individual circuit blocks. The isolation vias may be hollow or (lined or filled) with a conductive or non-conductive material.