公开(公告)号：WO2017058104A1

公开(公告)日：2017-04-06

申请号：PCT/SG2016/000016

申请日：2016-09-16

Applicant: HERAEUS MATERIALS SINGAPORE PTE., LTD. ,  HERAEUS ORIENTAL HITEC CO., LTD

Inventor： TARK, Yong-Deok ,  KANG, Il Tae ,  KIM, Jong Su ,  JUNG, Hyun Seok ,  KIM, Tae Yeop ,  ZHANG, Xi ,  SARANGAPANI, Murali

IPC: B23K35/30 ,  B23K35/02 ,  C22C5/06 ,  H01L23/00 ,  C22F1/14

CPC classification number: B23K35/3006 ,  B23K35/0261 ,  B23K35/0266 ,  B23K35/0272 ,  C22C5/06 ,  C22F1/14 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2924/00011 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01201 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/01049 ,  H01L2924/013 ,  H01L2924/01029

Abstract: An alloyed silver wire comprising or consisting of a wire core, the wire core itself consisting of: (a) palladium in an amount in the range of from 3 to 6 wt.-%, (b) gold in an amount in the range of from 0.2 to 2 wt.-%, (c) nickel in an amount in the range of from 20 to 700 wt.-ppm, (d) platinum in an amount in the range of from 20 to 500 wt.-ppm, (e) silver in an amount in the range of from 91.88 to 96.786 wt.-%, and (f) 0 to 100 wt.-ppm of further components, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, wherein the alloyed silver wire has an average diameter in the range of from 8 to 80 μm.

Abstract translation: 一种合金银线，其包括或由线芯组成，所述线芯本身由以下组成：（a）量为3至6重量％的钯，（b）金的量在 0.2至2重量％，（c）20至700重量ppm范围内的镍，（d）20至500重量ppm范围内的铂，（ e）银的量为91.88至96.786重量％，和（f）0至100重量ppm的其它组分，其中所有量的重量百分比和重量ppm基于 芯的总重量，其中合金银线的平均直径在8至80μm的范围内。

公开(公告)号：WO2015091232A1

公开(公告)日：2015-06-25

申请号：PCT/EP2014/077482

申请日：2014-12-12

Applicant: ATOTECH DEUTSCHLAND GMBH

Inventor： ÖZKÖK, Mustafa ,  RAMOS, Gustavo

IPC: H05K3/24 ,  H01L23/00

CPC classification number: H05K3/244 ,  C23C18/1651 ,  C23C18/1837 ,  C23C18/44 ,  C23C18/54 ,  H01L23/498 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/85205 ,  H01L2224/85395 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K2203/049 ,  H05K2203/072 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/01015 ,  H01L2924/01005 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2224/43848 ,  H01L2924/01028 ,  H01L2924/01032 ,  H01L2924/00013 ,  H01L2924/01049

Abstract: The present invention relates to a method of bonding a silver based wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a silver wire bonded to aforementioned layer assembly.

Abstract translation: 本发明涉及一种将银基线焊接到具有包括铜结合部分和钯或钯合金层的层组件的基板，特别是印刷电路板和IC基板的方法，以及具有银 引线键合到上述层组件。

公开(公告)号：WO2014137288A1

公开(公告)日：2014-09-12

申请号：PCT/SG2014/000066

申请日：2014-02-19

Applicant: HERAEUS MATERIALS SINGAPORE PTE.LTD.

Inventor： CHEW, Yeong Huey ,  SARANGAPANI, Murali ,  MILKE, Eugen

IPC: H01L23/49 ,  C22C9/00 ,  H01L21/60

CPC classification number: C22C9/00 ,  C22C5/04 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/43985 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/01047 ,  H01L2924/01015 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01203 ,  H01L2924/01201 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20109 ,  H01L2924/00015 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/01204 ,  H01L2924/01202 ,  H01L2924/00 ,  H01L2924/2011 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01034

Abstract: The invention is related to a bonding wire, comprising a core (2) with a surface, wherein the core (2) comprises copper as a main component, and a coating layer (3) superimposed over the surface of the core (2), wherein the coating layer (3) comprises palladium as a main component, wherein the core (2) comprises at least 5 wt. ppm silver and at least 20 wt. ppm phosphorus as further components, wherein the wire meets the relation 0.000025

Abstract translation: 本发明涉及一种接合线，其包括具有表面的芯（2），其中所述芯（2）包括铜作为主要成分，以及叠层在所述芯（2）的表面上的涂层（3） 其中所述涂层（3）包含钯作为主要组分，其中所述芯（2）包含至少5重量％ ppm银和至少20wt。 ppm磷作为其他组分，其中线满足关系0.000025

公开(公告)号：WO2014137287A1

公开(公告)日：2014-09-12

申请号：PCT/SG2014/000065

申请日：2014-02-19

Applicant: HERAEUS MATERIALS SINGAPORE PTE. LTD.

Inventor： CHEW, Yeong, Huey ,  SARANGAPANI, Murali ,  MILKE, Eugen

IPC: H01L23/49 ,  C22C9/00 ,  H01L21/60

CPC classification number: C22C9/00 ,  B23K35/0261 ,  B23K35/0266 ,  B23K35/302 ,  B23K35/322 ,  B32B15/018 ,  C22C1/02 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/43985 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01203 ,  H01L2924/01201 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20109 ,  H01L2924/00015 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/01204 ,  H01L2924/01202 ,  H01L2924/00 ,  H01L2924/2011 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: The invention is related to a bonding wire, comprising a core (2) with a surface, wherein the core (2) comprises copper as a main component, and a coating layer (3) superimposed over the surface of the core (2), wherein the coating layer (3) comprises palladium as a main component, wherein the core (2) comprises silver and phosphorus as further components, wherein the core comprises silver and phosphorus as further components, wherein the ratio between the silver content and the phosphorus content of the core is in the range of 0.03 to 2.

Abstract translation: 本发明涉及一种接合线，包括具有表面的芯（2），其中芯（2）包括铜作为主要成分，以及叠层在芯（2）的表面上的涂层（3） 其中所述涂层（3）包括钯作为主要成分，其中所述芯（2）包含银和磷作为其它组分，其中所述芯包含银和磷作为其它组分，其中所述银含量与所述磷含量之比 的核心在0.03到2的范围内。

公开(公告)号：WO2012084736A1

公开(公告)日：2012-06-28

申请号：PCT/EP2011/073120

申请日：2011-12-16

Applicant: ATOTECH DEUTSCHLAND GMBH ,  ÖZKÖK, Mustafa ,  RAMOS, Gustavo ,  KILIAN, Arnd

Inventor： ÖZKÖK, Mustafa ,  RAMOS, Gustavo ,  KILIAN, Arnd

IPC: H05K3/24 ,  H01L23/498

CPC classification number: H05K13/04 ,  H01B1/02 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/03464 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05464 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/48864 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2224/85464 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/20105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/09 ,  H05K3/244 ,  H05K2203/049 ,  H05K2203/072 ,  H05K2203/095 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01005 ,  H01L2924/20752 ,  H01L2924/01007 ,  H01L2924/01001

Abstract: The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.

Abstract translation: 本发明涉及一种将铜线结合到具有包括铜结合部分和钯或钯合金层的层组件的基板，特别是印刷电路板和IC基板的方法，以及具有铜线的基板 粘合到上述层组件。

公开(公告)号：WO2011111137A1

公开(公告)日：2011-09-15

申请号：PCT/JP2010/006785

申请日：2010-11-19

Applicant: 株式会社日立製作所 ,  池田 靖 ,  東平 知丈

Inventor： 池田　靖 ,  東平　知丈

IPC: H01L21/60

CPC classification number: H01L24/46 ,  H01L23/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L25/072 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/37026 ,  H01L2224/37147 ,  H01L2224/37655 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49505 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/20751 ,  H01L2924/2076 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2224/29101 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/83205 ,  H01L2924/01201 ,  H01L2924/01006

Abstract: 　半導体装置の半導体素子上面の配線接続に、電気抵抗値は低いが線膨張係数が大きい金属（例えばCuあるいはCu合金）の導体を、編み線状にして導電性接合材により接続する。これによって、電気抵抗小・線膨張係数大の導体の線膨張による導電性接合材のひずみを抑え、低電気抵抗化と高い接続信頼性が両立できる。これによって、低電気抵抗で高い信頼性を有するワイヤボンディングを有するパワー半導体素子上面の配線接続技術を提供する。

Abstract translation: 公开了一种半导体器件，其中将具有低电阻值和高线性膨胀系数的金属导体（例如Cu或Cu合金）编织到编织线中，并且使用导电接合材料将导线连接到 在半导体器件的半导体元件的上表面上的布线连接部分。 因此，由于具有低电阻和高线性膨胀系数的导体的线性膨胀导致的导电接合材料的应变被抑制，并且可以实现低电阻和高连接可靠性。 因此，提供了通过具有低电阻和高可靠性引线接合来连接功率半导体元件的上表面上的布线的技术。

公开(公告)号：WO2009060662A1

公开(公告)日：2009-05-14

申请号：PCT/JP2008/066442

申请日：2008-09-11

Applicant: 田中電子工業株式会社 ,  村井 博 ,  千葉 淳 ,  天田 富士夫

Inventor： 村井 博 ,  千葉 淳 ,  天田 富士夫

IPC: C22C5/02 ,  H01L21/60

CPC classification number: C22C5/02 ,  B23K35/3013 ,  H01L24/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78306 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/01071 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/20752 ,  H01L2924/00013 ,  H01L2924/01006

Abstract: 　Mg５～１００質量ppm、In５～２０質量ppm、Al5～20 質量ppm、Yb５～２０質量ppm、残部純度９９．９９５質量％以上の金合金、又は更にCa５～２０質量ppm やLa５～２０質量ppm、Ｌｕ５～２０質量ppm、Sn５～１００質量ppm、Sr５～１００質量ppm の一種以上を添加し、或いは、さらにこれらの金合金において、Pd０．０１～１．２質量％含有させてなる、添加元素酸化物の付着に起因するセカンド接合不良を解消した金合金ボンディングワイヤ。

Abstract translation: 由合金制成的金合金线，其包含5-100质量ppm的镁，5〜20质量ppm的铟，5〜20质量ppm的铝，5〜20质量ppm的镱和纯度为99.995质量％以上的金 作为剩余部分。 该合金还可以含有选自5-20质量ppm钙，5-20质量ppm镧，5-20质量ppm镥，5-100质量ppm锡和5-100质量ppm锶的一种或多种。 这些金合金还可以含有0.01〜1.2质量％的钯。 接合线消除了由添加元素的氧化物的沉积引起的次级接合故障。

公开(公告)号：US20180108631A1

公开(公告)日：2018-04-19

申请号：US15722579

申请日：2017-10-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Toyohiro Aoki ,  Takashi Hisada ,  Eiji Nakamura

IPC: H01L23/00

CPC classification number: H01L24/11 ,  H01L23/3171 ,  H01L24/02 ,  H01L24/13 ,  H01L24/742 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/02166 ,  H01L2224/024 ,  H01L2224/0382 ,  H01L2224/03826 ,  H01L2224/03827 ,  H01L2224/0401 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/11312 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13018 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01201

Abstract: Wafers and methods of forming solder balls include etching a hole in a final redistribution layer over a terminal contact pad on a wafer to expose the terminal contact pad. Solder is injected into the hole using an injection nozzle that is in direct contact with the final redistribution layer. The final redistribution layer is etched back. The injected solder is reflowed to form a solder ball.

公开(公告)号：US20180108630A1

公开(公告)日：2018-04-19

申请号：US15625033

申请日：2017-06-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Toyohiro Aoki ,  Takashi Hisada ,  Eiji Nakamura

IPC: H01L23/00

CPC classification number: H01L24/11 ,  H01L23/3171 ,  H01L24/02 ,  H01L24/13 ,  H01L24/742 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/02166 ,  H01L2224/024 ,  H01L2224/0382 ,  H01L2224/03826 ,  H01L2224/03827 ,  H01L2224/0401 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/11312 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13018 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01201

Abstract: Wafers include multiple bulk redistribution layers. A terminal contact pad is on a surface of one of the bulk redistribution layers. A final redistribution layer is formed on the surface and in contact with the terminal contact pad. The final redistribution layer is formed from a material other than a material of the plurality of bulk redistribution layers. A solder ball is formed on the terminal contact pad.

公开(公告)号：US20170256517A1

公开(公告)日：2017-09-07

申请号：US15506511

申请日：2015-06-29

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： Ki Ho KIM ,  Yong-Deok TARK ,  Il Tae KANG ,  Byoung Gil KIM ,  Tae Yeop KIM

IPC: H01L23/00 ,  H01B1/02

CPC classification number: H01L24/43 ,  H01B1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01045 ,  H01L2924/0102 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/013 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2224/05599

Abstract: A bonding wire and a method of manufacturing the bonding wire are provided. The bonding wire contains 90.0 to 99.0 wt % of silver (Ag); 0.2 to 2.0 wt % of gold (Au); 0.2 to 4.0 wt % of palladium (Pd), platinum (Pt), rhodium (Rh), or a combination thereof; 10 to 1000 ppm of dopants; and inevitable impurities. In the wire, the ratio of (a)/(b) is 3 to 5, in which (a) represents the amount of crystal grains having orientation in crystalline orientations in a wire lengthwise direction and (b) represents the amount of crystal grains having orientation in crystalline orientations in the wire lengthwise direction.